Military Digital-to-Analog Converters 1,864

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

5962-8961701LA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

Bipolar

38535Q/M;38534H;883B

12

4 µs

23 mA

0.024 %

Parallel, Word

15 V

±12/±15 V

-15 V

In-Line

DIP24,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.3 in (7.62 mm)

Yes

e0

1.2 in (30.48 mm)

Binary

5962-8967101LA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

12

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

In-Line

DIP24,.3

Other Converters

450 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

Binary, Offset Binary

5962-89657023A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

MIL-STD-883

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

e4

0.45 in (11.43 mm)

Binary

JM38510/11302BEA

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

8

0 ns

7.8 mA

0.1 %

Parallel, 8 Bits

15 V

-15 V

In-Line

85 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

5962-8969701XA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

38535Q/M;38534H;883B

16

0.024 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

7 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

-10 V

1.49 in (37.85 mm)

Binary, Offset Binary

5962-89932012A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

18 V

Yes

1

Bipolar

MIL-STD-883

8

150 ns

7.8 mA

0.19 %

Parallel, 8 Bits

15 V

±15 V

-15 V

Chip Carrier

LCC20,.35SQ

Other Converters

85 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

Yes

e0

-10 V

0.35 in (8.89 mm)

Binary

JM38510/13301BEA

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

Bipolar

10

16 mA

Parallel, Word

15 V

-15 V

In-Line

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

JM38510/11301BEA

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

MIL-M-38510

8

0 ns

0.1 %

Parallel, 8 Bits

15 V

-15 V

In-Line

85 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

0.75 in (19.05 mm)

Offset Binary

JM38510/12103BJA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

Parallel, Word

15 V

-15 V

In-Line

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD5761RTRUZ-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0122 %

Serial

11 V

-11 V

Small Outline, Thin Profile, Shrink Pitch

9 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G16

0.047 in (1.2 mm)

0.173 in (4.4 mm)

-10 V

0.197 in (5 mm)

Binary, 2's Complement Binary

AD5791SRU-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

20

0.000143 %

Serial

15 V

-15 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

1 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G20

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

-10 V

0.256 in (6.5 mm)

Binary, 2's Complement Binary

AD5791SRUZ-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

20

0.0003 %

Serial

15 V

-15 V

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e4

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

Binary, 2's Complement Binary

DAC8830MCDEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1 MHz

1

16

1 µs

20 μA

0.0023 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G8

3

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

AD5544SRS-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

16

9 μA

0.0023 %

Serial

5 V

3/5 V

Small Outline, Shrink Pitch

SSOP28,.3

Other Converters

900 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G28

0.079 in (2 mm)

0.209 in (5.3 mm)

0.402 in (10.2 mm)

Binary

AD5761RTRUZ-EP-RL7

Analog Devices

Digital to Analog converter

Military

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0122 %

Serial

11 V

-11 V

Small Outline, Thin Profile, Shrink Pitch

9 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G16

0.047 in (1.2 mm)

0.173 in (4.4 mm)

-10 V

0.197 in (5 mm)

Binary, 2's Complement Binary

AD5781SRU-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

14 V

Yes

1

CMOS

18

5.2 mA

0.0004 %

Serial

15 V

-15 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

1 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G20

0.047 in (1.2 mm)

0.173 in (4.4 mm)

-14 V

0.256 in (6.5 mm)

Binary, 2's Complement Binary

5962-8850902XA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

Hybrid

38535Q/M;38534H;883B

12

8 µs

120 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

-10 V

Binary

AD558TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

8

25 mA

Parallel, 8 Bits

5 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary

AD5781SRUZ-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

18

0.0004 %

Serial

15 V

-15 V

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G20

0.047 in (1.2 mm)

0.173 in (4.4 mm)

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

Binary, 2's Complement Binary

DAC5672MPFBREP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

200 MHz

1

CMOS

14

90 mA

0.0305 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-.8 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

AD390TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

8 µs

100 mA

0.0122 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.4 in (35.56 mm)

Offset Binary

AD7541ATQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.012 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7541ASQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.024 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

