AUDIO SINGLE CHIP RECEIVER Receiver ICs 462

Reset All

Part	Manufacturer	General IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Power Supplies (V)	Harmonic Distortion	Nominal Output Voltage (FM)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Nominal Signal to Noise Ratio (FM)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Nominal Output Voltage (AM)	Demodulation Type
SI4735-D60-GU	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	Other Consumer ICs	.635 mm	85 Cel	-20 Cel	MATTE TIN	DUAL	R-PDSO-G24	3	5.5 V	2 mm	3.9 mm	58 dB	Not Qualified	2.7 V		e3	40	260	8.65 mm	60 mV	AM/FM
SI4730-D60-GU	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	Other Consumer ICs	.635 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G24		5.5 V	2 mm	3.9 mm	58 dB	Not Qualified	2.7 V			NOT SPECIFIED	NOT SPECIFIED	8.65 mm	60 mV	AM/FM
SI4705-D60-GU	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Consumer ICs	.635 mm	85 Cel	-20 Cel	MATTE TIN	DUAL	R-PDSO-G24	3	5.5 V	2 mm	3.9 mm	58 dB	Not Qualified	2.7 V		e3	40	260	8.65 mm		FM
SI4705-D60-GUR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Consumer ICs	.635 mm	85 Cel	-20 Cel	MATTE TIN	DUAL	R-PDSO-G24	3	5.5 V	2 mm	3.9 mm	58 dB	Not Qualified	2.7 V		e3	40	260	8.65 mm		FM
SI4689-A10-GM	Silicon Labs	AUDIO SINGLE CHIP RECEIVER																				MATTE TIN			3								e3	40	260
SA605DK/01,118	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					150 mV	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	8 V	1.5 mm	4.4 mm	73 dB	Not Qualified	4.5 V	IN-BUILT QUADRATURE DETECTOR	e4		260	6.5 mm		FM
SI4735-D60-GUR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	Other Consumer ICs	.635 mm	85 Cel	-20 Cel	MATTE TIN	DUAL	R-PDSO-G24	3	5.5 V	2 mm	3.9 mm	58 dB	Not Qualified	2.7 V		e3	40	260	8.65 mm	60 mV	AM/FM
SA605D/01,118	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					150 mV	SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	8 V	2.65 mm	7.5 mm	73 dB	Not Qualified	4.5 V	IN-BUILT QUADRATURE DETECTOR	e4		260	12.8 mm		FM
SI4844-B20-GU	Silicon Labs	AUDIO SINGLE CHIP RECEIVER																				MATTE TIN			3								e3	40	260
SI4844-B20-GUR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER																				MATTE TIN			3								e3	40	260
SI4705-D60-GM	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	SMALL OUTLINE, SHRINK PITCH	LCC20,.12SQ,20	Other Consumer ICs	.635 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G24		5.5 V	2 mm	3.9 mm	58 dB	Not Qualified	2.7 V			NOT SPECIFIED	NOT SPECIFIED	8.65 mm		FM
TDA7210XUMA1	Infineon Technologies	AUDIO SINGLE CHIP RECEIVER																				TIN			3								e3
MICRF221AYQS	Microchip Technology	AUDIO SINGLE CHIP RECEIVER																				MATTE TIN											e3
SI4730-D60-GUR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	Other Consumer ICs	.635 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G24		5.5 V	2 mm	3.9 mm	58 dB	Not Qualified	2.7 V			NOT SPECIFIED	NOT SPECIFIED	8.65 mm	60 mV	AM/FM
SA605DK/01,112	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					150 mV	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	8 V	1.5 mm	4.4 mm	73 dB	Not Qualified	4.5 V	IN-BUILT QUADRATURE DETECTOR	e4		260	6.5 mm		FM
TDA1072AT/V4,112	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			27 mA		1 %		SMALL OUTLINE			1.27 mm	80 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	10 V	1.75 mm	3.9 mm		Not Qualified	7.5 V		e4			9.9 mm	310 mV	AM
TDA1072AT/V4,118	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			27 mA		1 %		SMALL OUTLINE			1.27 mm	80 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	10 V	1.75 mm	3.9 mm		Not Qualified	7.5 V		e4			9.9 mm	310 mV	AM
SA615D/01,118	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		7.4 mA			530 mV	SMALL OUTLINE	SOP20,.4		1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	8 V	2.65 mm	7.5 mm	68 dB	Not Qualified	4.5 V	IN-BUILT QUADRATURE DETECTOR	e4	30	260	12.8 mm		FM
