BUS BUFFERS Other Function Interface ICs 127

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

LTC4301LCMS8#TRPBF

Analog Devices

BUS BUFFERS

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC4303IMS8#TR

Analog Devices

BUS BUFFERS

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

LTC4302CMS-2#PBF

Analog Devices

BUS BUFFERS

COMMERCIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC4315IDE#TRPBF

Analog Devices

BUS BUFFERS

NO LEAD

12

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC12,.12,20

2.9 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-N12

1

.8 mm

3 mm

COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS

e3

30

260

4 mm

LTC4301LIMS8#PBF

Analog Devices

BUS BUFFERS

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC4304CDD#TRPBF

Analog Devices

BUS BUFFERS

COMMERCIAL

NO LEAD

10

HVSON

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-N10

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

PCA9605D

NXP Semiconductors

BUS BUFFERS

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

SMALL OUTLINE

2.7 V

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

4.9 mm

PCA9525DP

NXP Semiconductors

BUS BUFFERS

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

3 mm

PCA9525D

NXP Semiconductors

BUS BUFFERS

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

SMALL OUTLINE

2.7 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

4.9 mm

PCA9605DP

NXP Semiconductors

BUS BUFFERS

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

3 mm

PCA9601D

NXP Semiconductors

BUS BUFFERS

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

15 V

1

5 V

SMALL OUTLINE

SOP8,.25

2.5 V

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

PCA9601DP

NXP Semiconductors

BUS BUFFERS

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

15 V

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.5 V

.65 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G8

1.1 mm

3 mm

3 mm

PI6ULS5V9511AWEX

Diodes Incorporated

BUS BUFFERS

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE

SOP8,.25

2.7 V

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

e3

30

260

4.9 mm

PI6ULS5V9511AUEX

Diodes Incorporated

BUS BUFFERS

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.7 V

.65 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G8

1.1 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

3 mm

TC7WPN3125FK

Toshiba

BUS BUFFERS

ISL33002IUZ-T

Renesas Electronics

BUS BUFFERS

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

2.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.3 V

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

e3

30

260

3 mm

ISL33003IRTZ-T

Renesas Electronics

BUS BUFFERS

MATTE TIN

3

e3

30

260

ISL33002IRTZ

Renesas Electronics

BUS BUFFERS

MATTE TIN

3

e3

30

260

ISL33001IBZ-T

Renesas Electronics

BUS BUFFERS

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

2.5 V

SMALL OUTLINE

SOP8,.25

2.3 V

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

2

1.75 mm

3.9 mm

e3

30

260

4.9 mm

ISL33002IRT2Z

Renesas Electronics

BUS BUFFERS

MATTE TIN

1

e3

30

260

ISL33002IRTZ-T

Renesas Electronics

BUS BUFFERS

MATTE TIN

3

e3

30

260

ISL33001IBZ

Renesas Electronics

BUS BUFFERS

MATTE TIN

2

e3

30

260

ISL33001IRT2Z

Renesas Electronics

BUS BUFFERS

MATTE TIN

1

e3

30

260

ISL33001IRTZ-T

Renesas Electronics

BUS BUFFERS

MATTE TIN

3

e3

30

260

ISL33003IRT2Z-T

Renesas Electronics

BUS BUFFERS

MATTE TIN

1

e3

30

260

ISL33002IRT2Z-T

Renesas Electronics

BUS BUFFERS

MATTE TIN

1

e3

30

260

ISL33003IRTZ

Renesas Electronics

BUS BUFFERS

MATTE TIN

3

e3

30

260

ISL33001IRT2Z-T

Renesas Electronics

BUS BUFFERS

MATTE TIN

1

e3

30

260

ISL33001IUZ-T

Renesas Electronics

BUS BUFFERS

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

2.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.3 V

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

e3

30

260

3 mm

ISL33003IRT2Z

Renesas Electronics

BUS BUFFERS

MATTE TIN

1

e3

30

260

ISL33001IRTZ

Renesas Electronics

BUS BUFFERS

MATTE TIN

3

e3

30

260

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.