DAC121S101WGMPR

Texas Instruments

Digital to Analog converter

Military

Gull Wing

10

SOP

Rectangular

Ceramic, Metal-Sealed Cofired

5.5 V

Yes

1.8 MHz

1

CMOS

12

15 µs

325 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline

SOP10,.4

Other Converters

12.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDSO-G10

1

0.092 in (2.33 mm)

0.241 in (6.12 mm)

No

e0

0 V

0.27 in (6.86 mm)

Binary

AD558TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2.56 V

No

1

Bipolar

8

3 µs

25 mA

0.1465 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.8 in (20.32 mm)

Complementary Offset Binary

5962-8770101RA

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

8

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

180 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

0.953 in (24.195 mm)

Binary, Offset Binary

DAC5672MPFBEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

200 MHz

1

CMOS

14

90 mA

0.0305 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-.8 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

AD5686RTCPZ-EP-RL7

Analog Devices

Digital to Analog converter

Military

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

16

0.0076 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8831MCDEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

2 MHz

1

16

1 µs

20 μA

0.0023 %

Serial

3 V

3/5 V

Small Outline

SOP14,.25

Other Converters

1 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G14

3

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

-5.5 V

0.341 in (8.65 mm)

Binary

5962-8770103RA

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

8

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

180 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

0.953 in (24.195 mm)

Binary, Offset Binary

AD7533SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

10

1 µs

2 mA

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

5962-8876602RA

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

CMOS

MIL-STD-883

12

10 µs

12 mA

0.0244 %

Parallel, 8 Bits

15 V

12/15,GND/-12/-15 V

-15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

No

e0

-5 V

Binary

5962-8770204RX

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

Parallel, Word

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

Binary

5962-89697013A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

CMOS

38535Q/M;38534H;883B

16

0.024 %

Parallel, Word

15 V

5,±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

7 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

e4

-10 V

0.45 in (11.43 mm)

Binary, Offset Binary

AD390TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

MIL-STD-883 Class B

12

8 µs

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e4

-10 V

1.4 in (35.56 mm)

Binary

AD565ASD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

38535Q/M;38534H;883B

12

250 ns

18 mA

0.018 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD7545AUQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.953 in (24.195 mm)

Binary, 2's Complement Binary

AD766SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

3.12 V

No

1

BICMOS

MIL-STD-883 Class B

16

Serial

5 V

-5 V

In-Line

1.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-2.88 V

0.75 in (19.05 mm)

2's Complement Binary

5962-9090801MVA

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

8

5 µs

6 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

Yes

e0

Binary

AD5689RTCPZ-EP-RL7

Analog Devices

Digital to Analog converter

Military

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

16

0.0076 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

TLV5638MDREP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.1 V

Yes

233 kHz

1

CMOS

12

7 µs

7 mA

0.1465 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

5962-8776303LX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

BICMOS

MIL-STD-883

12

2 mA

0.0244 %

Parallel, 8 Bits

12 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

5962-9451802MLA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

BICMOS

MIL-STD-883

12

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

Yes

e0

Binary, Offset Binary

DAC121S101WGRLV

Texas Instruments

Digital to Analog converter

Military

Gull Wing

10

SOP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

1.8 MHz

1

CMOS

12

12.5 µs

0.1953 %

Serial

3 V

Small Outline

12.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDSO-G10

1

0.092 in (2.33 mm)

0.241 in (6.12 mm)

e0

0.27 in (6.86 mm)

Binary

DAC121S101WGRQV

Texas Instruments

Digital to Analog converter

Military

Gull Wing

10

SOP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

5.5 V

Yes

1.8 MHz

1

CMOS

12

10 µs

312 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline

SOP10,.4

Other Converters

12.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDSO-G10

1

0.092 in (2.33 mm)

0.241 in (6.12 mm)

No

e0

0 V

0.27 in (6.86 mm)

Binary

TLV5618AMDREP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.1 V

Yes

93 kHz

1

CMOS

12

10 µs

2.3 mA

0.0977 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

AD5547SRU-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

38

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

16

10 μA

0.0031 %

Parallel, Word

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP38,.25,20

Other Converters

500 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G38

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

0.382 in (9.7 mm)

Binary

AD7245ATQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

CMOS

MIL-STD-883 Class B

12

10 µs

12 mA

0.0183 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

In-Line

DIP24,.3

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.