INTERFACE CIRCUIT Other Function Interface ICs 2,400+

Reset All
Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

ISO7830FDW

Texas Instruments

INTERFACE CIRCUIT

MILITARY

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

3

3

CMOS

2.5 V

SMALL OUTLINE

2.25 V

1.27 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

2

2.65 mm

7.5 mm

e4

30

260

10.3 mm

ISO7840FDW

Texas Instruments

INTERFACE CIRCUIT

MILITARY

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

4

CMOS

2.5 V

SMALL OUTLINE

2.25 V

1.27 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

2

2.65 mm

7.5 mm

IT ALSO OPERATES AT 3.3, 5 V

e4

30

260

10.3 mm

L99SD01-E

STMicroelectronics

INTERFACE CIRCUIT

GULL WING

36

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

28 V

1

13 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

6 V

.5 mm

DUAL

R-PDSO-G36

2.47 mm

7.5 mm

NOT SPECIFIED

NOT SPECIFIED

10.3 mm

L99SD01TR-E

STMicroelectronics

INTERFACE CIRCUIT

GULL WING

36

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

28 V

1

13 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

6 V

.5 mm

DUAL

R-PDSO-G36

3

2.47 mm

7.5 mm

10.3 mm

LTC4316CDD#PBF

Analog Devices

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

10

VSON

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

16.5 V

SMALL OUTLINE, VERY THIN PROFILE

12 V

2.25 V

.5 mm

70 Cel

15 V

0 Cel

MATTE TIN

DUAL

S-PDSO-N10

.8 mm

3 mm

e3

3 mm

LTC4317IDHC#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2.25 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-N16

1

.8 mm

3 mm

e3

260

5 mm

LTC6957HMS-1#TRPBF

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

12

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.45 V

1

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP12,.19

3.15 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G12

1

1.1 mm

4.039 mm

e3

3 mm

LTC6957HMS-3#TRPBF

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

12

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.45 V

1

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP12,.19

3.15 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G12

1

1.1 mm

4.039 mm

e3

3 mm

LTC6957IDD-1#TRPBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

3.45 V

1

CMOS

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC12,.12,18

3.15 V

.45 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N12

1

.8 mm

3 mm

e3

260

3 mm

LTM2810HY-S#PBF

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

36

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

5 V

GRID ARRAY

1.62 V

1 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B36

2.31 mm

6.25 mm

NOT SPECIFIED

NOT SPECIFIED

22 mm

LTM2886IY-5S#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

5 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

4.5 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B32

3

3.62 mm

11.25 mm

30

245

15 mm

MADR-009150

M/a-com Technology Solutions

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

GENERAL PURPOSE

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

3 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

1

1 mm

3 mm

e4

3 mm

MADR-009190-0001TR

M/a-com Technology Solutions

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

5 V

-5 V

SMALL OUTLINE

4.5 V

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

e3

260

9.9 mm

MAX3002EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3002EBP+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e1

30

260

2.54 mm

MAX3131EAI

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

1

1.99 mm

5.29 mm

Not Qualified

e0

10.2 mm

MAX3131EAI+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G28

1

1.99 mm

5.29 mm

Not Qualified

e3

10.2 mm

MAX3377EETD

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

UNSPECIFIED

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC14,.12,16

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

S-XDSO-N8

1

.8 mm

3 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

3 mm

MAX3766EEP+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

Display Drivers

.635 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

1.73 mm

3.9 mm

Not Qualified

e3

30

260

8.65 mm

MAX3766EEP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

5

SMALL OUTLINE, SHRINK PITCH

SOP20,.25

Display Drivers

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.73 mm

3.9 mm

Not Qualified

e0

8.65 mm

MAX7370ETG+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

VSON

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

1.8/3.3

SMALL OUTLINE, VERY THIN PROFILE

LCC24,.13SQ,16

Display Drivers

1.62 V

.4 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N24

1

.85 mm

3.5 mm

Not Qualified

e3

30

260

3.5 mm

MC33978AEK

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

2.45 mm

7.5 mm

e3

40

260

11 mm

MC33CD1020AESR2

NXP Semiconductors

INTERFACE CIRCUIT

TIN

3

e3

40

260

MC33CD1030AE

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

36 V

1

SMARTMOS

16 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

4.5 V

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MD1712FG-G

Microchip Technology

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5 V

1

3.3 V

12.6 V

-10 V

FLATPACK, LOW PROFILE, FINE PITCH

SPQFP48,.28SQ,20

8 V

1.8 V

.5 mm

70 Cel

10 V

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

MD2131K7-G

Microchip Technology

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

2.7 V

1

2.5 V

5.25 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

4.75 V

2.3 V

.4 mm

70 Cel

5 V

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N40

.8 mm

5 mm

e4

5 mm

NB4L16MMNG

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

1

55 mA

2.5 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Line Driver or Receivers

