Military Digital-to-Analog Converters 1,864

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

5962R1621101VXA

STMicroelectronics

Digital to Analog converter

Military

Flat

24

DFP

Rectangular

100k Rad(Si)

.2 V

Yes

1

MIL-PRF-38535 Class V

16

4.7 mA

0.0069 %

Serial

3.3 V

Flatpack

FL24,.41

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

0.109 in (2.77 mm)

0.38 in (9.65 mm)

Yes

-.2 V

0.61 in (15.49 mm)

Binary

5962R2120801V9A

STMicroelectronics

Digital to Analog converter

Military

No Lead

6

DIE

Rectangular

100k Rad(Si)

Yes

1

CMOS

MIL-PRF-38535 Class V

12

0.0977 %

Serial

3.3 V

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N6

Yes

3.285 V

Binary

5962R2120801VXA

STMicroelectronics

Digital to Analog converter

Military

Flat

10

DFP

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-PRF-38535 Class V

12

0.0977 %

Serial

3.3 V

Flatpack

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

S-CDFP-F10

0.103 in (2.62 mm)

0.255 in (6.48 mm)

Yes

3.285 V

0.255 in (6.48 mm)

Binary

5962R2120801VXC

STMicroelectronics

Digital to Analog converter

Military

Flat

10

DFP

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-PRF-38535 Class V

12

0.0977 %

Serial

3.3 V

Flatpack

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

S-CDFP-F10

0.103 in (2.62 mm)

0.255 in (6.48 mm)

Yes

3.285 V

0.255 in (6.48 mm)

Binary

5962R1621101V9X

STMicroelectronics

Digital to Analog converter

Military

No Lead

32

DIE

Rectangular

100k Rad(Si)

Yes

1

MIL-PRF-38535 Class V

16

0.0069 %

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N32

Yes

Binary

5962R1621101V9A

STMicroelectronics

Digital to Analog converter

Military

No Lead

32

DIE

Rectangular

100k Rad(Si)

Yes

1

MIL-PRF-38535 Class V

16

0.0069 %

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N32

Yes

Binary

RHRDAC1612K01V

STMicroelectronics

Digital to Analog converter

Military

Flat

24

DFP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

1

16

0.0069 %

Serial

3.3 V

Flatpack

800 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDFP-F24

3

0.109 in (2.77 mm)

0.38 in (9.65 mm)

0.61 in (15.49 mm)

Binary, 2's Complement Binary

RH-DAC1612K1

STMicroelectronics

Digital to Analog converter

Military

Flat

24

DFP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

1

16

0.0069 %

Serial

3.3 V

Flatpack

800 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDFP-F24

0.109 in (2.77 mm)

0.38 in (9.65 mm)

0.61 in (15.49 mm)

Binary, 2's Complement Binary

DAC0808LJ

STMicroelectronics

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

Bipolar

8

0.19 %

Parallel, 8 Bits

5 V

5,-15 V

-15 V

In-Line

DIP16,.3

Other Converters

150 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

TDE8712D-T

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

0 V

No

1

Bipolar

8

0 ns

0.2 %

Parallel, 8 Bits

5 V

In-Line

6.5 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-1.75 V

Binary

SE5119F

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

22

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

8

0.0977 %

Parallel, 8 Bits

15 V

-15 V

In-Line

200 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T22

0.2 in (5.08 mm)

0.4 in (10.16 mm)

No

1.082 in (27.495 mm)

Binary

DAC08F

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

8

0 ns

Parallel, 8 Bits

15 V

-15 V

In-Line

70 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-10 V

0.769 in (19.535 mm)

Binary, Offset Binary

SE5019F

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

22

DIP

Rectangular

Ceramic, Glass-Sealed

5.25 V

No

1

Bipolar

8

15 mA

0.1 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP22,.4

Other Converters

2.3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T22

0.2 in (5.08 mm)

0.4 in (10.16 mm)

No

-5.25 V

1.082 in (27.495 mm)

Binary

SE5018N

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

22

DIP

Rectangular

Plastic/Epoxy

5.25 V

No

1

Bipolar

8

15 mA

0.19 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP22,.4

Other Converters

2.3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDIP-T22

0.19 in (4.83 mm)

0.4 in (10.16 mm)

No

-5.25 V

1.102 in (28 mm)

Binary

DAC08AF

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

8

0 ns

Parallel, 8 Bits

15 V

-15 V

In-Line

70 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-10 V

0.769 in (19.535 mm)

