Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
Bipolar |
38535Q/M;38534H;883B |
12 |
4 µs |
23 mA |
0.024 % |
Parallel, Word |
15 V |
±12/±15 V |
-15 V |
In-Line |
DIP24,.3 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.3 in (7.62 mm) |
Yes |
e0 |
1.2 in (30.48 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
MIL-STD-883 |
12 |
2 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15 V |
In-Line |
DIP24,.3 |
Other Converters |
450 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
CMOS |
MIL-STD-883 |
12 |
1.5 µs |
2 mA |
0.0244 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
Yes |
e4 |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
Bipolar |
8 |
0 ns |
7.8 mA |
0.1 % |
Parallel, 8 Bits |
15 V |
-15 V |
In-Line |
85 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.75 in (19.05 mm) |
Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
16 |
0.024 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
7 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
Yes |
e0 |
-10 V |
1.49 in (37.85 mm) |
Binary, Offset Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
18 V |
Yes |
1 |
Bipolar |
MIL-STD-883 |
8 |
150 ns |
7.8 mA |
0.19 % |
Parallel, 8 Bits |
15 V |
±15 V |
-15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
85 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
Yes |
e0 |
-10 V |
0.35 in (8.89 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
Bipolar |
10 |
16 mA |
Parallel, Word |
15 V |
-15 V |
In-Line |
250 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.75 in (19.05 mm) |
Binary |
||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
18 V |
No |
1 |
Bipolar |
MIL-M-38510 |
8 |
0 ns |
0.1 % |
Parallel, 8 Bits |
15 V |
-15 V |
In-Line |
85 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
0.75 in (19.05 mm) |
Offset Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
12 |
Parallel, Word |
15 V |
-15 V |
In-Line |
250 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Binary |
||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
16 |
0.0122 % |
Serial |
11 V |
-11 V |
Small Outline, Thin Profile, Shrink Pitch |
9 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDSO-G16 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
-10 V |
0.197 in (5 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
20 |
0.000143 % |
Serial |
15 V |
-15 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
1 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDSO-G20 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
-10 V |
0.256 in (6.5 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
20 |
0.0003 % |
Serial |
15 V |
-15 V |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.256 in (6.5 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Military |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 MHz |
1 |
16 |
1 µs |
20 μA |
0.0023 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G8 |
3 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
Yes |
4 |
CMOS |
16 |
9 μA |
0.0023 % |
Serial |
5 V |
3/5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Other Converters |
900 ns |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDSO-G28 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
0.402 in (10.2 mm) |
Binary |
||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
16 |
0.0122 % |
Serial |
11 V |
-11 V |
Small Outline, Thin Profile, Shrink Pitch |
9 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDSO-G16 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
-10 V |
0.197 in (5 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
14 V |
Yes |
1 |
CMOS |
18 |
5.2 mA |
0.0004 % |
Serial |
15 V |
-15 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
1 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDSO-G20 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
-14 V |
0.256 in (6.5 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
4 |
Hybrid |
38535Q/M;38534H;883B |
12 |
8 µs |
120 mA |
0.0244 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
4 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
Yes |
-10 V |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
8 |
25 mA |
Parallel, 8 Bits |
5 V |
In-Line |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
0.75 in (19.05 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
18 |
0.0004 % |
Serial |
15 V |
-15 V |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDSO-G20 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
30 s |
260 °C (500 °F) |
0.256 in (6.5 mm) |
Binary, 2's Complement Binary |
||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Military |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
1.25 V |
Yes |
200 MHz |
1 |
CMOS |
14 |
90 mA |
0.0305 % |
Parallel, Word |
3.3 V |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Other Converters |
20 ns |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
2 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-.8 V |
0.276 in (7 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Hybrid |
12 |
8 µs |
100 mA |
0.0122 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
4 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
1.4 in (35.56 mm) |
Offset Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
0.012 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
0.024 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Military |
Gull Wing |
10 |
SOP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
5.5 V |
Yes |
1.8 MHz |
1 |
CMOS |
12 |
15 µs |
325 μA |
0.1953 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP10,.4 |
Other Converters |
12.5 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDSO-G10 |
1 |
0.092 in (2.33 mm) |
0.241 in (6.12 mm) |