SA615DK/01,118	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		7.4 mA			530 mV	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	8 V	1.5 mm	4.4 mm	68 dB	Not Qualified	4.5 V	IN-BUILT QUADRATURE DETECTOR	e4		260	6.5 mm		FM
SI4844-A10-GU	Silicon Labs	AUDIO SINGLE CHIP RECEIVER																																NOT SPECIFIED	NOT SPECIFIED
SI4844-A10-GUR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER
SI4731-D60-GM	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,20	Other Consumer ICs	.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD	S-XQCC-N20	3	5.5 V	.6 mm	3 mm	58 dB	Not Qualified	2.7 V		e3	40	260	3 mm	60 mV	AM/FM
CXA1691BM	Sony	AUDIO SINGLE CHIP RECEIVER	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	14 mA		.9 %	77.5 mV	SMALL OUTLINE			1.27 mm	60 Cel	-10 Cel		DUAL	R-PDSO-G28		7.5 V	2.7 mm	7.6 mm		Not Qualified	2 V					18.8 mm	77.5 mV	AM/FM
TEA5767HL	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	COMMERCIAL EXTENDED	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				.5 %	75 mV	FLATPACK, LOW PROFILE			.8 mm	75 Cel	-10 Cel	MATTE TIN	QUAD	S-PQFP-G32		5 V	1.6 mm	7 mm		Not Qualified	2.5 V		e3			7 mm		FM
TEA5767HN	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	COMMERCIAL EXTENDED	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.5 %	75 mV	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	75 Cel	-10 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40		5 V	1 mm	6 mm		Not Qualified	2.5 V		e4			6 mm		FM
TEA5767HN/V3,118	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	COMMERCIAL EXTENDED	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.5 %	75 mV	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	75 Cel	-10 Cel		QUAD	S-PQCC-N40		5 V	1 mm	6 mm		Not Qualified	2.5 V					6 mm		FM
SI4730-D60-GMR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,20	Other Consumer ICs	.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD	S-XQCC-N20	3	5.5 V	.6 mm	3 mm	58 dB	Not Qualified	2.7 V		e3	40	260	3 mm	60 mV	AM/FM
SI4840-A10-GUR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER																				MATTE TIN			3								e3	40	260
SI4735-D60-GM	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,20	Other Consumer ICs	.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		5.5 V	.6 mm	3 mm	58 dB	Not Qualified	2.7 V			NOT SPECIFIED	NOT SPECIFIED	3 mm	60 mV	AM/FM
MC3361BD	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	6.4 mA	4	.86 %	160 mV	SMALL OUTLINE	SOP16,.25	Receiver ICs	1.27 mm	70 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16		8 V	1.75 mm	3.9 mm		Not Qualified	2 V		e0			9.9 mm		FM
MC3361BDR2	Motorola	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	6.4 mA	4	.86 %	160 mV	SMALL OUTLINE	SOP16,.25	Receiver ICs	1.27 mm	70 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16		8 V	1.75 mm	3.9 mm		Not Qualified	2 V		e0			9.9 mm		FM
MC3361BP	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	6.4 mA	4	.86 %	160 mV	IN-LINE	DIP16,.3	Receiver ICs	2.54 mm	70 Cel	-30 Cel	TIN LEAD	DUAL	R-PDIP-T16		8 V	4.44 mm	7.62 mm		Not Qualified	2 V		e0			19.175 mm		FM
SA605DK/01	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					4300 mV	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		8 V	1.5 mm	4.4 mm	73 dB		4.5 V					6.5 mm		FM
SI4734-D60-GM	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,20	Other Consumer ICs	.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD	S-XQCC-N20	3	5.5 V	.6 mm	3 mm	58 dB	Not Qualified	2.7 V		e3	40	260	3 mm	60 mV	AM/FM
SI4734-D60-GMR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,20	Other Consumer ICs	.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD	S-XQCC-N20	3	5.5 V	.6 mm	3 mm	58 dB	Not Qualified	2.7 V		e3	40	260	3 mm	60 mV	AM/FM
SI4820-A10-CUR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.1 %	72 mV	SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G24	3	3.6 V	1.75 mm	3.9 mm	45 dB		2 V		e3	40	260	8.65 mm	54 mV	AM/FM
