Other Digital-to-Analog Converters 1,129

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX5765AUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

-5 V

0.394 in (10 mm)

Binary

AD7226B/D

Analog Devices

Digital to Analog converter

Other

4

BICMOS

8

4 µs

24 mA

0.39 %

12/15, GND/-5 V

DIE OR CHIP

Other Converters

85 °C (185 °F)

-25 °C (-13 °F)

Binary

MP7645CQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T20

e0

Binary

MAX7533AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

0.2 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

MAX5763BUCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Flatpack, Low Profile, Fine Pitch

QFP64(UNSPEC)

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

0 V

0.394 in (10 mm)

Binary

MAX5763CUCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

QFP

Plastic/Epoxy

Yes

32

16

20 µs

0.048 %

3/5,5,10.5 V

Flatpack

QFP64(UNSPEC)

Other Converters

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

No

e0

Binary

MX7538BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-CDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary

MAX5775UCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

14

20 µs

0.0244 %

Serial

5 V

2.7/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-5 V

0.394 in (10 mm)

2's Complement Binary

MX7530LQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5018BIPB

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

Parallel, 8 Bits

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin Lead

Dual

R-PDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

Binary

MAX5764BUCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

7.5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

-3,3/5,5,8 V

Flatpack, Low Profile, Fine Pitch

QFP64(UNSPEC)

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-2.5 V

0.394 in (10 mm)

Binary

MAX5764CUCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

QFP

Plastic/Epoxy

Yes

32

16

20 µs

0.048 %

-3,3/5,5,8 V

Flatpack

QFP64(UNSPEC)

Other Converters

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

No

e0

Binary

MAX5774UTK+

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

7.5 V

Yes

1

BICMOS

14

20 µs

0.0244 %

Serial

5 V

2.7/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.394 in (10 mm)

2's Complement Binary

MAX5732BUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

MX7545AKIWP

Analog Devices

Digital to Analog converter

Other

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.024 %

5/15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin Lead

Dual

R-PDSO-G20

No

e0

Binary

MX7530KQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

2 mA

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5762AUCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP64(UNSPEC)

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

0 V

0.394 in (10 mm)

Binary

MAX5733AUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

0 V

0.315 in (8 mm)

Binary

MX7628KBQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

8

0.1953 %

Parallel, 8 Bits

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

MX7535AQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary, Offset Binary

MAX5765AUCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-5 V

0.394 in (10 mm)

Binary

MAX7533CQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

0.05 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

MX7531KD

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MAX5764CUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

QCCN

Square

Plastic/Epoxy

Yes

32

16

20 µs

0.048 %

-3,3/5,5,8 V

Chip Carrier

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-N68

No

e0

Binary

MAX5762BUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MAX5765BUCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-5 V

0.394 in (10 mm)

Binary

MAX5763AUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MAX5763AUCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5,10.5 V

Flatpack, Low Profile, Fine Pitch

QFP64(UNSPEC)

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

0 V

0.394 in (10 mm)

Binary

MX7534AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

1.5 µs

3 mA

0.0122 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-CDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

-10 V

Binary, Offset Binary

MX7542GBQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5734BUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

-2.5 V

0.315 in (8 mm)

Binary

MAX5732AUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

0 V

0.315 in (8 mm)

Binary

MAX5732BUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

MX7531LD

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MAX5735AUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

-5 V

0.315 in (8 mm)

Binary

MAX5882UXF+D

Analog Devices

Digital to Analog converter

Other

256

CGA

Square

Plastic/Epoxy

Yes

1

14

Parallel, Word

1.8 V

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-X256

30 s

260 °C (500 °F)

Binary

MX7531JQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7536BQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Offset Binary

MAX5775UTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

5 V

Yes

1

BICMOS

14

20 µs

0.0244 %

Serial

5 V

2.7/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

-5 V

0.394 in (10 mm)

2's Complement Binary

MX7538AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-CDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary

MAX7533BQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

0.1 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

MP7645BQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T20

e0

Binary

MAX5764AUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

-2.5 V

0.394 in (10 mm)

Binary

MX7530JQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

2 mA

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5735BUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

-5 V

0.315 in (8 mm)

Binary

MAX5018AIPG

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

220 mA

0.37 %

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP24,.3

Other Converters

7 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin Lead

Dual

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

Binary

MAX5764AUCB

Analog Devices

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Flatpack, Low Profile, Fine Pitch

QFP64(UNSPEC)

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-2.5 V

0.394 in (10 mm)

Binary

MAX5733AUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.