Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
8 |
0.2 % |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-XDIP-T16 |
No |
e0 |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
12 |
2 µs |
2.5 mA |
0.012 % |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T16 |
e0 |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
Hybrid |
10 |
375 ns |
8.33 mA |
0.1 % |
15 V |
±15 V |
-15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-XDIP-T16 |
No |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
2 |
CMOS |
12 |
1.5 µs |
5 mA |
0.0244 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-CDIP-T20 |
0.3 in (7.62 mm) |
No |
e0 |
1 in (25.4 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
In-Line |
DIP28,.6 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.6 in (15.24 mm) |
No |
e0 |
1.399 in (35.54 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
No Lead |
18 |
DIE |
Rectangular |
5 V |
Yes |
1 |
8 |
16 mA |
0.19 % |
Parallel, 8 Bits |
5 V |
-12 V |
Uncased Chip |
300 ns |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Upper |
R-XUUC-N18 |
No |
e0 |
-5 V |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
3.12 V |
No |
1 |
BIMOS |
18 |
15 mA |
Serial |
5 V |
±5/±12 V |
-5 V |
In-Line |
DIP16,.3 |
Other Converters |
1.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-3.12 V |
0.793 in (20.13 mm) |
2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Other |
No Lead |
24 |
DIE |
3 V |
Yes |
8 |
CMOS |
8 |
6 µs |
26 mA |
0.586 % |
Serial |
5 V |
5 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
25 °C (77 °F) |
-25 °C (-13 °F) |
Tin Lead |
Upper |
X-XUUC-N24 |
No |
e0 |
0 V |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Metal |
No |
1 |
ECL |
8 |
10 ns |
360 mA |
-5.2 V |
-5.2 V |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-MDIP-T24 |
No |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
10 |
0.05 % |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-XDIP-T16 |
No |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
18 V |
No |
1 |
Bipolar |
8 |
9.3 mA |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP18,.3 |
Other Converters |
1 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
10 |
2 mA |
0.05 % |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-XDIP-T16 |
No |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
3 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Complementary Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
1 mA |
0.025 % |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T16 |
No |
e0 |
Binary Coded Decimal |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
10 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
1 |
Hybrid |
10 |
0 ns |
8.33 mA |
0.05 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP16,.3 |
Other Converters |
375 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
0.75 in (19.05 mm) |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
8 |
0.2 % |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T16 |
No |
e0 |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
CMOS |
12 |
0.2 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
500 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-CDIP-T18 |
0.17 in (4.32 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.9 in (22.865 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Other |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
3 V |
Yes |
1 |
CMOS |
16 |
15 mA |
Serial |
5 V |
±5 V |
-5 V |
Small Outline |
SOP16,.4 |
Other Converters |
1.5 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-25 °C (-13 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
-3 V |
0.406 in (10.3 mm) |
2's Complement |
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Analog Devices |
Digital to Analog converter |
Other |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
16 |
14 mA |
Serial |
5 V |
5 V |
Small Outline |
SOP16,.4 |
Other Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-35 °C (-31 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.104 in (2.65 mm) |
0.299 in (7.6 mm) |
No |
e0 |
240 °C (464 °F) |
-1 V |
0.406 in (10.3 mm) |
2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
12 |
2 µs |
2.5 mA |
0.012 % |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-XDIP-T16 |
No |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
10 |
In-Line |
DIP28,.6 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T28 |
No |
e0 |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
1 |
BICMOS |
14 |
4 µs |
15 mA |
0.003 % |
5 V |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
2's Complement |
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Analog Devices |
Digital to Analog converter |
Other |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
3.06 V |
Yes |
2 |
BICMOS |
18 |
1 % |
Serial |
5 V |
-5 V |
Chip Carrier |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-25 °C (-13 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
-3.06 V |
0.453 in (11.5062 mm) |
2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Hybrid |
12 |
0.0122 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
Binary Coded Decimal |
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Analog Devices |
Digital to Analog converter |
Other |
2 |
BICMOS |
12 |
1.5 µs |
2 mA |
0.024 % |
12/15 V |
DIE OR CHIP |
Other Converters |
85 °C (185 °F) |
-25 °C (-13 °F) |
No |
Binary, Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Other |
Ball |
124 |
LBGA |
Square |
215 V |
Yes |
1 |
14 |
Serial |
5 V |
3/5,5 V |
-5 V |
Grid Array, Low Profile |
BGA124,14X14,40 |
Other Converters |
10 µs |
0.039 in (1 mm) |
85 °C (185 °F) |
-10 °C (14 °F) |
Tin Silver Copper |
Bottom |
S-XBGA-B124 |
3 |
0.067 in (1.7 mm) |
0.591 in (15 mm) |
No |
e1 |