SI4822-A10-CUR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.1 %	72 mV	SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	0 Cel		DUAL	R-PDSO-G24		3.6 V	1.75 mm	3.9 mm	45 dB		2 V			NOT SPECIFIED	NOT SPECIFIED	8.65 mm	54 mV	AM/FM
SI4835-B30-GUR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER																				MATTE TIN			3					Not Qualified			e3	40	260
SI4735-D60-GMR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,20	Other Consumer ICs	.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD	S-XQCC-N20	3	5.5 V	.6 mm	3 mm	58 dB	Not Qualified	2.7 V		e3	40	260	3 mm	60 mV	AM/FM
SA605DK	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6.55 mA			150 mV	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20		8 V	1.5 mm	4.4 mm	73 dB	Not Qualified	4.5 V	IN-BUILT QUADRATURE DETECTOR	e4			6.5 mm		FM
SA605DK,112	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6.55 mA			150 mV	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20		8 V	1.5 mm	4.4 mm	73 dB	Not Qualified	4.5 V	IN-BUILT QUADRATURE DETECTOR	e4			6.5 mm		FM
SA615DK/01	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER		GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		7.4 mA			530 mV	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		8 V	1.5 mm	4.4 mm	68 dB		4.5 V	IN-BUILT QUADRATURE DETECTOR				6.5 mm		FM
SI4707-B20-GMR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER
SI4730-D60-GM	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,20	Other Consumer ICs	.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD	S-XQCC-N20	3	5.5 V	.6 mm	3 mm	58 dB	Not Qualified	2.7 V		e3	40	260	3 mm	60 mV	AM/FM
SI4731-D60-GU	Silicon Labs	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8/3.3,3/5	.1 %	80 mV	SMALL OUTLINE, SHRINK PITCH	SSOP24,.24	Other Consumer ICs	.635 mm	85 Cel	-20 Cel	MATTE TIN	DUAL	R-PDSO-G24	3	5.5 V	2 mm	3.9 mm	58 dB	Not Qualified	2.7 V		e3	40	260	8.65 mm	60 mV	AM/FM
SI4825-A10-CSR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER																				MATTE TIN			3								e3	40	260
MC3371P	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		5 mA	4	.6 %	200 mV	IN-LINE	DIP16,.3	Receiver ICs	2.54 mm	70 Cel	-30 Cel	TIN LEAD	DUAL	R-PDIP-T16		9 V	4.44 mm	7.62 mm	67 dB	Not Qualified	2 V		e0			19.175 mm		FM
SI4356-B1A-FMR	Silicon Labs	AUDIO SINGLE CHIP RECEIVER

Receiver ICs

Receiver ICs, also known as radio receiver ICs or RF receiver ICs, are electronic components that receive and demodulate radio frequency (RF) signals. These ICs are used in a variety of applications, including wireless communication systems, radio receivers, and remote control systems.

Receiver ICs can be classified into several types based on the specific frequency range they operate in and the modulation scheme they support. Some of the most common types of receiver ICs include:

1. AM/FM receiver ICs - These ICs are designed to receive and demodulate analog AM and FM radio signals. They are used in radio receivers, car audio systems, and other audio applications.

2. Bluetooth receiver ICs - These ICs are designed to receive and demodulate Bluetooth signals, allowing wireless communication between devices such as smartphones, speakers, and headphones.

3. Wi-Fi receiver ICs - These ICs are designed to receive and demodulate Wi-Fi signals, allowing wireless communication between devices such as smartphones, computers, and routers.

4. GPS receiver ICs - These ICs are designed to receive and demodulate GPS signals, allowing precise location tracking and navigation.

Receiver ICs can be integrated into a variety of devices, from small portable devices to large communication systems. They can also be used in combination with other components, such as amplifiers, filters, and oscillators, to provide a complete RF system.