Maxim Integrated Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX521BCAG-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

20 mA

0.78 %

Serial

5 V

5 V

Small Outline, Shrink Pitch

SSOP24,.3

Other Converters

6 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

0 V

0.323 in (8.2 mm)

Binary

MAX527CCWG+T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

12

18 mA

0.0122 %

Parallel, Word

5 V

±5 V

-5 V

Small Outline

SOP24,.4

Other Converters

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

Binary

MX7520JD

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

2 mA

0.2 %

Parallel, Word

15 V

In-Line

DIP16,.3

500 ns

3.937 in (100 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold with Nickel barrier

Dual

R-GDIP-T16

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e4

0.84 in (21.34 mm)

Binary, Offset Binary

MAX5158EPE

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

2

CMOS

10

600 μA

0.0977 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.755 in (19.175 mm)

Binary

MAX5158MJE

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5.5 V

No

2

CMOS

10

600 μA

0.0977 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

0 V

Binary

MAX500ACWE

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

8

4.5 µs

22 mA

0.1953 %

Serial

15 V

11.4/16.5,GND/-5 V

-5 V

Small Outline

SOP16,.4

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0 V

0.406 in (10.3 mm)

Binary

MX7524UQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5853ETL+TGH7

Maxim Integrated

Digital to Analog converter

10

Matte Tin

1

e3

30 s

260 °C (500 °F)

MAX509BC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

5 V

Yes

4

8

10 mA

0.037 %

Serial

5 V

5/±5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

6 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

1

No

e0

-5 V

Binary

MX7545AK/D-T

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

20

DIE

Rectangular

Yes

1

CMOS

12

0.0122 %

Parallel, Word

5 V

Uncased Chip

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

Binary, 2's Complement Binary

MX7545KP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.024 %

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

No

e0

Binary

MX7524JC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

20

DIE

Rectangular

Yes

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Uncased Chip

DIE OR CHIP

Other Converters

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

Binary, Offset Binary

MAX501ACWG+

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

1

12

5 µs

10 mA

0.0732 %

Parallel, Word

15 V

±12/±15 V

-15 V

Small Outline

SOP24,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

Binary, Offset Binary

MX7547LEWG

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Small Outline

SOP24,.4

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

Binary, Offset Binary, 2's Complement Binary

MX7548KCWP

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

3 mA

0.0122 %

Parallel, 8 Bits

5 V

5/15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.104 in (2.642 mm)

0.302 in (7.67 mm)

No

e0

245 °C (473 °F)

0.512 in (13.005 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5858ECM+D

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

48

HTFQFP

Square

Plastic/Epoxy

1.25 V

Yes

1

CMOS

10

0.1221 %

Parallel, Word

3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.276 in (7 mm)

Binary

MX7847BN+

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

2

BICMOS

12

10 mA

0.0122 %

Parallel, Word

12 V

±12/±15 V

-12 V

In-Line

DIP24,.3

Other Converters

4 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T24

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

1.25 in (31.75 mm)

Binary, Offset Binary

MX7537J/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

24

DIE

Rectangular

Yes

2

CMOS

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

Uncased Chip

DIE OR CHIP

Other Converters

800 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N24

1

No

e0

Binary, Offset Binary, 2's Complement Binary

MAX5512EUA-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

2

BICMOS

8

6 μA

0.3906 %

Parallel, 8 Bits

5 V

2/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

660 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

Binary, Offset Binary

MAX5331UCB

Maxim Integrated

Digital to Analog converter

Commercial Extended

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

9.2 V

Yes

1

BICMOS

12

0.1 %

Serial

10 V

-4,5,10 V

-4 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-4.5 V

0.394 in (10 mm)

