Maxim Integrated Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX5231BEEE-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

525 μA

0.0244 %

Serial

5 V

5 V

Small Outline, Shrink Pitch

SSOP16,.25

Other Converters

10 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G16

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

20 s

240 °C (464 °F)

0 V

0.193 in (4.89 mm)

Binary

MAX5150AEPE

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

2

CMOS

13

650 μA

0.0061 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.755 in (19.175 mm)

Binary

MAX5294EUD

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

BICMOS

8

4 µs

0.1953 %

Serial

3 V

2/3.3,3/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

Other Converters

2 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G14

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

245 °C (473 °F)

0 V

0.197 in (5 mm)

Binary

MAX5622UCB

Maxim Integrated

Digital to Analog converter

Commercial Extended

Gull Wing

64

LFQFP

Square

9.2 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-4.5 V

0.394 in (10 mm)

Binary

MAX5734CETN

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0977 %

Serial

5 V

3/5,3/8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N56

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

-2.5 V

0.315 in (8 mm)

Binary

MX7845BEWG

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

Small Outline

SOP24,.4

Other Converters

2.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

-10 V

0.606 in (15.4 mm)

Binary

MAX5382MEUK

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

5

LSSOP

Rectangular

Plastic/Epoxy

Yes

1

8

0.3906 %

Serial

5 V

Small Outline, Low Profile, Shrink Pitch

20 µs

0.037 in (0.95 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G5

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e0

245 °C (473 °F)

0.114 in (2.9 mm)

Binary

MAX535ACUA-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

13

400 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

16 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX5887EGK-TD

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

14

0.8 %

Parallel, Word

3.3 V

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N68

0.035 in (0.9 mm)

0.394 in (10 mm)

No

-.5 V

0.394 in (10 mm)

Binary

MX7523JN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

200 ns

100 μA

0.1953 %

Parallel, 8 Bits

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0.755 in (19.175 mm)

Binary, Offset Binary

MAX5253AEPP+

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

CMOS

12

980 μA

0.0122 %

Serial

3 V

3.3 V

In-Line

DIP20,.3

Other Converters

16 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

0 V

1.03 in (26.16 mm)

Binary, Offset Binary

MX7845BQ

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

BICMOS

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T24

1

No

e0

-10 V

Binary

MX7548JEPP

Maxim Integrated

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

3 mA

0.0244 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

DIP20,.3

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.177 in (4.496 mm)

0.354 in (8.992 mm)

No

e0

0.354 in (8.992 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5734BCTN

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0244 %

Serial

5 V

3/5,3/8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

-2.5 V

0.315 in (8 mm)

Binary

MX7545BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2 mA

0.0244 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

Binary, Offset Binary, 2's Complement Binary

MAX518AEPA

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

2

BICMOS

8

6 mA

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

6 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

0.369 in (9.375 mm)

Binary

MX7524LP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

0.353 in (8.965 mm)

Binary, Offset Binary

MAX5631AECB-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

7.6 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

-3.25 V

0.394 in (10 mm)

Binary

MX7228BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

8

CMOS

8

5 µs

38 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

1.25 in (31.75 mm)

Binary

MAX505ACAG-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

5 V

Yes

4

CMOS

8

10 mA

Parallel, 8 Bits

5 V

5,GND/-5 V

-5.5 V

Small Outline, Shrink Pitch

SSOP24,.3

Other Converters

6 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

-5.5 V

0.323 in (8.2 mm)

Binary

MAX5874EGK-TD

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

14

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e0

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MX7536KP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

0.453 in (11.505 mm)

Offset Binary

MAX5622UCB-TD

Maxim Integrated

Digital to Analog converter

Commercial Extended

Gull Wing

64

LFQFP

Square

9.2 V

Yes

1

BICMOS

16

42 mA

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

-4.5 V

0.394 in (10 mm)

Binary

MX7543SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0244 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX541CESA-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

1.1 mA

0.0061 %

Serial

5 V

5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

0 V

0.193 in (4.9 mm)