No |
e0 |
0 V |
0.27 in (6.86 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2.56 V |
No |
1 |
Bipolar |
8 |
3 µs |
25 mA |
0.1465 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP16,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
0.8 in (20.32 mm) |
Complementary Offset Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
MIL-STD-883 |
8 |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
180 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
0.953 in (24.195 mm) |
Binary, Offset Binary |
||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Military |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
1.25 V |
Yes |
200 MHz |
1 |
CMOS |
14 |
90 mA |
0.0305 % |
Parallel, Word |
3.3 V |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Other Converters |
20 ns |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
2 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-.8 V |
0.276 in (7 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
16 |
HVQCCN |
Square |
5.005 V |
Yes |
1 |
16 |
0.0076 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N16 |
3 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Military |
Gull Wing |
14 |
SOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
2 MHz |
1 |
16 |
1 µs |
20 μA |
0.0023 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP14,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G14 |
3 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-5.5 V |
0.341 in (8.65 mm) |
Binary |
||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
MIL-STD-883 |
8 |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
180 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
0.953 in (24.195 mm) |
Binary, Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
10 |
1 µs |
2 mA |
0.2 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.75 in (19.05 mm) |
Binary, Offset Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
1 |
CMOS |
MIL-STD-883 |
12 |
10 µs |
12 mA |
0.0244 % |
Parallel, 8 Bits |
15 V |
12/15,GND/-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
No |
e0 |
-5 V |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
Parallel, Word |
5 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
Yes |
1 |
CMOS |
38535Q/M;38534H;883B |
16 |
0.024 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
7 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
Yes |
e4 |
-10 V |
0.45 in (11.43 mm) |
Binary, Offset Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
MIL-STD-883 Class B |
12 |
8 µs |
0.0122 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
4 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e4 |
-10 V |
1.4 in (35.56 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
38535Q/M;38534H;883B |
12 |
250 ns |
18 mA |
0.018 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
250 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
1 µs |
2 mA |
0.012 % |
Parallel, Word |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.953 in (24.195 mm) |
Binary, 2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
3.12 V |
No |
1 |
BICMOS |
MIL-STD-883 Class B |
16 |
Serial |
5 V |
-5 V |
In-Line |
1.5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-2.88 V |
0.75 in (19.05 mm) |
2's Complement Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
MIL-STD-883 |
8 |
5 µs |
6 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
Yes |
e0 |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
16 |
HVQCCN |
Square |
5.005 V |
Yes |
1 |
16 |
0.0076 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N16 |
3 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Military |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5.1 V |
Yes |
233 kHz |
1 |
CMOS |
12 |
7 µs |
7 mA |
0.1465 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
BICMOS |
MIL-STD-883 |
12 |
2 mA |
0.0244 % |
Parallel, 8 Bits |
12 V |
In-Line |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
BICMOS |
MIL-STD-883 |
12 |
10 mA |
0.0244 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
Yes |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Military |
Gull Wing |
10 |
SOP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
Yes |
1.8 MHz |
1 |
CMOS |
12 |
12.5 µs |
0.1953 % |
Serial |
3 V |
Small Outline |
12.5 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDSO-G10 |
1 |
0.092 in (2.33 mm) |
0.241 in (6.12 mm) |
e0 |
0.27 in (6.86 mm) |
Binary |
||||||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Military |
Gull Wing |
10 |
SOP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
5.5 V |
Yes |
1.8 MHz |
1 |
CMOS |
12 |
10 µs |
312 μA |
0.1953 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP10,.4 |
Other Converters |
12.5 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDSO-G10 |
1 |
0.092 in (2.33 mm) |
0.241 in (6.12 mm) |
No |
e0 |
0 V |
0.27 in (6.86 mm) |
Binary |
|||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Military |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5.1 V |
Yes |
93 kHz |
1 |
CMOS |
12 |
10 µs |
2.3 mA |
0.0977 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP8,.25 |
Other Converters |
3 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
38 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
16 |
10 μA |
0.0031 % |
Parallel, Word |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP38,.25,20 |
Other Converters |
500 ns |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDSO-G38 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
0.382 in (9.7 mm) |
Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
10 µs |
12 mA |
0.0183 % |
Parallel, Word |
15 V |
12/15,GND/-12/-15 V |
-15 V |
In-Line |
DIP24,.3 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.