Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
3 |
CMOS |
2.5 V |
SMALL OUTLINE |
2.25 V |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
2 |
2.65 mm |
7.5 mm |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
4 |
CMOS |
2.5 V |
SMALL OUTLINE |
2.25 V |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
2 |
2.65 mm |
7.5 mm |
IT ALSO OPERATES AT 3.3, 5 V |
e4 |
30 |
260 |
10.3 mm |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
GULL WING |
36 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
28 V |
1 |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
6 V |
.5 mm |
DUAL |
R-PDSO-G36 |
2.47 mm |
7.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
GULL WING |
36 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
28 V |
1 |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
6 V |
.5 mm |
DUAL |
R-PDSO-G36 |
3 |
2.47 mm |
7.5 mm |
10.3 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
10 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
16.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
12 V |
2.25 V |
.5 mm |
70 Cel |
15 V |
0 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
.8 mm |
3 mm |
e3 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2.25 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N16 |
1 |
.8 mm |
3 mm |
e3 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
12 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP12,.19 |
3.15 V |
.65 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G12 |
1 |
1.1 mm |
4.039 mm |
e3 |
3 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
12 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP12,.19 |
3.15 V |
.65 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G12 |
1 |
1.1 mm |
4.039 mm |
e3 |
3 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC12,.12,18 |
3.15 V |
.45 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N12 |
1 |
.8 mm |
3 mm |
e3 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
36 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
GRID ARRAY |
1.62 V |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B36 |
2.31 mm |
6.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
22 mm |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
3 |
3.62 mm |
11.25 mm |
30 |
245 |
15 mm |
|||||||||||||||||||||||||||||||||
|
M/a-com Technology Solutions |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
GENERAL PURPOSE |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
1 |
1 mm |
3 mm |
e4 |
3 mm |
||||||||||||||||||||||||||||||||
|
M/a-com Technology Solutions |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
-5 V |
SMALL OUTLINE |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
260 |
9.9 mm |
|||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B20 |
1 |
.67 mm |
2.03 mm |
Not Qualified |
e0 |
2.54 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B20 |
1 |
.67 mm |
2.03 mm |
Not Qualified |
e1 |
30 |
260 |
2.54 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e0 |
10.2 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e3 |
10.2 mm |
|||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
4 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,16 |
1.65 V |
Other Interface ICs |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
DUAL |
S-XDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
3 mm |
||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.25 |
Display Drivers |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
8.65 mm |
|||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SOP20,.25 |
Display Drivers |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
1.8/3.3 |
SMALL OUTLINE, VERY THIN PROFILE |
LCC24,.13SQ,16 |
Display Drivers |
1.62 V |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N24 |
1 |
.85 mm |
3.5 mm |
Not Qualified |
e3 |
30 |
260 |
3.5 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G32 |
3 |
2.45 mm |
7.5 mm |
e3 |
40 |
260 |
11 mm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
36 V |
1 |
SMARTMOS |
16 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
4.5 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
40 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 V |
1 |
3.3 V |
12.6 V |
-10 V |
FLATPACK, LOW PROFILE, FINE PITCH |
SPQFP48,.28SQ,20 |
8 V |
1.8 V |
.5 mm |
70 Cel |
10 V |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.7 V |
1 |
2.5 V |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.75 V |
2.3 V |
.4 mm |
70 Cel |
5 V |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N40 |
.8 mm |
5 mm |
e4 |
5 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
55 mA |
2.5 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
.265 ns |
|||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
55 mA |
2.5 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
.265 ns |
|||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
53 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Line Driver or Receivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
.47 ns |
|||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.465 V |
1 |
35 mA |
2.5 V |
+-2.5/+-3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
SMALL OUTLINE, LOW PROFILE |
TSSOP8,.19 |
3 V |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
3.3 V |
1.5/5.5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
Other Interface ICs |
1.5 V |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
.55 mm |
1 mm |
Not Qualified |
e4 |
30 |
260 |
1.45 mm |
||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
.9 V |
.4 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N12 |
1 |
.55 mm |
1.7 mm |
e4 |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Other Interface ICs |
.5 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
.9 mm |
2 mm |
Not Qualified |
e3 |
30 |
260 |
2.3 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
6 mA |
3.3 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
2.7 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NICKEL PALLADIUM GOLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
MATTE TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.575 V |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
1.425 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.8 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 V |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
0 V |
0 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1.1 mm |
3 mm |
Also required VDREF 0 to 5V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.1SQ,16 |
2.7 V |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 |
.4 mm |
2.6 mm |
260 |
2.6 mm |
|||||||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.2SQ,32 |
3.6 V |
.8 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 mm |
5 mm |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.2SQ,25 |
3.6 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 mm |
5 mm |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
INTERFACE CIRCUIT |
3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6.5 V |
1 |
3.3 V |
SMALL OUTLINE |
2.7 V |
1.27 mm |
85 Cel |
-25 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
e4 |
30 |
250 |
17.9 mm |
||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
2 |
.9 mm |
3 mm |
e4 |
40 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
.9 mm |
3 mm |
e4 |
3 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.