Through-Hole Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC08Q

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

8

0 ns

7.8 mA

0.19 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

85 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

0.75 in (19.05 mm)

Binary

PM7543AQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5 V

In-Line

DIP16,.3

Other Converters

380 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary, Offset Binary

DAC100DDQ3

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

Hybrid

10

0 ns

10 mA

0.3 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

375 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

0.75 in (19.05 mm)

Complementary Binary

DAC01FY

Analog Devices

Digital to Analog converter

Military

Through-Hole

14

DIP

Rectangular

Ceramic, Glass-Sealed

11.89 V

No

1

Bipolar

6

3 µs

9.3 mA

0.391 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP14,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T14

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-11.89 V

0.765 in (19.43 mm)

Binary, 2's Complement Binary, 1's Complement Binary, Complementary Offset Binary

PM7541AFX

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

2

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, Offset Binary

AD7226KN/+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

4

BICMOS

8

20 µs

13 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

e0

Binary

5962-8850901XA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

Hybrid

38535Q/M;38534H;883B

12

8 µs

120 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD1864N

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

3 V

No

2

BIMOS

18

28 mA

Serial

5 V

±5 V

-5 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-3 V

1.22 in (31 mm)

2's Complement Binary

5962-01-232-1115

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

0.1 %

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

Binary

5962-8969701XX

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4 V

No

1

BICMOS

16

Parallel, Word

15 V

-15 V

In-Line

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

-3 V

Binary

5962-8965702LB

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

2 mA

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD9712BTQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

12

183 mA

0.0427 %

Parallel, Word

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD668AQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

.512 V

No

1

Bipolar

12

32 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.3

Other Converters

120 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-.512 V

Binary, Offset Binary

AD7542SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 µs

2.5 mA

0.0244 %

Parallel, Word

5 V

In-Line

2 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

LTC7541AJN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

In-Line

600 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T18

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Binary, Offset Binary

PM7524FP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

15 V

No

1

MOS

8

0 ns

1 mA

0.1 %

Parallel, 8 Bits

15 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.793 in (20.13 mm)

Binary, Offset Binary

MAX513MJD

Analog Devices

Digital to Analog converter

Military

Through-Hole

14

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

3.6 V

No

1

CMOS

8

0.5859 %

Serial

3 V

3/3.3 V

0 V

In-Line

DIP14,.3

Other Converters

70 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T14

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

0 V

Binary

MAX257DENG

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

18 mA

0.0244 %

Parallel, 8 Bits

5 V

-5 V

In-Line

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

Binary

MAX521BCPP+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

1

CMOS

8

20 mA

0.78 %

Serial

5 V

5 V

In-Line

DIP20,.3

Other Converters

6 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

1.03 in (26.16 mm)

Binary

MAX519ACPE+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5 V

No

2

BICMOS

8

5 mA

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

6 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MX7533JN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

800 ns

2 mA

0.1953 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

Binary, Offset Binary

MAX532BMJE/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883 Class B

12

0.0244 %

Serial

15 V

-15 V

In-Line

2.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

MX767BD

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

4 µs

12 mA

0.01 %

±12/±15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-XDIP-T24

e0

Binary, Offset Binary

AD565AJQ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

250 ns

23 mA

0.018 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

e0

Binary, Offset Binary

MX7226TQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

4

BICMOS

38535Q/M;38534H;883B

8

4 µs

13 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

Binary

MAX501MJG

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

12

Parallel, Word

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.25 in (31.75 mm)

Binary

MAX514BENG-T

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

1 µs

0.0244 %

Serial

5 V

In-Line

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary, 2's Complement Binary

MX7225UQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

4

BICMOS

38535Q/M;38534H;883B

8

4 µs

12 mA

0.2 %

12/15, GND/-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

Binary

MAX528EJP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

8

8

Serial

5 V

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T20

0.23 in (5.842 mm)

0.3 in (7.62 mm)

No

e0

0.95 in (24.13 mm)

Binary

MX7545SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2 mA

0.0488 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary, 2's Complement Binary

MX7547TQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

12

0.0122 %

Parallel, Word

In-Line

80 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Binary, Offset Binary, 2's Complement Binary

AM6012DM

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

Bipolar

12

15 V

±15 V

-15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

e0

Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary

5962-8780201RC

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

0.3906 %

Parallel, 8 Bits

15 V

-5 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Dual

R-GDIP-T20

No

e4

Binary

MX7548SQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

12

1 µs

3 mA

0.024 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

Binary

MX7228LN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

8

CMOS

8

5 µs

20 mA

0.1953 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0 V

1.203 in (30.545 mm)

Binary

MAX537AEPE+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

2.5 V

No

4

12

16 mA

0.0122 %

Serial

5 V

±5 V

-5 V

In-Line

DIP16,.3

Other Converters

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MX7837BN+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

2

BICMOS

12

10 mA

0.0122 %

Parallel, 8 Bits

12 V

±12/±15 V

-12 V

In-Line

DIP24,.3

Other Converters

4 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

1.25 in (31.75 mm)

Binary, Offset Binary

MAX530BCNG+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5.1 V

No

1

12

400 μA

0.0366 %

Parallel, Word

5 V

5/±5 V

-5 V

In-Line

DIP24(UNSPEC)

Other Converters

25 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-5.1 V

Binary, Offset Binary

MAX512CPD+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

1

CMOS

8

0.5859 %

Serial

5 V

5 V

0 V

In-Line

DIP14,.3

Other Converters

70 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T14

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.75 in (19.05 mm)

Binary

MX7543TQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary

MAX502AENG+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

12

5 µs

10 mA

0.018 %

±12/±15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

e3

30 s

260 °C (500 °F)

Binary, Offset Binary

MX7536KN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T28

1

0.175 in (4.445 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

Offset Binary

MAX510ACPE+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5 V

No

4

8

10 mA

0.024 %

Serial

5 V

5/±5 V

-5 V

In-Line

DIP16,.3

Other Converters

6 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.755 in (19.175 mm)

Binary

MX767SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

4 µs

12 mA

0.02 %

±12/±15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

e0

Binary, Offset Binary

AD566AKQ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

350 ns

20 mA

0.012 %

-15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

e0

Binary, Offset Binary

MX7531LQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5018BIPG

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

8

220 mA

0.37 %

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP24,.3

Other Converters

7 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin Lead

Dual

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

Binary

MX7628KTQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

8

0.1953 %

Parallel, 8 Bits

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.