Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
3.8 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
20 |
HVQCCN |
Square |
5.5 V |
Yes |
1 |
16 |
0.0046 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N20 |
3 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
3.25 V |
Yes |
1 |
14 |
0.0073 % |
Serial, Parallel, Word |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
11.5 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.236 in (6 mm) |
Binary, 2's Complement Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
14 |
HVSON |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
8 |
CMOS |
12 |
0.061 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
4.4 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-N14 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
3.8 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
14 |
HVSON |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
8 |
CMOS |
12 |
0.061 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
4.5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-N14 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
3.6 V |
Yes |
1 |
CMOS |
14 |
10 µs |
0.0244 % |
Serial |
3 V |
3.3,3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Other Converters |
8 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.354 in (9 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
DIE |
Yes |
1 |
BICMOS |
8 |
Parallel, 8 Bits |
5 V |
Uncased Chip |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
X-XUUC-N16 |
No |
Binary |
||||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
12 |
32 mA |
Parallel, Word |
15 V |
-15 V |
Chip Carrier |
50 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
10 |
VSON |
Square |
5.5 V |
Yes |
1 |
CMOS |
16 |
0.0183 % |
Serial |
5 V |
Small Outline, Very Thin Profile |
4 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-XDSO-N10 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
8 |
0.1953 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
3.5 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
8 |
VSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
0.0244 % |
Serial |
3 V |
Small Outline, Very Thin Profile |
8 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-N8 |
0.033 in (0.85 mm) |
0.118 in (3 mm) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
14 |
0.0061 % |
Parallel, Word |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
2 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10 V |
0.354 in (9 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.1 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
2 µs |
2.5 mA |
0.0122 % |
Parallel, 4 Bits |
5 V |
5 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
250 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
Binary, Offset Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
24 |
DIE |
Rectangular |
15 V |
Yes |
1 |
CMOS |
12 |
1 µs |
0.0244 % |
Parallel, Word |
5 V |
Uncased Chip |
Tin Lead |
Upper |
R-XUUC-N24 |
No |
e0 |
0 V |
Binary, Offset Binary |
|||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
14 |
0.0977 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
9 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
20 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
12 |
0.0244 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.6 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
12 |
HVSON |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
14 |
0.0977 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
9 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Dual |
R-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
1 V |
Yes |
1 |
12 |
Parallel, Word |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-XQCC-N72 |
0.039 in (1 mm) |
0.394 in (10 mm) |
No |
-1 V |
0.394 in (10 mm) |
Binary |
|||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
CMOS |
MIL-STD-883 |
8 |
Parallel, 8 Bits |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
180 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
Yes |
e4 |
0.35 in (8.89 mm) |
Binary, Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
9.9853 V |
Yes |
4 |
BICMOS |
MIL-STD-883 |
12 |
15 µs |
13 mA |
0.0366 % |
Parallel, Word |
15 V |
5/±15 V |
-15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
Yes |
e0 |
-9.9902 V |
0.45 in (11.43 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
12.6 V |
Yes |
1 |
14 |
20 µs |
0.012 % |
Serial |
15 V |
-15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
12 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
30 s |
260 °C (500 °F) |
-12.6 V |
0.197 in (5 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
10 |
HVSON |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
7 |
1.25 % |
Serial |
3.3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-N10 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
e3 |
0.118 in (3 mm) |
2's Complement |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
Yes |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
5 µs |
10 mA |
0.0244 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
2.5 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.09 in (2.29 mm) |
0.45 in (11.43 mm) |
No |
e0 |
-10 V |
0.45 in (11.43 mm) |
Binary, Offset Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
88 |
HVQCCN |
Square |
.75 V |
Yes |
1 |
11 |
Serial |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
20 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N88 |
3 |
0.035 in (0.9 mm) |
0.472 in (12 mm) |
e3 |
260 °C (500 °F) |
-.25 V |
0.472 in (12 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
5 V |
Yes |
1 |
BIMOS |
MIL-STD-883 Class B |
16 |
6 µs |
26 mA |
0.04 % |
Parallel, Word |
12 V |
±12 V |
-12 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
4 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
-5 V |
0.45 in (11.43 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.3 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.1 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
0.0244 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
3 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-XDSO-N10 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
20 |
DIE |
Rectangular |
10 V |
Yes |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
12 |
18 mA |
0.05 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
250 ns |
25 °C (77 °F) |
25 °C (77 °F) |
Tin Lead |
Upper |
R-XUUC-N20 |
No |
e0 |
-5 V |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
14 |
HVSON |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
8 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
4 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-N14 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
5.5 V |
Yes |
1 |
CMOS |
16 |
10 µs |
2.5 mA |
0.0488 % |
Serial |
3 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.16SQ,25 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
S-XQCC-N16 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
0 V |
0.157 in (4 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
8 |
HVSON |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
0.0015 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
1 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-N8 |
0.033 in (0.85 mm) |
0.118 in (3 mm) |
No |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
14 |
HVSON |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
8 |
CMOS |
8 |
0.1953 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
3.8 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-N14 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
3.6 V |
Yes |
1 |
CMOS |
12 |
8 µs |
0.0244 % |
Serial |
3 V |
3.3,3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Other Converters |
6 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.354 in (9 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
Yes |
1 |
BICMOS |
38535Q/M;38534H;883B |
16 |
9 µs |
5 mA |
0.0244 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
-10 V |
0.45 in (11.43 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1.25 V |
Yes |
1 |
CMOS |
10 |
0.0684 % |
Parallel, Word |
3.3 V |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Other Converters |
11 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N32 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e0 |
-1 V |
0.197 in (5 mm) |
Binary, 2's Complement Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
20 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
14 |
4 mA |
0.0977 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.16X.2,20 |
9 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic |
Yes |
1 |
BICMOS |
38535Q/M;38534H;883B |
16 |
6 µs |
26 mA |
0.04 % |
12 V |
±12 V |
-12 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-XQCC-N28 |
No |
Binary, Offset Binary |
|||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
8 |
HVSON |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
14 |
0.0061 % |
Serial |
3 V |
Small Outline |
1 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-N8 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
DIE |
Yes |
1 |
12 |
0.0122 % |
Parallel, Word |
5 V |
Uncased Chip |
600 ns |
Upper |
X-XUUC-N |
No |
Binary, Offset Binary |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.2 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
20 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
4 |
CMOS |
12 |
0.0244 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
2.4 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
20 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
12 |
0.0244 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.2 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
R-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
20 |
HVQCCN |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
4 |
CMOS |
16 |
0.0061 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
9.1 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
Yes |
1 |
Bipolar |
8 |
Parallel, 8 Bits |
5 V |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
Yes |
0 V |
0.35 in (8.89 mm) |
Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
12 |
Parallel, Word |
15 V |
-15 V |
Chip Carrier |
50 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.