Maxim Integrated Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX506BEPP

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

5 V

No

4

CMOS

8

10 mA

Parallel, 8 Bits

5 V

5,GND/-5 V

-5.5 V

In-Line

DIP20,.3

Other Converters

6 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

-5.5 V

1.03 in (26.16 mm)

Binary

MX7224UD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

2 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

0 V

Offset Binary

MAX5250BEAP-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

10

980 μA

0.0977 %

Serial

5 V

5 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

10 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX5583ETP

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

5.25 V

Yes

1

BICMOS

10

6 µs

4 mA

0.0977 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Other Converters

2.5 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

245 °C (473 °F)

0 V

0.197 in (5 mm)

Binary

MX7541ATQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883 Class B

12

2 mA

0.012 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.96 in (24.38 mm)

Offset Binary

MAX532AMWE/PR3-T

Maxim Integrated

Digital to Analog converter

12

MX7225KEWG+T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

8

4 µs

10 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Small Outline

SOP24,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

Binary

MAX5156ACPE

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

2

CMOS

12

650 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

0.755 in (19.175 mm)

Binary

MX7535JCWI+T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

-10 V

0.705 in (17.9 mm)

Binary, Offset Binary

MX7226K/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

20

DIE

Rectangular

Yes

4

CMOS

8

0.3906 %

Parallel, 8 Bits

15 V

-5 V

Uncased Chip

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

Binary

MAX519ACSE

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

2

BICMOS

8

5 mA

Serial

5 V

5 V

Small Outline

SOP16,.25

Other Converters

6 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

0 V

0.39 in (9.9 mm)

Binary

MAX5480BEEE-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 μA

0.1953 %

Parallel, 8 Bits

5 V

5 V

Small Outline, Shrink Pitch

SSOP16,.25

Other Converters

250 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

20 s

240 °C (464 °F)

0.193 in (4.89 mm)

Binary

MX7545TQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2 mA

0.0244 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary, 2's Complement Binary

MX7225KEWG

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

8

4 µs

10 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Small Outline

SOP24,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

Binary

MX7534JCWP

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

1.5 µs

3 mA

0.0122 %

Parallel, 8 Bits

12/15,GND/-0.3 V

Small Outline

SOP20,.4

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

-10 V

0.504 in (12.8 mm)

Binary, Offset Binary

MX7528JP-T

Maxim Integrated

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

8

400 ns

1 mA

0.3906 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

0.353 in (8.965 mm)

Binary

MAX5204BEUB+

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

1.5 mA

0.061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

25 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Offset Binary

MX7845KN-T

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

12

0.0183 %

Parallel, Word

15 V

-15 V

In-Line

2.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary

MAX5531ETC

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

12

7 μA

0.1953 %

Serial

3 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e0

245 °C (473 °F)

0.157 in (4 mm)

Binary

MAX532AEWE

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

12.5 V

Yes

2

CMOS

12

10 mA

0.0122 %

Serial

15 V

±12/±15 V

-15 V

Small Outline

SOP16,.4

Other Converters

2.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

20 s

240 °C (464 °F)

-12.5 V

0.406 in (10.3 mm)

Binary

MAX520C/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

16

DIE

Rectangular

Yes

4

8

Serial

5 V

Uncased Chip

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N16

No

e0

Binary

MAX5441AEUA

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

16

200 μA

0.0031 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

MAX5230BEEE

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

BICMOS

12

475 μA

0.0244 %

Serial

3 V

3/3.3 V

Small Outline, Shrink Pitch

SSOP16,.25

Other Converters

10 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

0 V

0.193 in (4.89 mm)

Binary

MAX5230AEEE-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

BICMOS

12

475 μA

0.0122 %

Serial

3 V

3/3.3 V

Small Outline, Shrink Pitch

SSOP16,.25

Other Converters

10 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

20 s

240 °C (464 °F)

0 V

0.193 in (4.89 mm)

Binary

MAX541ACSA

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

1.1 mA

0.0015 %

Serial

5 V

5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

0 V

0.193 in (4.9 mm)

Offset Binary

MAX5762AUTK

Maxim Integrated

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MAX5876EGK+D

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

12

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX531AESD

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

4.8 V

Yes

1

CMOS

12

0.0122 %

Serial

5 V

±5 V

-5 V

Small Outline

SOP14,.25

Other Converters

25 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G14

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

-4.8 V

0.341 in (8.65 mm)

Binary

MAX550BEUA

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

8

10 μA

0.35 %

Serial

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

4 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MX7845KP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

-10 V

0.453 in (11.505 mm)

Binary

MX7845JR-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

Small Outline

SOP24,.4

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

-10 V

0.606 in (15.4 mm)

Binary

MX7533LP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

10

800 ns

2 mA

0.05 %

Parallel, Word

15 V

15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

0.353 in (8.965 mm)

Binary, Offset Binary

MX7541AJ/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

Uncased Chip

DIE OR CHIP

Other Converters

600 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

1

No

e0

Binary, Offset Binary

MX7543GKCWE-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

Small Outline

SOP16,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.406 in (10.3 mm)

Binary, Offset Binary

MAX520BCPE+

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

1

CMOS

8

20 μA

0.39 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

2 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MX7541AJN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

Binary, Offset Binary

MAX502ACWG

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

1

12

5 µs

10 mA

0.0732 %

Parallel, Word

15 V

±12/±15 V

-15 V

Small Outline

SOP24,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.606 in (15.4 mm)

Binary, Offset Binary

MX7537JP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

245 °C (473 °F)

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MAX520ACPE

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

1

CMOS

8

20 μA

0.39 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

2 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

0.755 in (19.175 mm)

Binary

MX7542KP-T

Maxim Integrated

Digital to Analog converter

12

Matte Tin

1

e3

Binary

MAX5631UTK+T

Maxim Integrated

Digital to Analog converter

Commercial Extended

No Lead

68

HVQCCN

Square

9.2 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

-4.5 V

0.394 in (10 mm)

Binary

MAX525AMJP

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

CMOS

12

980 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP20,.3

Other Converters

12 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

Binary, Offset Binary

MAX526CEWG+T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

12

28 mA

0.0122 %

Parallel, Word

15 V

15,-5 V

-5 V

Small Outline

SOP24,.4

Other Converters

3 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

Binary

MAX542BC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

14

DIE

Rectangular

2.5 V

Yes

1

CMOS

16

0.0031 %

Serial

5 V

Uncased Chip

1 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N14

1

No

e0

0 V

Offset Binary

MAX5721EUA-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

10

10 µs

215 μA

0.3906 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

4 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX552BCUB-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

Yes

1

12

1 µs

500 μA

0.0244 %

Serial

3 V

3/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

120 ns

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

Offset Binary

MAX542CCPD

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

2.5 V

No

1

CMOS

16

1.1 mA

0.0061 %

Serial

5 V

5 V

In-Line

DIP14,.3

Other Converters

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T14

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Offset Binary

MX7228KEWG+

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

8

CMOS

8

0.3906 %

Parallel, 8 Bits

15 V

-5 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0 V

0.606 in (15.4 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.