Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Vishay Intertechnology |
INTERFACE CIRCUIT |
OTHER |
UNSPECIFIED |
8 |
RECTANGULAR |
UNSPECIFIED |
NO |
5.5 V |
1 |
CMOS |
5 V |
5.5 V |
MICROELECTRONIC ASSEMBLY |
2.4 V |
2.4 V |
.95 mm |
85 Cel |
5 V |
-30 Cel |
SINGLE |
R-XSMA-X8 |
3.1 mm |
2.5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
8.5 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
SMALL OUTLINE |
SOP16,.4 |
4.5 V |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
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|
Dialog Semiconductor |
INTERFACE CIRCUIT |
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|
Renesas Electronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
32 V |
1 |
HVCMOS |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
8 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
1 mm |
7 mm |
7 mm |
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|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 V |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
11 V |
.95 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
2.9 mm |
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|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
2 |
1.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.1X.14,20 |
Other Interface ICs |
1.1 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
1 |
.8 mm |
2.5 mm |
Not Qualified |
e4 |
30 |
260 |
3.5 mm |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2.64 V |
1 |
2.5 V |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC8,.06SQ,20 |
3 V |
2.36 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N8 |
1 |
.5 mm |
1.6 mm |
Not Qualified |
ALSO OPERARTES AT 3.3V SUPPLY |
e4 |
30 |
260 |
1.6 mm |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
4 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
Level Translators |
2.5 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
.5 mm |
2.04 mm |
Not Qualified |
2.04 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
2 |
2 |
3.3 V |
SMALL OUTLINE |
3.3 V |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
2 |
1.75 mm |
3.895 mm |
VCC2 SUPPLY FROM 3 TO 5.5 V |
e4 |
30 |
260 |
4.905 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
3 |
CMOS |
AEC-Q100 |
2.5 V |
SMALL OUTLINE, SHRINK PITCH |
2.25 V |
.635 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
2 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
3 |
CMOS |
AEC-Q100 |
2.5 V |
SMALL OUTLINE |
2.25 V |
1.27 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
2 |
2.65 mm |
7.5 mm |
e4 |
30 |
260 |
10.3 mm |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
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Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e0 |
9.375 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Other Interface ICs |
4.5 V |
2.54 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDIP-T8 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e3 |
30 |
260 |
9.375 mm |
|||||||||||||||||||||||||||
Microchip Technology |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
TS 16949; AEC-Q100 |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.8 V |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
4.5 V |
.65 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
2 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
8.65 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.9 V |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B20 |
.53 mm |
1.7 mm |
e2 |
30 |
260 |
2.1 mm |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
1 |
260 |
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Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.32 V |
3.6 V |
CHIP CARRIER |
1.08 V |
1.08 V |
.5 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBCC-N20 |
.4 mm |
.8 mm |
1.35 mm |
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|
Microchip Technology |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.2SQ,25 |
3.6 V |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 mm |
5 mm |
5 mm |
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|
Vishay Intertechnology |
INTERFACE CIRCUIT |
OTHER |
UNSPECIFIED |
8 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
2.4 V |
1 mm |
85 Cel |
-25 Cel |
MATTE TIN |
SINGLE |
R-PSMA-X8 |
4 |
4.7 mm |
4 mm |
e3 |
10 |
260 |
9.9 mm |
|||||||||||||||||||||||||||||||||
|
Vishay Intertechnology |
INTERFACE CIRCUIT |
OTHER |
L BEND |
8 |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
5.5 V |
MICROELECTRONIC ASSEMBLY |
2.4 V |
2.4 V |
1 mm |
85 Cel |
3.3 V |
-25 Cel |
MATTE TIN |
SINGLE |
R-XSMA-L8 |
4 |
4.2 mm |
4.7 mm |
Not Qualified |
e3 |
10 |
260 |
9.7 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
4.5 V |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N12 |
1 |
.8 mm |
2 mm |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Display Drivers |
3 V |
.5 mm |
100 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 |
.9 mm |
3 mm |
Not Qualified |
e3 |
3 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
CMOS |
5 V |
SMALL OUTLINE |
SOP8,.25 |
3 V |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
CMOS |
AEC-Q100 |
5 V |
SMALL OUTLINE |
3 V |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
33.1 V |
1 |
CMOS |
30 V |
SMALL OUTLINE, SHRINK PITCH |
16 V |
.65 mm |
85 Cel |
-25 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
e3 |
30 |
260 |
10.2 mm |
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|
Advantech |
INTERFACE CIRCUIT |
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|
Renesas Electronics |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
32 V |
1 |
HV-CMOS |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
8 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
7 mm |
|||||||||||||||||||||||||||||||||||
|
Dialog Semiconductor |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
32 V |
1 |
HVCMOS |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
8 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
.8 mm |
4 mm |
4 mm |
||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
INTERFACE CIRCUIT |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
8 |
RECTANGULAR |
UNSPECIFIED |
NO |
3.6 V |
1 |
BICMOS |
3 V |
MICROELECTRONIC ASSEMBLY |
2.4 V |
85 Cel |
-25 Cel |
SINGLE |
R-XSMA-N8 |
4 |
Not Qualified |
255 |
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|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
3 |
CMOS |
AEC-Q100 |
1.8 V |
1.71 V |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
2 |
ALSO REQUIRE SUPPLY FROM 2.25V TO 5.5V |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
3 |
CMOS |
AEC-Q100 |
1.8 V |
1.71 V |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
2 |
ALSO REQUIRE SUPPLY FROM 2.25V TO 5.5V |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
3 |
3 |
3.3 V |
SMALL OUTLINE |
3.3 V |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
2 |
2.65 mm |
7.5 mm |
IT ALSO OPERATES AT 5V |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
4 |
4 |
3.3 V |
SMALL OUTLINE |
3.3 V |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
2 |
2.65 mm |
7.5 mm |
IT ALSO OPERATES AT 5 V |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
GULL WING |
20 |
HSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
4 |
4 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SOP20,.4 |
2.97 V |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
3 |
3.55 mm |
7.5 mm |
e4 |
260 |
12.83 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BUTT |
56 |
HVFLGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BIPOLAR |
3.3 V |
GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
SLGA56,11X11,22 |
3 V |
.55 mm |
125 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B56 |
.83 mm |
6 mm |
SEATED HT-CALCULATED |
e3 |
6 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
2.25 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
1 |
1.1 mm |
3 mm |
e3 |
260 |
3 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
4 |
3.62 mm |
15 mm |
30 |
245 |
11.25 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
3.3 V |
SMALL OUTLINE |
SOP16,.25 |
1.71 V |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Also has VDDB supply from 1.71V to 5.5V |
e3 |
30 |
260 |
9.9 mm |
||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
AEC-Q100 |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.65 V |
1.2 V |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
1.1 mm |
4.4 mm |
e3 |
30 |
260 |
6.5 mm |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
TIN |
3 |
e3 |
40 |
260 |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
12 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
1.8/3.3,2.5/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,16 |
Other Interface ICs |
.4 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
Not Qualified |
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|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BICMOS |
3 V |
2.5/3.3 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2.3 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.