Through-Hole Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MX7541KN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.9 in (22.86 mm)

Binary, Offset Binary

AD566AKN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

350 ns

20 mA

0.012 %

-15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

e0

Binary, Offset Binary

MX7534KN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

14

1.5 µs

3 mA

0.0061 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

1.03 in (26.16 mm)

Binary, Offset Binary

MAX536AEPE+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

10 V

No

4

12

25 mA

0.0122 %

Serial

15 V

12,-5 V

-5 V

In-Line

DIP16,.3

Other Converters

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MAX502BCNG-T

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

12

5 µs

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary

MAX506MJP

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

Parallel, 8 Bits

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.23 in (5.842 mm)

0.3 in (7.62 mm)

No

e0

0.95 in (24.13 mm)

Binary

MAX535BMJA

Analog Devices

Digital to Analog converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

CMOS

13

400 μA

0.0244 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

16 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

MAX526EPG

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

Parallel, Word

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

Binary

MX667SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

Bipolar

12

4 µs

12 mA

0.02 %

±12/±15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

e0

Binary, Offset Binary

MAX7533LN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

0.05 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T16

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

0.755 in (19.175 mm)

Offset Binary

MX7547KN-T

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

Binary, Offset Binary, 2's Complement Binary

MX7225LN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

8

4 µs

10 mA

0.1953 %

Parallel, Word

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Binary

MAX526DENG-T

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

0.0244 %

Parallel, Word

15 V

-5 V

In-Line

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

Binary

MAX501EJG

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

12

Parallel, Word

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T24

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.25 in (31.75 mm)

Binary

AD566ASQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

350 ns

20 mA

0.018 %

-15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

e0

Binary, Offset Binary

MX7531LD

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MX7545SQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2 mA

0.049 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

Binary

MAX534BEPE+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

1

CMOS

8

1.3 mA

0.7812 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

8 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MX7548TQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

12

1 µs

3 mA

0.012 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

Binary

AD566AJQ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

350 ns

20 mA

0.018 %

-15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

e0

Binary, Offset Binary

MX7545KN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 µs

2 mA

0.0244 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

Binary, Offset Binary, 2's Complement Binary

MX7837KN-T

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

2

12

10 mA

0.0122 %

Parallel, 8 Bits

12 V

-12 V

In-Line

4 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.25 in (31.75 mm)

Binary, Offset Binary

MX7545AUQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2 mA

0.012 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

Binary

MX7531JQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7536BQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Offset Binary

MAX501BMRG

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±12/±15 V

-15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

20 s

240 °C (464 °F)

Binary, Offset Binary

MAX536BCPE+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

10 V

No

4

12

25 mA

0.0244 %

Serial

15 V

12,-5 V

-5 V

In-Line

DIP16,.3

Other Converters

3 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MX7538AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-CDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary

AD566AJN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

350 ns

20 mA

0.018 %

-15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

e0

Binary, Offset Binary

MAX541CCPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2.5 V

No

1

CMOS

16

1.1 mA

0.0061 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Offset Binary

MAX7533BQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

0.1 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

MX7542JN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 µs

2.5 mA

0.0244 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

Binary, Offset Binary

MP7645BQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T20

e0

Binary

MAX543BEPA+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

500 μA

0.0244 %

Serial

5 V

5/15 V

In-Line

DIP8,.3

Other Converters

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

Binary, Offset Binary, 2's Complement Binary

MX767KENG

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

4 µs

12 mA

0.01 %

±12/±15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

e0

Binary, Offset Binary

MAX505EJG

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

Parallel, 8 Bits

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T24

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

Binary

MAX7645BCPP+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

2 mA

0.0244 %

Parallel, Word

5 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

Binary, 2's Complement Binary

MAX541BCPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2.5 V

No

1

CMOS

16

1.1 mA

0.0031 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Offset Binary

MX667KEPI

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

4 µs

12 mA

0.01 %

±12/±15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T28

e0

Binary, Offset Binary

MAX257CCNG

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

18 mA

0.0122 %

Parallel, 8 Bits

5 V

-5 V

In-Line

5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e0

Binary

MX7837KN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

2

BICMOS

12

10 mA

0.0122 %

Parallel, 8 Bits

12 V

±12/±15 V

-12 V

In-Line

DIP24,.3

Other Converters

4 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

1.25 in (31.75 mm)

Binary, Offset Binary

MX7530JQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

2 mA

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7538TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.6

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary

MAX5018AIPG

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

220 mA

0.37 %

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP24,.3

Other Converters

7 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin Lead

Dual

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

Binary

MAX549AEPA+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

2

8

Serial

In-Line

4 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

MAX7645ACPP+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, Word

5 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

Binary, 2's Complement Binary

MX7537UQ/HR

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

2

BICMOS

MIL-STD-883 Class B (Modified)

12

1.5 µs

2 mA

0.012 %

12/15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary

MAX501BCNG+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±12/±15 V

-15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.25 in (31.75 mm)

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.