292 Other Function Consumer ICs 16

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Part RoHS Manufacturer General IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Bandwidth Maximum Supply Current Channel Separation Maximum Reading Time Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Gain Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Nominal Output Power Maximum Seated Height Width Qualification Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Nominal Noise Figure Length Demodulation Type

PNX1301EH,557

NXP Semiconductors

CONSUMER CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

GRID ARRAY

BGA292,20X20,50

Other Consumer ICs

1.27 mm

BOTTOM

S-PBGA-B292

Not Qualified

935266917557

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

292

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

1200 mA

GRID ARRAY, HEAT SINK/SLUG

1.27 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B292

2.625 V

2.55 mm

27 mm

Not Qualified

2.375 V

ALSO REQUIRES CORE SUPPLY OF 2.5 V, 1.2 A

27 mm

PTM1300FBEA

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

292

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

1200 mA

GRID ARRAY, HEAT SINK/SLUG

1.27 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B292

2.625 V

2.55 mm

27 mm

Not Qualified

2.375 V

ALSO REQUIRES CORE SUPPLY OF 2.5 V, 1.2 A

27 mm

935266871557

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

292

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

1200 mA

GRID ARRAY, HEAT SINK/SLUG

1.27 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B292

2.625 V

2.55 mm

27 mm

Not Qualified

2.375 V

ALSO REQUIRES CORE SUPPLY OF 2.5 V, 1.2 A

27 mm

PNX1311EH,557

NXP Semiconductors

CONSUMER CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

2.2,3.3

GRID ARRAY

BGA292,20X20,50

Other Consumer ICs

1.27 mm

BOTTOM

S-PBGA-B292

Not Qualified

PNX1300EH/G,557

NXP Semiconductors

CONSUMER CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

GRID ARRAY

BGA292,20X20,50

Other Consumer ICs

1.27 mm

BOTTOM

S-PBGA-B292

Not Qualified

PTM1300GBEA

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

292

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

1200 mA

GRID ARRAY, HEAT SINK/SLUG

1.27 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B292

2.625 V

2.55 mm

27 mm

Not Qualified

2.375 V

27 mm

PNX1300EH,557

NXP Semiconductors

CONSUMER CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

GRID ARRAY

BGA292,20X20,50

Other Consumer ICs

1.27 mm

BOTTOM

S-PBGA-B292

Not Qualified

PNX1302EH/G,557

NXP Semiconductors

CONSUMER CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

GRID ARRAY

BGA292,20X20,50

Other Consumer ICs

1.27 mm

BOTTOM

S-PBGA-B292

Not Qualified

935268386557

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

292

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

1200 mA

GRID ARRAY, HEAT SINK/SLUG

1.27 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B292

2.625 V

2.55 mm

27 mm

Not Qualified

2.375 V

27 mm

PTM1300AEBEA

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

292

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

1200 mA

GRID ARRAY, HEAT SINK/SLUG

1.27 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B292

2.625 V

2.55 mm

27 mm

Not Qualified

2.375 V

ALSO REQUIRES CORE SUPPLY OF 2.5 V, 1.2 A

27 mm

PNX1302EH,557

NXP Semiconductors

CONSUMER CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

GRID ARRAY

BGA292,20X20,50

Other Consumer ICs

1.27 mm

BOTTOM

S-PBGA-B292

Not Qualified

PNX1301EH/G,557

NXP Semiconductors

CONSUMER CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

GRID ARRAY

BGA292,20X20,50

Other Consumer ICs

1.27 mm

BOTTOM

S-PBGA-B292

Not Qualified

PNX1311EH/G,557

NXP Semiconductors

CONSUMER CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

2.2,3.3

GRID ARRAY

BGA292,20X20,50

Other Consumer ICs

1.27 mm

BOTTOM

S-PBGA-B292

Not Qualified

MC149570/D

NXP Semiconductors

CONSUMER CIRCUIT

COMMERCIAL

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

1.27 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B292

3.6 V

2.65 mm

27 mm

Not Qualified

3 V

27 mm

MC149570

NXP Semiconductors

CONSUMER CIRCUIT

COMMERCIAL

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

1

450 mA

3.3

GRID ARRAY

BGA292,20X20,50

Other Consumer ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B292

3.6 V

2.65 mm

27 mm

Not Qualified

3 V

e0

27 mm

Other Function Consumer ICs

Other function consumer ICs are a broad category of electronic components that provide a variety of specialized functions in consumer electronics products. These ICs are used in a wide range of applications, including entertainment systems, home automation, and mobile devices.

Other function consumer ICs can be classified into several types based on the specific functions they provide. Some of the most common types of other function consumer ICs include:

1. Power management ICs - These ICs are designed to manage the power supply in electronic devices, providing a way to regulate voltage, current, and power consumption.

2. Memory ICs - These ICs are used to store and retrieve data in electronic devices, such as smartphones, computers, and digital cameras.

3. Sensor ICs - These ICs are used to detect physical phenomena, such as temperature, pressure, and motion, and convert them into electrical signals that can be processed by other electronic components.

4. Interface ICs - These ICs are used to provide a connection between different electronic components or devices, such as USB, HDMI, and Ethernet interfaces.

Other function consumer ICs can be integrated into a variety of devices, from small portable devices to large home automation systems. They can also be used in combination with other components, such as processors, amplifiers, and filters, to provide a complete electronic system.