Offset Binary

MAX514AEWI

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

12

1 µs

50 mA

0.02441 %

Serial

5 V

Small Outline

250 ns

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

No

e0

20 s

240 °C (464 °F)

Binary

MAX5839AEMH

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

9 V

Yes

1

13

0.0244 %

Parallel, Word

14 V

-9,5,14 V

-9 V

Flatpack

QFP44,.5SQ,32

Other Converters

22 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G44

1

0.094 in (2.388 mm)

0.394 in (10.0075 mm)

No

e0

245 °C (473 °F)

-4 V

0.394 in (10.0075 mm)

Offset Binary, 2's Complement Binary

MAX547AEQH-D

Maxim Integrated

Digital to Analog converter

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0244 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e0

245 °C (473 °F)

-4.5 V

0.653 in (16.585 mm)

Offset Binary

MX7521JQ

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.96 in (24.38 mm)

Binary, Offset Binary

MX7549KP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCN

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

3 mA

0.0122 %

Parallel, 4 Bits

15 V

15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

No

e0

Binary

MAX518BC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

8

DIE

Rectangular

5 V

Yes

2

8

Serial

5 V

Uncased Chip

6 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N8

1

No

e0

0 V

Binary

MAX5235BEUB-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

0.0244 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

10 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX5153ACEE-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

13

600 μA

0.0122 %

Serial

3 V

3/3.3 V

Small Outline, Shrink Pitch

SSOP16,.25

Other Converters

16 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0.193 in (4.89 mm)

Binary

MAX5885EGM

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

1.1 V

Yes

1

CMOS

16

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e0

245 °C (473 °F)

-.5 V

0.276 in (7 mm)

Binary

MAX5175AEEE-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

12

0.0244 %

Serial

5 V

Small Outline, Shrink Pitch

12 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0 V

0.193 in (4.9 mm)

Binary

MAX500AEWE

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

8

4.5 µs

22 mA

0.1953 %

Serial

15 V

11.4/16.5,GND/-5 V

-5 V

Small Outline

SOP16,.4

Other Converters

2.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0 V

0.406 in (10.3 mm)

Binary

MAX528CAG

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

2.25 V

Yes

8

BICMOS

8

3 µs

9 mA

0.3906 %

Serial

12 V

12,GND/-5 V

-5 V

Small Outline, Shrink Pitch

SSOP24,.24

Other Converters

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

0 V

0.323 in (8.2 mm)

Binary

MAX505BEAG/CEG

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

Parallel, 8 Bits

5 V

-5 V

Small Outline, Shrink Pitch

6 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G24

0.078 in (1.99 mm)

0.208 in (5.29 mm)

-5.5 V

0.303 in (7.7 mm)

Binary

MX7224LP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

2 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

0 V

0.353 in (8.965 mm)

Offset Binary

MAX5623UTK-T

Maxim Integrated

Digital to Analog converter

Commercial Extended

No Lead

68

HVQCCN

Square

9.2 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

-4.5 V

0.394 in (10 mm)

Binary

MX7541JN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

0.02441 %

Serial

15 V

In-Line

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T18

1

No

e0

Binary

MX7248JP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

-5 V

0.353 in (8.965 mm)

Binary

MAX5102AEUE-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

8

360 μA

0.3906 %

Parallel, 8 Bits

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

6 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

0 V

0.197 in (5 mm)

Binary

MAX536ACPE

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

10 V

No

4

CMOS

12

0.0122 %

Serial

15 V

12/15,-5 V

-5 V

In-Line

DIP16,.3

Other Converters

3 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

0.755 in (19.175 mm)

Binary

MAX517AESA-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

BICMOS

8

3.5 mA

Serial

5 V

5 V

Small Outline

SOP8,.25

Other Converters

6 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0 V

0.193 in (4.9 mm)

Binary

MX7524KEPE-T

Maxim Integrated

Digital to Analog converter

8

MX7549SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

12

1.5 µs

3 mA

0.0244 %

Parallel, 4 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

e0

Binary

MAX544BESA-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

14

1.1 mA

0.0031 %

Serial

5 V

5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

20 s

240 °C (464 °F)

0 V

0.193 in (4.9 mm)

Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.