Part | RoHS | Manufacturer | General IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Maximum Supply Current | Power Supplies (V) | Harmonic Distortion | Nominal Output Voltage (FM) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Nominal Signal to Noise Ratio (FM) | Qualification | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Nominal Output Voltage (AM) | Demodulation Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
AUDIO DEMODULATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2650 mV |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 |
8 V |
.5 mm |
3 mm |
73 dB |
4.5 V |
260 |
3 mm |
FM |
||||||||||||||
NXP Semiconductors |
AUDIO DEMODULATOR |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
4 mA |
6 |
530 mV |
IN-LINE |
DIP16,.3 |
Receiver ICs |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
8 V |
4.2 mm |
7.62 mm |
68 dB |
Not Qualified |
4.5 V |
19.025 mm |
FM |
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NXP Semiconductors |
AUDIO DEMODULATOR |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
AUDIO DEMODULATOR |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
530 mV |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
8 V |
1.75 mm |
3.9 mm |
73 dB |
4.5 V |
e4 |
9.9 mm |
FM |
|||||||||||||||
NXP Semiconductors |
AUDIO DEMODULATOR |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2650 mV |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
8 V |
1.75 mm |
3.9 mm |
73 dB |
4.5 V |
9.9 mm |
FM |
|||||||||||||||||
NXP Semiconductors |
AUDIO DEMODULATOR |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 mA |
530 mV |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
8 V |
1.75 mm |
3.9 mm |
73 dB |
Not Qualified |
4.5 V |
9.9 mm |
FM |
|||||||||||||||
NXP Semiconductors |
AUDIO DEMODULATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2650 mV |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
8 V |
.5 mm |
3 mm |
73 dB |
4.5 V |
3 mm |
FM |
|||||||||||||||||
NXP Semiconductors |
AUDIO DEMODULATOR |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
4 mA |
530 mV |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
8 V |
4.2 mm |
7.62 mm |
73 dB |
Not Qualified |
4.5 V |
19.025 mm |
FM |
||||||||||||||||
Infineon Technologies |
AUDIO DEMODULATOR |
INDUSTRIAL |
GULL WING |
16 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 % |
650 mV |
SMALL OUTLINE |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
13.2 V |
84 dB |
Not Qualified |
7.5 V |
e0 |
220 |
FM |
||||||||||||||||
Infineon Technologies |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
.4 % |
600 mV |
IN-LINE |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
15.75 V |
Not Qualified |
10.5 V |
FM |
|||||||||||||||||||
Infineon Technologies |
AUDIO DEMODULATOR |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
41 mA |
550 mV |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
11 V |
1.2 mm |
4.4 mm |
84 dB |
Not Qualified |
7.5 V |
e0 |
6.5 mm |
FM |
|||||||||||||
Infineon Technologies |
AUDIO DEMODULATOR |
COMMERCIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
86 mA |
5 |
.2 % |
220 mV |
SMALL OUTLINE |
SOP28,.4 |
Receiver ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
5.5 V |
Not Qualified |
4.5 V |
e0 |
235 |
FM |
|||||||||||
Toshiba |
AUDIO DEMODULATOR |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
24 mA |
.9 % |
2500 mV |
IN-LINE |
2.54 mm |
75 Cel |
-20 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
30 V |
4.44 mm |
7.62 mm |
Not Qualified |
30 V |
e0 |
19.25 mm |
FM |
||||||||||||
Toshiba |
AUDIO DEMODULATOR |
GULL WING |
24 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
TIN LEAD |
DUAL |
R-PDSO-G24 |
4 V |
1.6 mm |
5.6 mm |
Not Qualified |
.95 V |
e0 |
7.8 mm |
||||||||||||||||||||
|
Toshiba |
AUDIO DEMODULATOR |
GULL WING |
16 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.2 % |
45 mV |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G16 |
2.2 V |
1.6 mm |
4.4 mm |
58 dB |
Not Qualified |
.95 V |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
FM |
||||||||||||||
Toshiba |
AUDIO DEMODULATOR |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
14 |
HDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
50 mA |
2 % |
450 mV |
IN-LINE, HEAT SINK/SLUG |
2.54 mm |
75 Cel |
-20 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
30 V |
4.2 mm |
12.7 mm |
Not Qualified |
16 V |
e0 |
26.5 mm |
FM |
|||||||||||||
Toshiba |
AUDIO DEMODULATOR |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
64 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
IN-LINE, SHRINK PITCH |
1.778 mm |
75 Cel |
-20 Cel |
DUAL |
R-PDIP-T64 |
5.25 V |
5 mm |
19.05 mm |
Not Qualified |
4.75 V |
57.5 mm |
FM |
|||||||||||||||||
Toshiba |
AUDIO DEMODULATOR |
COMMERCIAL EXTENDED |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
FLATPACK |
.8 mm |
75 Cel |
-20 Cel |
QUAD |
R-PQFP-G80 |
5.25 V |
3.05 mm |
14 mm |
Not Qualified |
4.75 V |
20 mm |
FM |
|||||||||||||||||
Toshiba |
AUDIO DEMODULATOR |
GULL WING |
16 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
5 mA |
.2 % |
45 mV |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G16 |
2.2 V |
1.6 mm |
4.4 mm |
58 dB |
Not Qualified |
.95 V |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
