Military Digital-to-Analog Converters 1,864

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX534AMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5.5 V

No

1

CMOS

8

1.5 mA

0.3906 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

8 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

AD7545AUQ/883

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2 mA

0.012 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

Binary

AD7548TQ/883

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

Binary

5962-9234502MPA

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

12

1 µs

500 μA

0.0244 %

Serial

5 V

5/15 V

In-Line

DIP8,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T8

1

No

e0

Binary

MAX506AMJP/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

4

CMOS

8

Parallel, 8 Bits

5 V

-5.5 V

In-Line

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5.5 V

Binary

MX7541ASD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MAX5153BMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

13

600 μA

0.0244 %

Serial

3 V

3/3.3 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

Binary

MAX5156BMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5.5 V

No

2

CMOS

12

650 μA

0.0244 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

0 V

Binary

MX7548TQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

1

0.23 in (5.842 mm)

0.3 in (7.62 mm)

No

e0

0.97 in (24.638 mm)

Binary, Offset Binary, 2's Complement Binary

MAX529MJP

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

3 V

No

8

BICMOS

8

2 µs

9 mA

0.3906 %

Serial

5 V

5,GND/-5 V

-5 V

In-Line

DIP20,.3

Other Converters

1 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

Binary

MAX7645AMJP

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, Word

5 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, 2's Complement Binary

5962-9452702M2A

Maxim Integrated

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

CMOS

8

0.1953 %

Serial

15 V

-5 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

Binary

5962-87702012C

Maxim Integrated

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

2 mA

0.0488 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

1

No

Binary, 2's Complement Binary

MX390SD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

Hybrid

12

8 µs

50 mA

0.0183 %

Parallel, Word

15 V

-15 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

MX7548SD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

1 µs

3 mA

0.0244 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

1

0.23 in (5.842 mm)

0.3 in (7.62 mm)

No

e0

0.97 in (24.638 mm)

Binary, Offset Binary, 2's Complement Binary

MX7541ATQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

Binary, Offset Binary

MX7524TD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MX7543SQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

Serial

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX502AMRG

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

12

5 µs

10 mA

0.0732 %

Parallel, Word

15 V

±12/±15 V

-15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T24

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

20 s

240 °C (464 °F)

Binary, Offset Binary

MX7542GTD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX502BMRG

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±12/±15 V

-15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

Binary, Offset Binary

MX7543TQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

Serial

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7228UQ/883

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

BICMOS

38535Q/M;38534H;883B

8

5 µs

42 mA

0.2 %

12/15, GND/-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary

MX7224UQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

2 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Offset Binary

MAX520AMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5.5 V

No

1

CMOS

8

20 μA

0.39 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

2 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

0 V

Binary

5962-87700022C

Maxim Integrated

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

8

500 ns

2 mA

1.9531 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

1

No

Binary, Offset Binary

MX7542SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0244 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX526BMYG/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

4

CMOS

12

0.0244 %

Parallel, Word

15 V

-5 V

In-Line

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

MX7541ASQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883 Class B

12

2 mA

0.024 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.96 in (24.38 mm)

Offset Binary

MAX532BMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

12.5 V

No

2

CMOS

12

10 mA

0.0244 %

Serial

15 V

±12/±15 V

-15 V

In-Line

DIP16,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

-12.5 V

Binary

MX7541ASQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7547TQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary, 2's Complement Binary

MX7521UQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.96 in (24.38 mm)

Binary, Offset Binary

MAX526BMYG

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

4

CMOS

12

28 mA

0.0244 %

Parallel, Word

15 V

15,-5 V

-5 V

In-Line

DIP24,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

Binary

MX7524TQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7545UQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary, 2's Complement Binary

AD7545TQ/883

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2 mA

0.024 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

Binary

MAX5154BMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

650 μA

0.0244 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

Binary

MX7535TD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

-10 V

Binary, Offset Binary

MX7624MJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

350 ns

2.5 mA

0.1953 %

Parallel, 8 Bits

5 V

12/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7548TQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

1 µs

3 mA

0.0122 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

1

0.23 in (5.842 mm)

0.3 in (7.62 mm)

No

e0

0.97 in (24.638 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5355MJA

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

3.3 V

No

1

CMOS

10

400 μA

0.0977 %

Serial

3.3 V

3.3 V

In-Line

DIP8,.3

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

MAX526CMYG/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

4

CMOS

12

0.0122 %

Parallel, Word

15 V

-5 V

In-Line

3 µs

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T24

1

No

e4

Binary

MAX506BMJP/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

4

CMOS

8

Parallel, 8 Bits

5 V

-5.5 V

In-Line

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5.5 V

Binary

MX7528TQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

8

400 ns

1 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

MAX531AMJD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

14

DIP

Rectangular

Ceramic, Glass-Sealed

5.1 V

No

1

12

0.0244 %

Serial

5 V

±5 V

-5 V

In-Line

DIP8(UNSPEC)

Other Converters

25 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T14

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

-5.1 V

0.765 in (19.43 mm)

Binary

MAX542CMJD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

14

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2.5 V

No

1

CMOS

16

1.1 mA

0.0061 %

Serial

5 V

5 V

In-Line

DIP14,.3

Other Converters

1 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T14

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Offset Binary

MX7225UQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

4 µs

12 mA

0.1953 %

Parallel, Word

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

No

e0

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.