No Lead Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MX7547TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MAX5292ETE

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

3 V

Yes

1

BICMOS

10

6 µs

0.0977 %

Serial

3 V

2/3.3,3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

2.5 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N16

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e0

245 °C (473 °F)

0 V

0.157 in (4 mm)

Binary

MAX5888AEGK+TD

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

16

0.008 %

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Binary

MAX5633AETK

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

VQCCN

Square

7.6 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-3.25 V

0.394 in (10 mm)

Binary

MAX5875EGK+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

16

56 mA

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX5632UTK+

Analog Devices

Digital to Analog converter

Commercial Extended

No Lead

68

HVQCCN

Square

9.2 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

-4.5 V

0.394 in (10 mm)

Binary

MAX5582ETP+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

5.25 V

Yes

1

BICMOS

10

6 µs

4 mA

0.0977 %

Serial

3 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Other Converters

2.5 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

0 V

0.197 in (5 mm)

Binary

MAX5331UTK+

Analog Devices

Digital to Analog converter

Commercial Extended

No Lead

68

HVQCCN

Square

9.2 V

Yes

1

BICMOS

12

0.1 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

-4.5 V

0.394 in (10 mm)

Binary

MAX5898EGK+TD

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

16

Parallel, Word

1.8 V

1.8/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX5852ETL+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

-1 V

0.236 in (6 mm)

Complementary Binary

MAX9979KCTK+D

Analog Devices

Digital to Analog converter

Commercial

No Lead

68

HVQCCN

Square

Yes

1

BICMOS

16

Serial

9.75 V

-4.75 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Nickel Gold Palladium

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

30 s

260 °C (500 °F)

0.394 in (10 mm)

Binary

MAX5763CUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

QCCN

Square

Plastic/Epoxy

Yes

32

16

20 µs

0.048 %

3/5,5,10.5 V

Chip Carrier

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-N68

No

e0

Binary

MAX5851ETL+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Complementary Binary

MAX5888AEGK+

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

16

0.008 %

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Binary

MAX5621UTK+

Analog Devices

Digital to Analog converter

Commercial Extended

No Lead

68

HVQCCN

Square

9.2 V

Yes

1

BICMOS

16

42 mA

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-4.5 V

0.394 in (10 mm)

Binary

MAX5633UTK+

Analog Devices

Digital to Analog converter

Commercial Extended

No Lead

68

HVQCCN

Square

9.2 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

-4.5 V

0.394 in (10 mm)

Binary

MX7547SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MAX5774UTK+T

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

7.5 V

Yes

1

BICMOS

14

20 µs

0.0244 %

Serial

5 V

2.7/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.394 in (10 mm)

2's Complement Binary

MAX5581BETP+

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

5.25 V

Yes

1

BICMOS

12

6 µs

4 mA

0.0977 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

MAX5888EGK+TD

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

16

0.008 %

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Binary

MAX5294ETE

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

3 V

Yes

1

BICMOS

8

4 µs

0.1953 %

Serial

3 V

2/3.3,3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

2 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N16

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e0

0 V

0.157 in (4 mm)

Binary

MAX5584ETP+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

5.25 V

Yes

1

BICMOS

8

4 µs

4 mA

0.1953 %

Serial

3 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Other Converters

2 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

0 V

0.197 in (5 mm)

Binary

AD7533JC/D

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

UUC

Yes

1

CMOS

10

800 ns

0.2 %

Parallel, Word

15 V

Uncased Chip

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

MAX5853ETL+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

1

CMOS

10

46 mA

0.0977 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Binary

MX7537UE/883

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

2

BICMOS

38535Q/M;38534H;883B

12

1.5 µs

2 mA

0.012 %

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-XQCC-N28

No

e0

Binary, Offset Binary

MAX5762CUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

QCCN

Square

Plastic/Epoxy

Yes

32

16

20 µs

0.048 %

3/5,5 V

Chip Carrier

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-N68

No

e0

Binary

MAX5525ETC+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

VQCCN

Square

5.5 V

Yes

2

BICMOS

10

8 μA

0.3906 %

Parallel, Word

5 V

2/5 V

Chip Carrier, Very Thin Profile

LCC12,.16SQ,32

Other Converters

12 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary, Offset Binary

MAX5291AETE

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

3 V

Yes

1

BICMOS

12

6 µs

0.0244 %

Serial

3 V

2/3.3,3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N16

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e0

245 °C (473 °F)

0 V

0.157 in (4 mm)

Binary

MX7226TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

CMOS

8

4 µs

13 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

MAX5585ETP+

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

5.25 V

Yes

1

BICMOS

8

4 µs

4 mA

0.1953 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Other Converters

2 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

MAX5524ETC+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

VQCCN

Square

5.5 V

Yes

2

BICMOS

10

0.3906 %

Parallel, Word

5 V

Chip Carrier, Very Thin Profile

12 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary, Offset Binary

MX7549TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

2

CMOS

12

1.5 µs

3 mA

0.0122 %

Parallel, 4 Bits

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-XQCC-N20

No

e0

Binary

MX7845SE

Analog Devices

Digital to Analog converter

Industrial

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0488 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.451 in (11.4554 mm)

No

e0

-10 V

0.451 in (11.4554 mm)

Binary

MAX5530ETC+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

12

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

Binary

MAX5854ETL+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

10

0.0977 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Binary

DS4402N+T&R

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Square

Plastic/Epoxy

5 V

Yes

1

5

500 μA

3.125 %

Serial

4 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC14,.12,16

0.016 in (0.4 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5733BUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

MAX5510ETC+

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

8

5 μA

0.3906 %

Serial

2.7 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

Binary

MAX5763BUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MAX5581BETP+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

5.25 V

Yes

1

BICMOS

12

6 µs

4 mA

0.0977 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

0 V

0.197 in (5 mm)

Binary

MAX5765AUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

-5 V

0.394 in (10 mm)

Binary

MAX5184ETG+

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

HVQCCN

Square

.8 V

Yes

1

10

5 mA

0.1953 %

Parallel, Word

3 V

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16SQ,20

Other Converters

25 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N24

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

-.3 V

0.157 in (4 mm)

Binary

5962-89657013C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MAX5887EGK+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

14

0.8 %

Parallel, Word

3.3 V

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Binary

MAX5535ETC+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

2

BICMOS

12

8 μA

0.1953 %

Parallel, Word

5 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

Binary, Offset Binary

MAX5886EGK+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

12

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Binary

MAX5705BATB+

Analog Devices

Digital to Analog converter

Automotive

No Lead

10

HVSON

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

12

410 μA

0.0244 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.08,20

6.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-N10

1

0.031 in (0.8 mm)

0.079 in (2 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Offset Binary

MX7537SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.