260 °C (500 °F) |
2.5 V |
0.591 in (15 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
No Lead |
24 |
DIE |
Rectangular |
10 V |
Yes |
1 |
Bipolar |
12 |
4 µs |
23 mA |
0.0244 % |
Parallel, Word |
15 V |
±12/±15 V |
-15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
3 µs |
85 °C (185 °F) |
-25 °C (-13 °F) |
Upper |
R-XUUC-N24 |
No |
-10 V |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
3 V |
No |
2 |
BIMOS |
18 |
28 mA |
Serial |
5 V |
±5 V |
-5 V |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-3 V |
1.22 in (31 mm) |
2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Gull Wing |
64 |
QFP |
Plastic/Epoxy |
Yes |
32 |
16 |
20 µs |
0.048 % |
3/5,5 V |
Flatpack |
QFP64(UNSPEC) |
Other Converters |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
No |
e0 |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
No Lead |
68 |
HVQCCN |
Square |
7.5 V |
Yes |
1 |
BICMOS |
16 |
20 µs |
0.0244 % |
Serial |
5 V |
-3,3/5,5,8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC68,.4SQ,20 |
Other Converters |
20 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-XQCC-N68 |
0.031 in (0.8 mm) |
0.394 in (10 mm) |
No |
e0 |
-2.5 V |
0.394 in (10 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
No Lead |
68 |
HVQCCN |
Square |
10 V |
Yes |
1 |
BICMOS |
14 |
20 µs |
0.0244 % |
Serial |
5 V |
2.7/5,5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC68,.4SQ,20 |
Other Converters |
20 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-XQCC-N68 |
0.031 in (0.8 mm) |
0.394 in (10 mm) |
No |
e0 |
0 V |
0.394 in (10 mm) |
2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
0.05 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
500 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T18 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
Bipolar |
8 |
220 mA |
0.37 % |
Parallel, 8 Bits |
-5.2 V |
-5.2 V |
In-Line |
DIP24,.3 |
Other Converters |
7 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-20 °C (-4 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.203 in (30.545 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0061 % |
Parallel, Word |
12/15,GND/-0.3 V |
In-Line |
DIP28,.6 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
1 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
10 |
2 mA |
0.1 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
500 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
BICMOS |
14 |
20 µs |
0.0244 % |
Serial |
5 V |
2.7/5,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP64,.47SQ,20 |
Other Converters |
20 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G64 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.394 in (10 mm) |
2's Complement Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
68 |
QCCN |
Square |
Plastic/Epoxy |
Yes |
32 |
16 |
20 µs |
0.048 % |
3/5,5,10.5 V |
Chip Carrier |
LCC68,.4SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-N68 |
No |
e0 |
Binary |
||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
8 |
CMOS |
8 |
5 µs |
20 mA |
0.1953 % |
Parallel, 8 Bits |
12/15, GND/-5 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
1.25 in (31.75 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
12 |
2 µs |
2 mA |
0.049 % |
15 V |
15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-XDIP-T20 |
e0 |
Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
10 |
0.2 % |
Parallel, Word |
15 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
Offset Binary |
|||||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
68 |
HVQCCN |
Square |
7.5 V |
Yes |
1 |
BICMOS |
14 |
20 µs |
0.0244 % |
Serial |
5 V |
2.7/5,5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC68,.4SQ,20 |
Other Converters |
20 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-XQCC-N68 |
3 |
0.031 in (0.8 mm) |
0.394 in (10 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-2.5 V |
0.394 in (10 mm) |
2's Complement Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
68 |
QCCN |
Square |
Plastic/Epoxy |
Yes |
32 |
16 |
20 µs |
0.048 % |
3/5,5 V |
Chip Carrier |
LCC68,.4SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-N68 |
No |
e0 |
Binary |
||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
8 |
220 mA |
0.37 % |
Parallel, 8 Bits |
-5.2 V |
-5.2 V |
In-Line |
DIP24,.3 |
Other Converters |
4 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-20 °C (-4 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.25 in (31.75 mm) |
Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 mA |
0.2 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIE OR CHIP |
Other Converters |
500 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-GDIP-T18 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
Binary, Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
10 |
0.05 % |
Parallel, Word |
15 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-GDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
Offset Binary |
|||||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
56 |
HVQCCN |
Square |
10 V |
Yes |
1 |
BICMOS |
16 |
20 µs |
0.0244 % |
Serial |
5 V |
3/5,5,10.5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC56,.31SQ,20 |
Other Converters |
20 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-XQCC-N56 |
3 |
0.031 in (0.8 mm) |
0.315 in (8 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.315 in (8 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
68 |
HVQCCN |
Square |
10 V |
Yes |
1 |
BICMOS |
16 |
20 µs |
0.0244 % |
Serial |
5 V |
3/5,5,10.5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC68,.4SQ,20 |
Other Converters |
20 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-XQCC-N68 |
0.031 in (0.8 mm) |
0.394 in (10 mm) |
No |
e0 |
0 V |
0.394 in (10 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.