No Lead Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC8562SDSCR

Texas Instruments

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

100 kHz

1

16

10 µs

1.3 mA

0.0183 %

Serial

3.6 V

3/5 V

Chip Carrier

SOLCC10,.12,20

Other Converters

7 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Quad

S-PQCC-N10

2

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8562SDSCT

Texas Instruments

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

100 kHz

1

16

10 µs

1.3 mA

0.0183 %

Serial

3.6 V

3/5 V

Chip Carrier

SOLCC10,.12,20

Other Converters

7 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Quad

S-PQCC-N10

2

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC9881SRGERG4

Texas Instruments

Digital to Analog converter

Industrial

No Lead

24

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

18

1.5 mA

0.0011 %

Serial

5 V

2.7/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N24

2

0.039 in (1 mm)

0.157 in (4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary, 2's Complement Binary

LT3040EDD#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

15 V

Yes

2 μA

Small Outline, Thin Profile

SOLCC10,.12,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2606IDD#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2611IDD#TR

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2611IDD-1

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2611IDD-1#TR

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2626CDD

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2626CDD-1#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2626CDD-1#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2636IDE-LMI12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2636IDE-LMX12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2637IDE-LZ12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2641IDD-14#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0061 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N8

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

LTC2642IDD-12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

2.5 V

Yes

1

12

0.0122 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

LTC2654CUF-H12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.6 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2656IUFD-L12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2657IUFD-H12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2666CUH-12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

12

0.0076 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

Binary

LTC2666CUH-16#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

16

0.1221 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

Binary

LTC2666HUH-16#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

16

0.1221 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

Binary

LTC2666IUH-12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

12

0.0076 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

Binary

LTC2672IUH-12#PBF

Analog Devices

Digital to Analog Converter 12 bit

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

12

5.3 mA

0.09765625 %

Serial

5 V

-3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

3.5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

30 s

260 °C (500 °F)

0.197 in (5 mm)

Binary

LTC7106EDDB#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

10

HVSON

Rectangular

Plastic/Epoxy

Yes

1

CMOS

7

1.4 mA

1.25 %

Serial

3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.08,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N10

1

0.031 in (0.8 mm)

0.079 in (2 mm)

e3

260 °C (500 °F)

0.118 in (3 mm)

2's Complement

MAX5511ETC

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

8

7 μA

0.3906 %

Serial

2.7 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e0

245 °C (473 °F)

0.157 in (4 mm)

Binary

MAX5511ETC+

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

8

7 μA

0.3906 %

Serial

2.7 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

Binary

MAX5511ETC-T

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

8

7 μA

0.3906 %

Serial

2.7 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

0.157 in (4 mm)

Binary

MAX5511ETC+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

8

7 μA

0.3906 %

Serial

2.7 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

Binary

MAX5535ETC

Maxim Integrated

Digital to Analog Converter 12 bit

Industrial

No Lead

12

HVQCCN

Square

Yes

2

BICMOS

12

8 μA

0.1953 %

Parallel, Word

5 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e0

0.157 in (4 mm)

Binary, Offset Binary

MAX5535ETC+

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

2

BICMOS

12

8 μA

0.1953 %

Parallel, Word

5 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

Binary, Offset Binary

MAX5734AUTN+

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.315 in (8 mm)

Binary

MAX5734AUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

-2.5 V

0.315 in (8 mm)

Binary

MAX5735BUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

-5 V

0.315 in (8 mm)

Binary

MAX5735BUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.315 in (8 mm)

Binary

MAX5878EGK-D

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

16

0.0045 %

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e0

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX5878EGK+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

16

0.0045 %

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MCP4706A1T-E/MAY

Microchip Technology

Digital to Analog converter

Automotive

No Lead

6

HVSON

Square

Plastic/Epoxy

Yes

1

TS 16949

8

400 μA

0.3543 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

TSSOP6,.08

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N6

0.035 in (0.9 mm)

0.079 in (2 mm)

e4

0.079 in (2 mm)

Binary

PDAC63204RTET

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

250 kHz

1

12

200 μA

0.097656 %

Serial

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

20 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0 V

0.118 in (3 mm)

Binary

AD5361BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

AD5544ACPZ-1-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Yes

1

CMOS

16

9 μA

0.0061 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

900 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

Binary

AD5624BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5645RBCPZ-R2

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

5 µs

1.16 mA

0.0244 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

3.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5667RBCPZ-R2

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

5.5 V

Yes

1

CMOS

16

7 µs

0.0183 %

Serial

5 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5684RBCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

CMOS

12

7 µs

1.3 mA

0.0244 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

AD5696BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

16

8 µs

700 μA

0.0046 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5735ACPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

12 V

Yes

1

12

18 µs

11 mA

0.032 %

Serial

15 V

3/5,9/33 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

11 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-12 V

0.354 in (9 mm)

Binary

DAC128S085CISQX/NOPB

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

2.5 MHz

1

CMOS

12

8.5 µs

0.1953 %

Serial

3 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,20

Other Converters

8.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N16

1

0.033 in (0.85 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.