Binary

MAX542AEPD

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

2.5 V

No

1

CMOS

16

1.1 mA

0.0015 %

Serial

5 V

5 V

In-Line

DIP14,.3

Other Converters

1 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T14

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Offset Binary

MX7538JEWG

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,-0.3 V

Small Outline

SOP24,.4

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

Binary

MAX5202AEUB-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

10

SOP

Square

Plastic/Epoxy

3.6 V

Yes

1

BICMOS

16

50 mA

0.030517 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

25 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX5633AEGK-T

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

68

VQCCN

Square

Ceramic, Metal-Sealed Cofired

7.6 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4 V

Chip Carrier, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-CQCC-N68

0.039 in (1 mm)

0.394 in (10 mm)

No

e0

-3.25 V

0.394 in (10 mm)

Binary

MAX521BEWG

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

24 mA

0.78 %

Serial

5 V

5 V

Small Outline

SOP24,.4

Other Converters

6 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0 V

0.606 in (15.4 mm)

Binary

MX7543GKEWE-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

Small Outline

SOP16,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.406 in (10.3 mm)

Binary, Offset Binary

MAX500AEJE

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

8

4.5 µs

22 mA

0.1953 %

Serial

15 V

11.4/16.5,GND/-5 V

-5 V

In-Line

DIP16,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

0 V

Binary

MAX514BCWI

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

12

1 µs

50 mA

0.02441 %

Serial

5 V

Small Outline

250 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

No

e0

20 s

240 °C (464 °F)

Binary

MX7531JC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

Uncased Chip

500 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Binary, Offset Binary

MAX5351BCUA

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

3.3 V

Yes

1

CMOS

13

400 μA

0.0244 %

Serial

3.3 V

3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

16 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX5185BEEI-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

10

0.1953 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

-.3 V

0.389 in (9.89 mm)

Binary

MAX7645BCPP-T

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

Binary, 2's Complement Binary

MAX5812LEUT

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

0.3906 %

Serial

5 V

Small Outline, Low Profile, Shrink Pitch

4 µs

0.037 in (0.95 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e0

245 °C (473 °F)

0 V

0.114 in (2.9 mm)

Binary

MX7533KN+

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

800 ns

2 mA

0.0977 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

Binary, Offset Binary

MAX5631UTK

Maxim Integrated

Digital to Analog converter

Commercial Extended

No Lead

68

HVQCCN

Square

9.2 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-4.5 V

0.394 in (10 mm)

Binary

MX7226KEWP

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

8

4 µs

13 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.504 in (12.8 mm)

Binary

MAX5190BEEG

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

8

0.3906 %

Parallel, 8 Bits

3 V

3 V

Small Outline, Shrink Pitch

SSOP24,.24

Other Converters

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

-.3 V

0.341 in (8.65 mm)

Binary

MAX5353ACUA

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

3.3 V

Yes

1

CMOS

12

400 μA

0.0244 %

Serial

3.3 V

3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

14 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX530BCNG

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5.1 V

No

1

12

400 μA

0.0366 %

Parallel, Word

5 V

5/±5 V

-5 V

In-Line

DIP24(UNSPEC)

Other Converters

25 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

-5.1 V

Binary, Offset Binary

MAX5443BEUA+T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

16

200 μA

0.0061 %

Serial

3 V

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

MX7520UD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

2 mA

0.05 %

Parallel, Word

15 V

In-Line

DIP16,.3

500 ns

3.937 in (100 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e4

0.84 in (21.34 mm)

Binary, Offset Binary

MAX5235AEUB

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

450 μA

0.0122 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

10 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX534BC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

16

DIE

5.5 V

Yes

1

CMOS

8

0.7812 %

Serial

5 V

Uncased Chip

8 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

X-XUUC-N

No

e0

0 V

Binary

MAX5181BEEG

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

10

0.1953 %

Parallel, Word

3 V

3 V

Small Outline, Shrink Pitch

SSOP24,.24

Other Converters

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

-.3 V

0.341 in (8.65 mm)

Binary

MX7545JP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.049 %

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

No

e0

Binary

5962-9452701MEA

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

8

Serial

15 V

-5 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

Binary

MX7245SE

Maxim Integrated

Digital to Analog converter

Military

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Small Outline

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

-5 V

0.606 in (15.4 mm)

Binary

MX7224C/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

2 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.