Military Digital-to-Analog Converters 1,864

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MX7549TQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

12

1.5 µs

3 mA

0.0122 %

Parallel, 4 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

e0

Binary

5962-9234501MPA

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

12

1 µs

500 μA

0.0122 %

Serial

5 V

5/15 V

In-Line

DIP8,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T8

1

No

e0

Binary

MAX5151BMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

3.6 V

No

2

CMOS

13

600 μA

0.0244 %

Serial

3 V

3/3.3 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

0 V

Binary

MAX521BMJP

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5.5 V

No

1

CMOS

8

24 mA

0.78 %

Serial

5 V

5 V

In-Line

SOP20,.4

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

Binary

MX7524SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7535SD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

-10 V

Binary, Offset Binary

MX7524SD-T

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

8

0.1953 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7228TQ/883

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

BICMOS

38535Q/M;38534H;883B

8

5 µs

42 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary

MX7225TQ/883

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

4

BICMOS

38535Q/M;38534H;883B

8

4 µs

12 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary

MX7533TD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

800 ns

2 mA

0.0977 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

5962-87702032C

Maxim Integrated

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

2 mA

0.0488 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

1

No

Binary, 2's Complement Binary

MAX537AMDE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2.5 V

No

4

CMOS

12

0.0122 %

Serial

5 V

±5 V

-5 V

In-Line

DIP16,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary

MAX527AMYG

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

4

CMOS

12

18 mA

0.0122 %

Parallel, Word

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

MX7543SD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 µs

2.5 mA

0.0244 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

0.75 in (19.05 mm)

Binary, Offset Binary

MAX526AMYG

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

4

CMOS

12

28 mA

0.0122 %

Parallel, Word

15 V

15,-5 V

-5 V

In-Line

DIP24,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

Binary

MX565ATQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

Bipolar

12

0 ns

20 mA

0.012 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

150 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

-10 V

Binary

5962-9452702M2X

Maxim Integrated

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

CMOS

8

0.1953 %

Serial

15 V

-5 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

Binary

MAX500BMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

8

4.5 µs

22 mA

0.3906 %

Serial

15 V

11.4/16.5,GND/-5 V

-5 V

In-Line

DIP16,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

0 V

Binary

MX390TD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

Hybrid

12

8 µs

50 mA

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

MX7541SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

1 µs

0.02441 %

Serial

15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-CDIP-T18

1

No

e0

Binary

MX7545SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2 mA

0.0488 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

Binary, Offset Binary, 2's Complement Binary

MX7547SQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

Parallel, Word

15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

1

Binary

5962-9452702MEA

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

MIL-STD-883

8

4.5 µs

22 mA

0.3906 %

Serial

15 V

11.4/16.5,GND/-5 V

-5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

No

e0

Binary

MX565ASD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

Bipolar

12

0 ns

20 mA

0.018 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

150 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

-10 V

Binary

MX7225UQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

4

CMOS

38535Q/M;38534H;883B

8

4 µs

12 mA

0.2 %

12/15, GND/-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

Binary

MAX506AMJP

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

4

CMOS

8

12 mA

Parallel, 8 Bits

5 V

5,GND/-5 V

-5.5 V

In-Line

DIP20,.3

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

-5.5 V

Binary

MX7837SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

2

BICMOS

12

10 mA

0.0244 %

Parallel, 8 Bits

12 V

±12/±15 V

-12 V

In-Line

DIP24,.3

Other Converters

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary, Offset Binary

MX7847SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

2

BICMOS

12

10 mA

0.0244 %

Parallel, Word

12 V

±12/±15 V

-12 V

In-Line

DIP24,.3

Other Converters

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

-10 V

Binary, Offset Binary

MAX532AMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

12.5 V

No

2

CMOS

12

10 mA

0.0122 %

Serial

15 V

±12/±15 V

-15 V

In-Line

DIP16,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

-12.5 V

Binary

5962-87700032C

Maxim Integrated

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

8

500 ns

2 mA

1.9531 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

1

No

Binary, Offset Binary

MAX510BMJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

4

8

12 mA

0.037 %

Serial

5 V

5/±5 V

-5 V

In-Line

DIP16,.3

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

-5 V

Binary

5962-89657033C

Maxim Integrated

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MAX5250BMJP

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

CMOS

10

980 μA

0.0977 %

Serial

5 V

5 V

In-Line

DIP20,.3

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

Binary, Offset Binary

MX7226TQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

4

CMOS

38535Q/M;38534H;883B

8

4 µs

13 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

Binary

MX7533SQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

10

800 ns

2 mA

0.1953 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

5962-9566702MEX

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

0.0122 %

Serial

15 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

No

e0

Binary

MX7224TD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

8

5 µs

6 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

2 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Offset Binary

MX7226TD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

4

CMOS

8

4 µs

13 mA

0.3906 %

Parallel, Word

15 V

12/15, GND/-5 V

-5 V

In-Line

DIE OR CHIP

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary

MAX531BMJD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

14

DIP

Rectangular

Ceramic, Glass-Sealed

5.1 V

No

1

12

0.0488 %

Serial

5 V

±5 V

-5 V

In-Line

DIP8(UNSPEC)

Other Converters

25 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T14

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

-5.1 V

0.765 in (19.43 mm)

Binary

MAX537BMDE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2.5 V

No

4

CMOS

12

0.0244 %

Serial

5 V

±5 V

-5 V

In-Line

DIP16,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary

MAX538BMJA

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

2.6 V

No

1

CMOS

12

300 μA

0.048 %

Serial

5 V

5 V

In-Line

DIP8(UNSPEC)

Other Converters

25 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

MAX539AMJA

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

4.6 V

No

1

CMOS

12

300 μA

0.024 %

Serial

5 V

5 V

In-Line

DIP8(UNSPEC)

Other Converters

25 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

0 V

Binary

5962-9566701MEA

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

12

10 mA

0.0122 %

Serial

15 V

±12/±15 V

-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

No

e0

Binary

MX7537SE

Maxim Integrated

Digital to Analog converter

Military

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.024 %

Parallel, Word

15 V

12/15 V

Small Outline

LCC28,.45SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-PDSO-G20

0.105 in (2.67 mm)

0.295 in (7.5 mm)

No

e0

0.505 in (12.82 mm)

Binary, Offset Binary, 2's Complement Binary

MAX526AMYG/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

4

CMOS

12

0.0122 %

Parallel, Word

15 V

-5 V

In-Line

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

MX7228UQ/883

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

BICMOS

38535Q/M;38534H;883B

8

5 µs

42 mA

0.2 %

12/15, GND/-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary

MAX526DMYG/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

4

CMOS

12

0.0244 %

Parallel, Word

15 V

-5 V

In-Line

3 µs

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T24

1

No

e4

Binary

MAX509BMJP

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

4

8

12 mA

0.037 %

Serial

5 V

5/±5 V

-5 V

In-Line

DIP20,.3

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

-5 V

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.