Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
10 |
2 mA |
0.2 % |
Parallel, Word |
15 V |
In-Line |
DIP16,.3 |
500 ns |
3.937 in (100 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.84 in (21.34 mm) |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0061 % |
Parallel, Word |
12/15,GND/-0.3 V |
In-Line |
DIP28,.6 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
1 |
0.23 in (5.842 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.45 in (36.83 mm) |
Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
8 |
400 ns |
2.5 mA |
0.1953 % |
Parallel, 8 Bits |
12/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
0.23 in (5.842 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.95 in (24.13 mm) |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
5 V |
No |
1 |
BICMOS |
12 |
5 µs |
12 mA |
0.0244 % |
Parallel, Word |
15 V |
12/15,GND/-12/-15 V |
-15 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
13 |
650 μA |
0.0122 % |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
16 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
Bipolar |
12 |
0 ns |
18 mA |
0.018 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
150 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
-10 V |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
1 µs |
500 μA |
0.0244 % |
Serial |
5 V |
5/15 V |
In-Line |
DIP8,.3 |
Other Converters |
250 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
Binary, Offset Binary, 2's Complement Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
1 |
CMOS |
12 |
980 μA |
0.0244 % |
Serial |
5 V |
5 V |
In-Line |
DIP20,.3 |
Other Converters |
12 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
CMOS |
12 |
1 µs |
3 mA |
0.0244 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T20 |
1 |
0.23 in (5.842 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.97 in (24.638 mm) |
Binary, Offset Binary, 2's Complement Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic |
Yes |
2 |
BICMOS |
38535Q/M;38534H;883B |
12 |
1.5 µs |
2 mA |
0.012 % |
12/15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-XQCC-N28 |
No |
e0 |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
8 |
CMOS |
8 |
5 µs |
42 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
1.25 in (31.75 mm) |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
CMOS |
12 |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold Over Nickel |
Dual |
R-CDIP-T18 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
12 |
1 µs |
0.0122 % |
Serial |
15 V |
In-Line |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold with Nickel barrier |
Dual |
R-CDIP-T18 |
1 |
No |
e4 |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0122 % |
Parallel, Word |
15 V |
In-Line |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary |
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|
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
12 |
1 µs |
2 mA |
0.024 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T18 |
No |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
12 |
5 µs |
10 mA |
0.0732 % |
Parallel, Word |
15 V |
±12/±15 V |
-15 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T24 |
1 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 µs |
2 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary, 2's Complement Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
12 |
1 µs |
0.0122 % |
Serial |
15 V |
In-Line |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T18 |
1 |
No |
e0 |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
1 µs |
500 μA |
0.0244 % |
Serial |
5 V |
5/15 V |
In-Line |
DIP8,.3 |
Other Converters |
250 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
Binary, Offset Binary, 2's Complement Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
12 |
5 µs |
12 mA |
0.024 % |
Parallel, Word |
12 V |
12/±15 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
2 |
BICMOS |
12 |
10 mA |
0.0122 % |
Parallel, Word |
12 V |
±12/±15 V |
-12 V |
In-Line |
DIP24,.3 |
Other Converters |
4 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 µs |
2 mA |
0.0244 % |
Parallel, Word |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold Over Nickel |
Dual |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
Binary, Offset Binary, 2's Complement Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
10 |
0.0488 % |
Parallel, Word |
15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
0.0122 % |
Serial |
5 V |
In-Line |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
No |
e0 |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 µs |
2.5 mA |
0.0122 % |
Parallel, 4 Bits |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2.5 V |
No |
4 |
CMOS |
8 |
1.5 mA |
0.3906 % |
Serial |
3 V |
3/3.3 V |
In-Line |
DIP16,.3 |
Other Converters |
6 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 |
12 |
2 mA |
0.0488 % |
Parallel, Word |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
1 |
No |
Binary, 2's Complement Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0061 % |
Parallel, Word |
12/15,-0.3 V |
In-Line |
DIP24,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.25 in (31.75 mm) |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0122 % |
Parallel, Word |
15 V |
In-Line |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
4 |
CMOS |
8 |
4 µs |
12 mA |
0.3906 % |
Parallel, Word |
15 V |
12/15, GND/-5 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
No |
e0 |
Binary |
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|
Maxim Integrated |
Digital to Analog converter |
Military |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
1 |
BICMOS |
12 |
5 µs |
12 mA |
0.0244 % |
Parallel, Word |
15 V |
12/15,GND/-12/-15 V |
-15 V |
Small Outline |
LCC28,.45SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
-5 V |
0.606 in (15.4 mm) |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
No |
1 |
BICMOS |
38535Q/M;38534H;883B |
12 |
1 µs |
3 mA |
0.024 % |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T20 |
No |
e0 |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
No |
2 |
CMOS |
12 |
1.5 µs |
3 mA |
0.0122 % |
Parallel, 4 Bits |
15 V |
15 V |
In-Line |
DIP20,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T20 |
e0 |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
MIL-STD-883 |
12 |
1 µs |
500 μA |
0.0122 % |
Serial |
5 V |
5/15 V |
In-Line |
DIP8,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
1 |
No |
e0 |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
3.6 V |
No |
2 |
CMOS |
13 |
600 μA |
0.0244 % |
Serial |
3 V |
3/3.3 V |
In-Line |
DIP16,.3 |
Other Converters |
16 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0 V |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5.5 V |
No |
1 |
CMOS |
8 |
24 mA |
0.78 % |
Serial |
5 V |
5 V |
In-Line |
SOP20,.4 |
Other Converters |
6 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
8 |
500 ns |
2 mA |
0.1953 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
In-Line |
DIP28,.6 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold Over Nickel |
Dual |
R-CDIP-T28 |
1 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e4 |
-10 V |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
CMOS |
8 |
0.1953 % |
Parallel, 8 Bits |
5 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
8 |
BICMOS |
38535Q/M;38534H;883B |
8 |
5 µs |
42 mA |
0.39 % |
12/15, GND/-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
4 |
BICMOS |
38535Q/M;38534H;883B |
8 |
4 µs |
12 mA |
0.39 % |
12/15, GND/-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
10 |
800 ns |
2 mA |
0.0977 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 |
12 |
2 mA |
0.0488 % |
Parallel, Word |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
1 |
No |
Binary, 2's Complement Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2.5 V |
No |
4 |
CMOS |
12 |
0.0122 % |
Serial |
5 V |
±5 V |
-5 V |
In-Line |
DIP16,.3 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
0.75 in (19.05 mm) |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
4 |
CMOS |
12 |
18 mA |
0.0122 % |
Parallel, Word |
5 V |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary |
|||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
CMOS |
12 |
2 µs |
2.5 mA |
0.0244 % |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold Over Nickel |
Dual |
R-CDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
0.75 in (19.05 mm) |
Binary, Offset Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
4 |
CMOS |
12 |
28 mA |
0.0122 % |
Parallel, Word |
15 V |
15,-5 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
Bipolar |
12 |
0 ns |
20 mA |
0.012 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
150 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
-10 V |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.