Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
1 |
7.3 mA |
5 V |
2.5/15 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
2.5 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 V |
2 |
BIPOLAR |
5 V |
2/15 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
2 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
1.1 V |
5.5 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.7 V |
Line Driver or Receivers |
.9 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
ALSO OPERATES WITH 2.7 TO 5.5V |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
2 |
BIPOLAR |
5 V |
2/15 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
15 V |
2 |
BIPOLAR |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
NOT SPECIFIED |
260 |
3 mm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
2 |
BIPOLAR |
5 V |
2/15 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2 V |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
260 |
4.9 mm |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.5 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
NOT SPECIFIED |
260 |
3 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.6 mA |
3.3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
2.7 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
1 |
7.3 mA |
5 V |
2.5/15 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
2.5 V |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||
|
Renesas Electronics |
BUS BUFFERS |
MATTE TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
1 |
7.3 mA |
5 V |
2.5/15 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2.5 V |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
2.7 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
BUS BUFFERS |
MATTE TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
1 |
7.3 mA |
5 V |
2.5/15 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2.5 V |
1.27 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.6 mA |
3.3 V |
5.5 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
2.7 V |
Other Interface ICs |
2.7 V |
1.27 mm |
85 Cel |
3.3 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.5 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
2.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
1 |
5 V |
SMALL OUTLINE |
SOP8,.25 |
2.5 V |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
BUS BUFFERS |
MATTE TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.6 mA |
3.3 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2.7 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS BUFFERS |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
15 V |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.5 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||
Analog Devices |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
GULL WING |
12 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP12,.19 |
2.9 V |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G12 |
1 |
1.1 mm |
3 mm |
COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS |
e3 |
30 |
260 |
4.039 mm |
||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS BUFFERS |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N8 |
.65 mm |
2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
5.5 V |
SMALL OUTLINE |
2.7 V |
2.7 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS BUFFERS |
INDUSTRIAL |
NO LEAD |
8 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
1.1 V |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
.9 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N8 |
1 |
.4 mm |
1.6 mm |
ALSO OPERATES WITH 2.7 TO 5.5V |
e4 |
30 |
260 |
1.6 mm |
|||||||||||||||||||||||||||||
Texas Instruments |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
SMALL OUTLINE |
2.7 V |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS BUFFERS |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
1.65 V |
.8 V |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.1 mm |
3 mm |
ALSO HAVE 1.65 MIN INPUT |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
BUS BUFFERS |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
1.65 V |
.8 V |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.1 mm |
3 mm |
ALSO HAVE 1.65 MIN INPUT |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
BUS BUFFERS |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
1.65 V |
.8 V |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.1 mm |
3 mm |
ALSO HAVE 1.65 MIN INPUT |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
BUS BUFFERS |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
1.65 V |
.8 V |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.1 mm |
3 mm |
ALSO HAVE 1.65 MIN INPUT |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
BUS BUFFERS |
INDUSTRIAL |
NO LEAD |
8 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
1.1 V |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
.9 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N8 |
1 |
.4 mm |
1.6 mm |
ALSO OPERATES WITH 2.7 TO 5.5V |
e4 |
30 |
260 |
1.6 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
NO LEAD |
12 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC12,.12,20 |
2.9 V |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-N12 |
1 |
.8 mm |
3 mm |
COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
GULL WING |
8 |
HVSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
2.7 V |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
NO LEAD |
12 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC12,.12,20 |
2.9 V |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-N12 |
1 |
.8 mm |
3 mm |
COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
NO LEAD |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
Analog Devices |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||||||||||||||||||||
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||||||||||||||||||||
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
.5 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||||||||||||||||||||
Analog Devices |
BUS BUFFERS |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.