Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1.9 V |
No |
4 |
CMOS |
10 |
980 μA |
0.1953 % |
Serial |
3.3 V |
3.3 V |
In-Line |
DIP20,.3 |
Other Converters |
12 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
Binary |
||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
4 |
CMOS |
8 |
12 mA |
Parallel, 8 Bits |
5 V |
5,GND/-5 V |
-5.5 V |
In-Line |
DIP20,.3 |
Other Converters |
6 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5.5 V |
Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
2 |
CMOS |
8 |
400 ns |
1 mA |
0.3906 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold Over Nickel |
Dual |
R-CDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
Binary |
|||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
2 |
BICMOS |
MIL-STD-883 |
8 |
6 mA |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
6 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0 V |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2.25 V |
No |
8 |
BICMOS |
8 |
2 µs |
9 mA |
0.3906 % |
Serial |
12 V |
12,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Other Converters |
1 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
Binary |
||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
CMOS |
8 |
5 µs |
6 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
In-Line |
DIP18,.3 |
Other Converters |
2 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T18 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0 V |
Offset Binary |
|||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
In-Line |
DIP24,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.25 in (31.75 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
10 |
800 ns |
2 mA |
0.1953 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0122 % |
Serial |
5 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
2 |
BICMOS |
12 |
10 mA |
0.0122 % |
Parallel, 8 Bits |
12 V |
±12/±15 V |
-12 V |
In-Line |
DIP24,.3 |
Other Converters |
4 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
Binary, Offset Binary |
||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 µs |
2.5 mA |
0.0244 % |
Parallel, 4 Bits |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0244 % |
Parallel, 8 Bits |
5 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T20 |
1 |
0.23 in (5.842 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.97 in (24.638 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 |
8 |
Serial |
15 V |
-5 V |
Chip Carrier |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
Binary |
||||||||||||||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
8 |
400 ns |
1 mA |
0.1953 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary |
|||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 |
8 |
500 ns |
2 mA |
1.9531 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
1 |
No |
Binary, Offset Binary |
||||||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Rectangular |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0122 % |
Parallel, Word |
15 V |
Chip Carrier |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
R-CQCC-N28 |
No |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
CMOS |
14 |
1.5 µs |
3 mA |
0.0122 % |
Parallel, 8 Bits |
12/15,GND/-0.3 V |
In-Line |
DIP20,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
Binary, Offset Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
4 |
BICMOS |
38535Q/M;38534H;883B |
8 |
4 µs |
22 mA |
0.2 % |
12/15, GND/-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
Binary |
|||||||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0244 % |
Parallel, Word |
15 V |
In-Line |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
1 |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 µs |
2.5 mA |
0.0122 % |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Yes |
1 |
CMOS |
MIL-STD-883 Class B |
8 |
0.1953 % |
Parallel, 8 Bits |
5 V |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold Over Nickel |
Quad |
S-XQCC-N20 |
1 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e4 |
0.35 in (8.89 mm) |
Binary, Offset Binary |
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Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
8 |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
||||||||||||||||||||||||||||||||
Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
12 |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
||||||||||||||||||||||||||||||||
Renesas Electronics |
Digital to Analog converter |
Military |
Flat |
24 |
DFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
12 |
0.0061 % |
Parallel, Word |
15 V |
-15 V |
Flatpack |
500 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDFP-F24 |
0.115 in (2.92 mm) |
0.39 in (9.905 mm) |
No |
e0 |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||||||||
Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
1 |
Bipolar |
12 |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
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|
Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
MIL-STD-883 Class B |
12 |
0.018 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
350 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Dual |
R-CDIP-T24 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e4 |
-1.5 V |
Binary, Offset Binary, 2's Complement Binary |
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Renesas Electronics |
Digital to Analog converter |
Military |
No Lead |
24 |
DIE |
Rectangular |
Yes |
1 |
12 |
0.0183 % |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
125 °C (257 °F) |
-55 °C (-67 °F) |
Upper |
R-XUUC-N24 |
Yes |
Binary, Offset Binary, 2's Complement Binary |
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Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
12 |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
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|
Renesas Electronics |
Digital to Analog converter |
Military |
Flat |
24 |
DFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
12 |
0.0061 % |
Parallel, Word |
15 V |
-15 V |
Flatpack |
500 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Dual |
R-CDFP-F24 |
0.115 in (2.92 mm) |
0.39 in (9.905 mm) |
No |
e4 |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||||||||
|
Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
12 |
0.0061 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
500 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Dual |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||||||||
Renesas Electronics |
Digital to Analog converter |
Military |
Flat |
24 |
DFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
12 |
0.0183 % |
Parallel, Word |
15 V |
-15 V |
Flatpack |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-CDFP-F24 |
Yes |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
Digital to Analog converter |
Military |
Flat |
24 |
DFP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
12 |
500 ns |
0.0122 % |
Parallel, Word |
15 V |
-15 V |
Flatpack |
FL24,.4 |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Dual |
R-CDFP-F24 |
0.115 in (2.92 mm) |
0.39 in (9.905 mm) |
e4 |
0.64 in (16.26 mm) |
Binary, Offset Binary, 2's Complement Binary |
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Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
8 |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
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Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
8 |
0.2 % |
-5.2 V |
-5.2 V |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
Binary |
||||||||||||||||||||||||||
Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
12 |
0.0183 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-CDIP-T24 |
Yes |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||||||||||||||
Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
12 |
0.012 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T18 |
No |
Binary, Offset Binary |
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Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
10 |
2 mA |
0.05 % |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T16 |
No |
Binary, Offset Binary |
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Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
1 |
Bipolar |
38535Q/M;38534H;883B |
12 |
250 ns |
26.3 mA |
0.018 % |
15 V |
±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
Binary, Offset Binary |
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Renesas Electronics |
Digital to Analog converter |
Military |
No Lead |
24 |
DIE |
Rectangular |
100k Rad(Si) |
Yes |
1 |
MIL-PRF-38535 Class V |
12 |
0.0061 % |
Parallel, Word |
15 V |
-15 V |
Uncased Chip |
500 ns |
125 °C (257 °F) |
-55 °C (-67 °F) |
Upper |
R-XUUC-N24 |
Yes |
Binary, Offset Binary, 2's Complement Binary |
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|
Renesas Electronics |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
No |
1 |
MIL-PRF-38535 Class V |
12 |
0.0061 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
500 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Dual |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e4 |
Binary, Offset Binary, 2's Complement Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.