2.375 V

.5 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

S-XQCC-N16

1

1 mm

3 mm

Not Qualified

30

260

3 mm

.265 ns

NB4L16MMNR2G

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

1

55 mA

2.5 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Line Driver or Receivers

2.375 V

.5 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

S-XQCC-N16

1

1 mm

3 mm

Not Qualified

30

260

3 mm

.265 ns

NB4N527SMNR2G

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

53 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Line Driver or Receivers

3 V

.5 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

S-XQCC-N16

1

1 mm

3 mm

Not Qualified

30

260

3 mm

.47 ns

NB7L216MNG

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.465 V

1

35 mA

2.5 V

+-2.5/+-3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Line Driver or Receivers

2.375 V

.5 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

S-XQCC-N16

1

1 mm

3 mm

Not Qualified

30

260

3 mm

NLHV1T0434ZR2G

Onsemi

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

TSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

SMALL OUTLINE, LOW PROFILE

TSSOP8,.19

3 V

.65 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

e4

30

260

3 mm

NLSX4401MU1TCG

Onsemi

INTERFACE CIRCUIT

MILITARY

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

3.3 V

1.5/5.5

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

Other Interface ICs

1.5 V

.5 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N6

1

.55 mm

1 mm

Not Qualified

e4

30

260

1.45 mm

NLSX5004MUTAG

Onsemi

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

4.5 V

CHIP CARRIER, VERY THIN PROFILE

LCC12,.07X.08,16

.9 V

.4 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

R-PQCC-N12

1

.55 mm

1.7 mm

e4

30

260

2 mm

NLV9306USG

Onsemi

INTERFACE CIRCUIT

MILITARY

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TSSOP8,.12,20

Other Interface ICs

.5 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

.9 mm

2 mm

Not Qualified

e3

30

260

2.3 mm

PCA9510AD,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

6 mA

3.3 V

3/5

SMALL OUTLINE

SOP8,.25

Other Interface ICs

2.7 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PCA9548PW

NXP Semiconductors

INTERFACE CIRCUIT

NICKEL PALLADIUM GOLD

1

PCA9654EDR2G

Onsemi

INTERFACE CIRCUIT

MATTE TIN

1

e3

30

260

PI3EQX6801AZDEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1.575 V

1

1.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

1.425 V

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.8 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

PI4GTL2002UEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5 V

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

0 V

0 V

.65 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G8

1.1 mm

3 mm

Also required VDREF 0 to 5V

NOT SPECIFIED

NOT SPECIFIED

3 mm

PI4MSD5V9543AWEX

Diodes Incorporated

INTERFACE CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

PI4MSD5V9548AZDEX

Diodes Incorporated

INTERFACE CIRCUIT

30

260

PTN5110DHQZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1

.4 mm

2.6 mm

260

2.6 mm

SEC1110-A5-02-TR

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.2SQ,32

3.6 V

.8 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N16

1 mm

5 mm

5 mm

SEC1210I-CN-02-TR

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.2SQ,25

3.6 V

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1 mm

5 mm

5 mm

SI88442EC-ISR

Silicon Labs

INTERFACE CIRCUIT

3

40

260

ST8004CDR

STMicroelectronics

INTERFACE CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

1

3.3 V

SMALL OUTLINE

2.7 V

1.27 mm

85 Cel

-25 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G28

3

2.65 mm

7.5 mm

Not Qualified

ALSO OPERATES AT 5V SUPPLY

e4

30

250

17.9 mm

SY88022ALMG

Microchip Technology

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

3 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

2

.9 mm

3 mm

e4

40

260

3 mm

SY88022ALMG-TR

Microchip Technology

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

3 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

.9 mm

3 mm

e4

3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.