FM |
||||||||||||||
Toshiba |
AUDIO DEMODULATOR |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
25 mA |
IN-LINE |
2.54 mm |
75 Cel |
-20 Cel |
SINGLE |
R-PSIP-T9 |
15 V |
7.8 mm |
3.2 mm |
Not Qualified |
8 V |
22.28 mm |
FM |
|||||||||||||||||
Renesas Electronics |
AUDIO DEMODULATOR |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
30 mA |
12 |
.5 % |
400 mV |
SMALL OUTLINE |
SO(UNSPEC) |
Other Consumer ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
16 V |
2.65 mm |
7.5 mm |
Not Qualified |
8.5 V |
e0 |
12.8 mm |
FM |
|||||||||
Renesas Electronics |
AUDIO DEMODULATOR |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
2.54 mm |
DUAL |
R-PDIP-T14 |
5.06 mm |
7.62 mm |
Not Qualified |
19.2 mm |
|||||||||||||||||||||||||
Renesas Electronics |
AUDIO DEMODULATOR |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
2.54 mm |
DUAL |
R-PDIP-T14 |
5.06 mm |
7.62 mm |
Not Qualified |
19.2 mm |
|||||||||||||||||||||||||
Renesas Electronics |
AUDIO DEMODULATOR |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
30 mA |
12 |
.5 % |
400 mV |
IN-LINE |
DIP16,.3 |
Other Consumer ICs |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
16 V |
5.33 mm |
7.62 mm |
Not Qualified |
8.5 V |
e0 |
19.17 mm |
FM |
|||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
8 mA |
4 |
150 mV |
SMALL OUTLINE |
SOP16,.25 |
Receiver ICs |
1.27 mm |
70 Cel |
-20 Cel |
DUAL |
R-PDSO-G16 |
7 V |
1.95 mm |
3.9 mm |
Not Qualified |
2.5 V |
9.9 mm |
FM |
||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
8 mA |
4 |
150 mV |
IN-LINE |
DIP16,.3 |
Receiver ICs |
2.54 mm |
70 Cel |
-20 Cel |
DUAL |
R-PDIP-T16 |
7 V |
5.08 mm |
7.62 mm |
Not Qualified |
2.5 V |
19.4 mm |
FM |
||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
85 mA |
.5 % |
IN-LINE, SHRINK PITCH |
1.778 mm |
70 Cel |
-10 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
10.16 mm |
Not Qualified |
4.5 V |
29.4 mm |
FM |
||||||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
87 mA |
IN-LINE, SHRINK PITCH |
1.778 mm |
70 Cel |
-10 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
10.16 mm |
Not Qualified |
4.7 V |
29.4 mm |
FM |
|||||||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
7 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
.2 % |
500 mV |
IN-LINE |
2.54 mm |
70 Cel |
-20 Cel |
SINGLE |
R-PSIP-T7 |
14 V |
7.3 mm |
3 mm |
60 dB |
Not Qualified |
8 V |
21.84 mm |
FM |
|||||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
25 mA |
12 |
IN-LINE |
SIP9,.1 |
Receiver ICs |
2.54 mm |
70 Cel |
-20 Cel |
TIN LEAD |
SINGLE |
R-PSIP-T9 |
7.3 mm |
3 mm |
Not Qualified |
e0 |
21.84 mm |
||||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
87 mA |
.5 % |
IN-LINE, SHRINK PITCH |
1.778 mm |
70 Cel |
-10 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
10.16 mm |
Not Qualified |
4.7 V |
29.4 mm |
FM |
||||||||||||||||
Samsung |
AUDIO DEMODULATOR |
THROUGH-HOLE |
24 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE, SHRINK PITCH |
1.778 mm |
DUAL |
R-PDIP-T24 |
7 V |
5.08 mm |
7.62 mm |
Not Qualified |
1.8 V |
22.95 mm |
AM/FM |
|||||||||||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
24 mA |
24 |
IN-LINE |
DIP14,.3 |
Receiver ICs |
2.54 mm |
70 Cel |
-20 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
19.4 mm |
||||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
7 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
.2 % |
500 mV |
IN-LINE |
2.54 mm |
70 Cel |
-20 Cel |
TIN LEAD |
SINGLE |
R-PSIP-T7 |
14 V |
7.3 mm |
3 mm |
60 dB |
Not Qualified |
8 V |
e0 |
21.84 mm |
FM |
|||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
35 mA |
12 |
1.5 % |
360 mV |
IN-LINE |
DIP14,.3TB |
Other Consumer ICs |
2.54 mm |
75 Cel |
-20 Cel |
TIN LEAD |
DUAL |
R-PDIP-T14 |
18 V |
5.08 mm |
7.62 mm |
Not Qualified |
9 V |
e0 |
19 mm |
FM |
Receiver ICs, also known as radio receiver ICs or RF receiver ICs, are electronic components that receive and demodulate radio frequency (RF) signals. These ICs are used in a variety of applications, including wireless communication systems, radio receivers, and remote control systems.
Receiver ICs can be classified into several types based on the specific frequency range they operate in and the modulation scheme they support. Some of the most common types of receiver ICs include:
1. AM/FM receiver ICs - These ICs are designed to receive and demodulate analog AM and FM radio signals. They are used in radio receivers, car audio systems, and other audio applications.
2. Bluetooth receiver ICs - These ICs are designed to receive and demodulate Bluetooth signals, allowing wireless communication between devices such as smartphones, speakers, and headphones.
3. Wi-Fi receiver ICs - These ICs are designed to receive and demodulate Wi-Fi signals, allowing wireless communication between devices such as smartphones, computers, and routers.
4. GPS receiver ICs - These ICs are designed to receive and demodulate GPS signals, allowing precise location tracking and navigation.
Receiver ICs can be integrated into a variety of devices, from small portable devices to large communication systems. They can also be used in combination with other components, such as amplifiers, filters, and oscillators, to provide a complete RF system.