Other Digital-to-Analog Converters 1,129

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7523AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

8

0.2 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

AD7542GBD/+

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T16

e0

Binary

5962-01-426-0903

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Hybrid

10

375 ns

8.33 mA

0.1 %

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T16

No

Complementary Binary

AD7549AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

2

CMOS

12

1.5 µs

5 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T20

0.3 in (7.62 mm)

No

e0

1 in (25.4 mm)

Binary

AD7535AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.6 in (15.24 mm)

No

e0

1.399 in (35.54 mm)

Binary

DAC-888G

Analog Devices

Digital to Analog converter

Other

No Lead

18

DIE

Rectangular

5 V

Yes

1

8

16 mA

0.19 %

Parallel, 8 Bits

5 V

-12 V

Uncased Chip

300 ns

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

-5 V

Binary

AD1860N

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

3.12 V

No

1

BIMOS

18

15 mA

Serial

5 V

±5/±12 V

-5 V

In-Line

DIP16,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-3.12 V

0.793 in (20.13 mm)

2's Complement Binary

DAC8841GBC

Analog Devices

Digital to Analog converter

Other

No Lead

24

DIE

3 V

Yes

8

CMOS

8

6 µs

26 mA

0.586 %

Serial

5 V

5 V

Uncased Chip

DIE OR CHIP

Other Converters

25 °C (77 °F)

-25 °C (-13 °F)

Tin Lead

Upper

X-XUUC-N24

No

e0

0 V

Binary

5962-01-181-4856

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Metal

No

1

ECL

8

10 ns

360 mA

-5.2 V

-5.2 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-MDIP-T24

No

Complementary Binary

5962-01-203-4877

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

0.05 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

DAC-86EX

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

8

9.3 mA

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

1 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

5962-01-221-6728

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

10

2 mA

0.05 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

ADDAC72C-COB-I

Analog Devices

Digital to Analog converter

Other

Pin/Peg

24

DIP

Rectangular

Metal

10 V

No

1

Bipolar

16

3 µs

55 mA

0.003 %

Parallel, Word

15 V

5,±15 V

-15 V

Microelectronic Assembly

DIP24,.6

Other Converters

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-MDMA-P24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Complementary Offset Binary

AD7525CD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

1 mA

0.025 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary Coded Decimal

ADDAC71-CSB-V

Analog Devices

Digital to Analog converter

Other

Pin/Peg

24

DIP

Rectangular

Metal

10 V

No

1

Bipolar

16

10 µs

55 mA

0.003 %

Parallel, Word

15 V

5,±15 V

-15 V

Microelectronic Assembly

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-MDMA-P24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

0 V

Complementary Binary

DAC100ACQ7

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

Hybrid

10

0 ns

8.33 mA

0.05 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

375 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

0.75 in (19.05 mm)

Complementary Binary

AD7523AD/883B

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

AD7531JD

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T18

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

Binary

AD1856RZ-K-REEL7

Analog Devices

Digital to Analog converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

16

15 mA

Serial

5 V

±5 V

-5 V

Small Outline

SOP16,.4

Other Converters

1.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

-3 V

0.406 in (10.3 mm)

2's Complement

AD1866R

Analog Devices

Digital to Analog converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

14 mA

Serial

5 V

5 V

Small Outline

SOP16,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-35 °C (-31 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.299 in (7.6 mm)

No

e0

240 °C (464 °F)

-1 V

0.406 in (10.3 mm)

2's Complement Binary

5962-01-410-8764

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T16

No

Binary

AD7527GCD/883B

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD7840CQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

BICMOS

14

4 µs

15 mA

0.003 %

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

2's Complement

AD1865PZ

Analog Devices

Digital to Analog converter

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

3.06 V

Yes

2

BICMOS

18

1 %

Serial

5 V

-5 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

-3.06 V

0.453 in (11.5062 mm)

2's Complement Binary

ADDAC85-CCD-I

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

0.0122 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

0 V

Binary Coded Decimal

AD7537ACHIPS

Analog Devices

Digital to Analog converter

Other

2

BICMOS

12

1.5 µs

2 mA

0.024 %

12/15 V

DIE OR CHIP

Other Converters

85 °C (185 °F)

-25 °C (-13 °F)

No

Binary, Offset Binary

AD5535ABCZ

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

215 V

Yes

1

14

Serial

5 V

3/5,5 V

-5 V

Grid Array, Low Profile

BGA124,14X14,40

Other Converters

10 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Silver Copper

Bottom

S-XBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

No

e1

260 °C (500 °F)

2.5 V

0.591 in (15 mm)

Binary

AD767ACHIPS

Analog Devices

Digital to Analog converter

Other

No Lead

24

DIE

Rectangular

10 V

Yes

1

Bipolar

12

4 µs

23 mA

0.0244 %

Parallel, Word

15 V

±12/±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

3 µs

85 °C (185 °F)

-25 °C (-13 °F)

Upper

R-XUUC-N24

No

-10 V

Binary

AD1864N

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

3 V

No

2

BIMOS

18

28 mA

Serial

5 V

±5 V

-5 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-3 V

1.22 in (31 mm)

2's Complement Binary

MAX5762CUCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

QFP

Plastic/Epoxy

Yes

32

16

20 µs

0.048 %

3/5,5 V

Flatpack

QFP64(UNSPEC)

Other Converters

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

No

e0

Binary

MAX5764BUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

-2.5 V

0.394 in (10 mm)

Binary

MAX5773UTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

10 V

Yes

1

BICMOS

14

20 µs

0.0244 %

Serial

5 V

2.7/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

2's Complement Binary

MX7531LQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5018BIPG

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

8

220 mA

0.37 %

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP24,.3

Other Converters

7 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin Lead

Dual

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

Binary

MX7535BQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary, Offset Binary

MX7530KD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

2 mA

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5773UCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

14

20 µs

0.0244 %

Serial

5 V

2.7/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

0 V

0.394 in (10 mm)

2's Complement Binary

MAX5763CUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

QCCN

Square

Plastic/Epoxy

Yes

32

16

20 µs

0.048 %

3/5,5,10.5 V

Chip Carrier

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-N68

No

e0

Binary

MX7228CQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

8

CMOS

8

5 µs

20 mA

0.1953 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

1.25 in (31.75 mm)

Binary

MP7645AQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 µs

2 mA

0.049 %

15 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T20

e0

Binary

MAX7533AQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

0.2 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

MAX5774UTK+T

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

7.5 V

Yes

1

BICMOS

14

20 µs

0.0244 %

Serial

5 V

2.7/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.394 in (10 mm)

2's Complement Binary

MAX5762CUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

QCCN

Square

Plastic/Epoxy

Yes

32

16

20 µs

0.048 %

3/5,5 V

Chip Carrier

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-N68

No

e0

Binary

MAX5140IPG

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

220 mA

0.37 %

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP24,.3

Other Converters

4 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin Lead

Dual

R-PDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

Binary

MX7531JD

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIE OR CHIP

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MAX7533CD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

0.05 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

MAX5733BUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

MAX5763BUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.