Binary, Offset Binary

5018/BWA

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

22

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

5.5 V

No

1

8

15 mA

0.19 %

Parallel, 8 Bits

15 V

-15 V

In-Line

1.8 µs

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T22

No

-5.25 V

Binary

SE5410F

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

2.5 V

No

1

10

0.0488 %

Parallel, Word

5 V

-15 V

In-Line

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-2.5 V

0.769 in (19.535 mm)

Binary

TDE8712D

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

0 V

No

1

Bipolar

8

0 ns

0.2 %

Parallel, 8 Bits

5 V

In-Line

6.5 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-1.75 V

Binary

SE5019N

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

22

DIP

Rectangular

Plastic/Epoxy

5.25 V

No

1

Bipolar

8

15 mA

0.1 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP22,.4

Other Converters

2.3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDIP-T22

0.19 in (4.83 mm)

0.4 in (10.16 mm)

No

-5.25 V

1.102 in (28 mm)

Binary

SE5018F

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

22

DIP

Rectangular

Ceramic, Glass-Sealed

5.25 V

No

1

Bipolar

8

15 mA

0.19 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP22,.4

Other Converters

2.3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T22

0.2 in (5.08 mm)

0.4 in (10.16 mm)

No

-5.25 V

1.082 in (27.495 mm)

Binary

MC3510F

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

10

0.05 %

Parallel, Word

5 V

-15 V

In-Line

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.769 in (19.535 mm)

Binary

MC1508-8F/883B

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

.5 V

No

1

MIL-STD-883 Class B

8

0.19 %

Parallel, 8 Bits

5 V

-15 V

In-Line

70 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-5 V

0.769 in (19.535 mm)

Binary

MC1508-8F

NXP Semiconductors

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

.5 V

No

1

8

0.19 %

Parallel, 8 Bits

5 V

-15 V

In-Line

70 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-5 V

0.769 in (19.535 mm)

Binary

5962-8950901XX

Infineon Technologies

Digital to Analog converter

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

3

CMOS

8

0.3906 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T40

0.22 in (5.588 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

Binary

5962-8950901XA

Infineon Technologies

Digital to Analog converter

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

3

CMOS

MIL-STD-883

8

0.3906 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T40

0.22 in (5.588 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

Binary

MX7524TQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7225TE/883

Maxim Integrated

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

4

CMOS

MIL-STD-883

8

0.3906 %

Parallel, 8 Bits

15 V

-5 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

Binary

MX7545GUD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary, 2's Complement Binary

MAX533BMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

2.5 V

No

4

CMOS

8

1.5 mA

0.7812 %

Serial

3 V

3/3.3 V

In-Line

DIP16,.3

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

MX7534TD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

1.5 µs

3 mA

0.0061 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

-10 V

Binary, Offset Binary

MX7537UE

Maxim Integrated

Digital to Analog converter

Military

J Bend

20

QCCJ

Square

Yes

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-XQCC-J20

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

0.353 in (8.965 mm)

Binary, Offset Binary, 2's Complement Binary

MAX510AMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

4

8

12 mA

0.024 %

Serial

5 V

5/±5 V

-5 V

In-Line

DIP16,.3

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

-5 V

Binary

5962-9234501M2A

Maxim Integrated

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

0.0122 %

Serial

5 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

Binary

MAX536AMDE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

CMOS

12

0.0122 %

Serial

15 V

12/15,-5 V

-5 V

In-Line

DIP16,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

245 °C (473 °F)

0 V

0.75 in (19.05 mm)

Binary

5962-8876702LX

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

12

0.0183 %

Parallel, Word

12 V

-12 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

Binary, Offset Binary

MX7547TQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

Parallel, Word

15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

1

Binary

MX7537TQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5150BMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5.5 V

No

2

CMOS

13

650 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

0 V

Binary

MAX5155BMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

650 μA

0.0488 %

Serial

3 V

3/3.3 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

Binary

MAX536BMDE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

CMOS

12

0.0244 %

Serial

15 V

12/15,-5 V

-5 V

In-Line

DIP16,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

245 °C (473 °F)

0 V

0.75 in (19.05 mm)

Binary

MX7541TQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.12 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

5962-9234502M2A

Maxim Integrated

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

Binary

MX7541SD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

1 µs

0.02441 %

Serial

15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-CDIP-T18

1

No

e0

Binary

AD7545SQ/883

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2 mA

0.049 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

Binary

MAX505BMRG

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

4

CMOS

8

12 mA

Parallel, 8 Bits

5 V

5,GND/-5 V

-5.5 V

In-Line

DIP24,.3

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

-5.5 V

Binary

MX7535SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary, Offset Binary

MAX508AMJP

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

12

5 µs

12 mA

0.018 %

Parallel, Word

12 V

12/±15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

Binary, Offset Binary

MX7543TD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.