Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Silicon Labs |
INTERFACE CIRCUIT |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
5 |
CMOS |
5 V |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
2.375 V |
.635 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
4.89 mm |
||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
INTERFACE CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
AEC-Q100 |
5 V |
SMALL OUTLINE |
SOP8,.25 |
2.5 V |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
1.8 V |
1.8/3.3,1.8/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.05X.06,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N8 |
.6 mm |
1.2 mm |
Not Qualified |
ALSO REQUIRED 3.3V SUPPLY NOMINAL |
1.4 mm |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
1.8 V |
1.8/3.3,1.8/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N12 |
.55 mm |
1.7 mm |
Not Qualified |
ALSO REQUIRED VCC = 3.3V SUPPLY NOMINAL |
2 mm |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
4 |
1.8 V |
5.5 V |
1.8/3.3,1.8/5 |
CHIP CARRIER |
LCC16,.07X.1,16 |
1.65 V |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
3.3 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-XQCC-N16 |
1 |
.6 mm |
1.8 mm |
Not Qualified |
e4 |
30 |
260 |
2.6 mm |
|||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
2 V |
5.5 V |
2/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
1.8 V |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
2 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
1 |
.55 mm |
1.4 mm |
Not Qualified |
e4 |
30 |
260 |
1.8 mm |
|||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
5.5 V |
2/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
1.8 V |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
1 |
.55 mm |
1.4 mm |
Not Qualified |
e4 |
30 |
260 |
1.8 mm |
|||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1.8 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
1.16 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD |
BOTTOM |
S-PBGA-B25 |
3 |
1.16 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
TFBGA |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
CMOS |
3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-XBGA-B25 |
3 |
1.16 mm |
3 mm |
Not Qualified |
e1 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
36 V |
1 |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.11,20 |
7 V |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N10 |
2 |
1 mm |
.35 A |
3 mm |
LDO output range(V) : 5 |
e4 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Powerex |
INTERFACE CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
CMOS |
AEC-Q100 |
1.8 V |
1.71 V |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
ALSO REQUIRE SUPPLY FROM 2.25V TO 5.5V |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
GULL WING |
20 |
HSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
4 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SOP20,.4 |
2.97 V |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
3.55 mm |
7.5 mm |
12.83 mm |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3 V |
SMALL OUTLINE |
SOP16,.4 |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
3 |
2.64 mm |
7.5 mm |
e3 |
30 |
260 |
12.75 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3 V |
SMALL OUTLINE |
SOP16,.4 |
2.7 V |
1.27 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
3 |
2.64 mm |
7.5 mm |
e3 |
30 |
260 |
12.75 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
1 |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
3.3 V |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
Not Qualified |
ALSO OPERATES FROM 4.5 TO 5.5 V SUPPLY |
e4 |
30 |
260 |
4.905 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
e3 |
40 |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
.001 mA |
5.5 V |
5.5 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
30 |
260 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
.001 mA |
5.5 V |
5.5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
30 |
260 |
||||||||||||||||||||||||||||||||||
|
Silicon Labs |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
SMALL OUTLINE |
2.7 V |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B12 |
1 |
.625 mm |
1.39 mm |
e1 |
30 |
260 |
1.69 mm |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
GULL WING |
20 |
HSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
4 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SOP20,.4 |
2.97 V |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
3.55 mm |
7.5 mm |
12.83 mm |
||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
THROUGH-HOLE |
5 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
20 V |
1 |
BIPOLAR |
16 V |
+-16 |
-16 V |
FLANGE MOUNT |
ZIP5,.15,.2,67TB |
-20 V |
Other Interface ICs |
1.7 mm |
-16 V |
ZIG-ZAG |
R-PZFM-T5 |
Not Qualified |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1.8 V |
SMALL OUTLINE |
1.71 V |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
e3 |
30 |
260 |
10.3 mm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
1.2/3.6,1.8/5 |
Other Interface ICs |
TIN |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
INTERFACE CIRCUIT |
2A |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
3.3 V |
5.5 V |
1.8/5,3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
1.6 V |
Other Interface ICs |
2.5 V |
.65 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G5 |
1 |
1.1 mm |
1.25 mm |
Not Qualified |
BIDIRECTIONAL LEVEL SHIFTER |
e0 |
2 mm |
||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
5.5 V |
1.8/5,3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
1.6 V |
Other Interface ICs |
2.5 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G5 |
1 |
1.1 mm |
1.25 mm |
Not Qualified |
e3 |
30 |
260 |
2 mm |
||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
8 V |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G16 |
1 |
3.886 mm |
7.493 mm |
SEATED-HGT CALCULATED |
e3 |
260 |
10.363 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
4 |
.011 mA |
1.2 V |
1.2/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,16 |
Other Interface ICs |
1.1 V |
.4 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B20 |
1 |
.5 mm |
1.57 mm |
Not Qualified |
e1 |
30 |
260 |
1.97 mm |
|||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5,15 |
SMALL OUTLINE |
SOP16,.4 |
MOSFET Drivers |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
||||||||||||||||||||||||||||||
Broadcom |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
5.5 V |
1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
1.65 V |
Other Interface ICs |
1.2 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e0 |
6.5 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
BICMOS |
5.5 V |
1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
1.65 V |
Other Interface ICs |
1.2 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G20 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
6.5 mm |
||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
MATTE TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
1.8 V |
5.5 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
1.65 V |
Other Interface ICs |
1.15 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
3 |
1 mm |
4 mm |
Not Qualified |
e3 |
260 |
4 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
NO LEAD |
42 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
QUAD |
R-XQCC-N42 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
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Silicon Labs |
INTERFACE CIRCUIT |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.