Through-Hole Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD562KN/BCD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

0.05 %

5/15,-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

Binary Coded Decimal

DAC312FR

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

Bipolar

12

1 µs

18 mA

0.05 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP20,.3

Other Converters

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary, Offset Binary, 2's Complement Binary

M38510/11302SEX

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

8

0.1 %

Parallel, 8 Bits

15 V

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

0.75 in (19.05 mm)

Binary

AD7542JN/+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 µs

2.5 mA

0.024 %

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T16

e0

Binary

AD7530LN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.055 mm)

Binary

AD7521UQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

500 ns

2 mA

0.05 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7564BNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

4

BICMOS

12

10 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP28,.6

Other Converters

550 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.472 in (37.4 mm)

Binary

ADDAC85MIL-CBI-V

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD7249SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

2

BICMOS

12

0.0244 %

Serial

12 V

-12 V

In-Line

5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.248 in (6.3 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.78 in (19.81 mm)

Binary

DAC100BCQ3

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

Hybrid

10

0 ns

10 mA

0.1 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

375 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

0.75 in (19.05 mm)

Complementary Binary

5962-01-059-2587

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

8

0.19 %

5,-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

AD664JN-BIP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

13 V

No

4

BICMOS

12

10 µs

19 mA

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-13 V

1.472 in (37.4 mm)

Binary

LTC1454LCN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

2.54 V

No

2

CMOS

12

1.1 mA

0.1099 %

Serial

3 V

In-Line

14 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

0 V

0.77 in (19.558 mm)

Binary

AD7528SQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

38535Q/M;38534H;883B

8

400 ns

2 mA

0.39 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

Binary, Offset Binary

M38510/11301BEA

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

MIL-M-38510 Class B

8

135 ns

7.8 mA

0.1 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

85 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

-10 V

0.75 in (19.05 mm)

Binary

5962-8948104VA

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

10 V

No

1

CMOS

MIL-STD-883

12

0.0122 %

Parallel, Word

15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary

AD7245AAQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

CMOS

12

10 µs

12 mA

0.0183 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

In-Line

DIP24,.3

Other Converters

7 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

HDS-1250

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

.512 V

No

1

Hybrid

12

35 ns

54 mA

0.0122 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

60 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.215 in (5.457 mm)

0.6 in (15.24 mm)

No

e0

-.512 V

1.295 in (32.89 mm)

Binary, Offset Binary

AD7533UQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

10

800 ns

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

AD7840CQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

BICMOS

14

4 µs

15 mA

0.003 %

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

2's Complement

LTC8143FN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0244 %

Serial

5 V

In-Line

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T16

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

PM7524EQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

1

MOS

8

0 ns

1 mA

0.05 %

Parallel, 8 Bits

15 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary, Offset Binary

AD7538TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12 V

12/15,-0.3 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.28 in (32.51 mm)

Binary, Offset Binary

PM7226BR/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

4

BICMOS

38535Q/M;38534H;883B

8

5 µs

12 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

Binary

ADV7121JN30

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

10

125 mA

0.293 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD664AD-UNI

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

13 V

No

4

BICMOS

12

10 µs

19 mA

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

0 V

Binary

AD7391ANZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

10

0.1953 %

Serial

3 V

In-Line

70 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.389 in (9.88 mm)

Binary

AD7536SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

14

1.5 µs

4 mA

0.012 %

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Offset Binary

DAC8840FW

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

3 V

No

4

CMOS

8

6 µs

26 mA

0.3906 %

Serial

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

3.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-3 V

Offset Binary

LTC1664CN#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

0.2441 %

Serial

3 V

In-Line

19 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

0.3 in (7.62 mm)

e3

0.77 in (19.558 mm)

Binary

AD7846SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

BICMOS

38535Q/M;38534H;883B

16

9 µs

0.0244 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

DAC08AQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

MIL-STD-883

8

135 ns

7.8 mA

0.1 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

85 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

0.75 in (19.05 mm)

Binary

DAC8043BIHP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

0.0244 %

Serial

5 V

In-Line

250 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

Offset Binary

AD7840KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

BICMOS

14

4 µs

14 mA

0.0061 %

Serial, Parallel, Word

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-3 V

1.2 in (30.48 mm)

2's Complement Binary

DAC8212BV

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

1

CMOS

12

1 µs

2 mA

0.024 %

Parallel, Word

5 V

5/15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

0 V

Binary, Offset Binary

LTC1660CN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

8

10

0.2441 %

Serial

3 V

In-Line

30 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

Binary

ADDAC85-CCD-I

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

0.0122 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

0 V

Binary Coded Decimal

AD7848KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

MOS

12

4 µs

13 mA

0.012 %

Parallel, Word

5 V

±5 V

-5 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-3 V

1.472 in (37.4 mm)

2's Complement Binary

DAC8043BIFZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

0.0244 %

Serial

5 V

In-Line

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

AD7247JN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5 V

No

2

CMOS

12

10 µs

0.024 %

Parallel, Word

12 V

-12 V

In-Line

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.19 in (4.82 mm)

0.3 in (7.62 mm)

No

e0

-5 V

1.227 in (31.165 mm)

Binary

5962-01-076-7378

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.1 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

5962-01-117-1821

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

DAC8222BIGP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

12

2 mA

0.0122 %

Parallel, Word

5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

Binary

AD7548JN/+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

12

3 mA

0.024 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

e0

Binary

LTC1664CN#TR

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

0.2441 %

Serial

3 V

In-Line

19 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

0.3 in (7.62 mm)

e0

0.77 in (19.558 mm)

Binary

5962-01-229-7465

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

0.2 %

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T28

No

Binary

HDS-1240E

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

50 ns

110 mA

0.0125 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

Complementary Binary, Complementary Offset Binary

ADV101KN50

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

8

100 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.