10 Other Function Interface ICs 136

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Nominal Output Peak Current Limit	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCA9615DPZ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20			2.3 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G10	1	1.1 mm		3 mm		ALSO REQUIRE VDDB SUPPLY FROM 3V TO 5.5V	e4	30	260	3 mm
PCA9615DPJ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	3 V		2.3 V	.5 mm	85 Cel	5 V	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G10	1	1.1 mm		3 mm		ALSO REQUIRE VDDB SUPPLY FROM 3V TO 5.5V	e4	30	260	3 mm
NCP1094MNRG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	57 V	1							SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				0 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	3	1 mm		3 mm	Not Qualified		e3	30	260	3 mm
TPD4EUSB30DQAR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VSON	RECTANGULAR	PLASTIC/EPOXY	YES		1	4						SMALL OUTLINE, VERY THIN PROFILE					.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-N10	1	.55 mm		1 mm	Not Qualified		e4	NOT SPECIFIED	260	2.5 mm
SN6507DGQRQ1	Texas Instruments	INTERFACE CIRCUIT		GULL WING	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	36 V	1			AEC-Q100	24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	TSSOP10,.20,20			3 V	.5 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G10	2	1.1 mm		3 mm			e4		260	3 mm
NCP1093MNRG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	57 V	1							SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				0 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	3	1 mm		3 mm	Not Qualified		e3	30	260	3 mm
MAX9921AUB+	Analog Devices		AUTOMOTIVE	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				BICMOS		13.6 V		13.6	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs		.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G10	1				Not Qualified		e3	30	260
HV892K7-G	Microchip Technology	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.8 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,25			2.65 V	.65 mm	85 Cel		-25 Cel	MATTE TIN	DUAL	S-PDSO-N10		.8 mm		4 mm	Not Qualified		e3			4 mm
TIOL1123DRCR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	36 V	1				24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20			7 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	1 mm	.35 A	3 mm		LDO output range(V) : 3.3	e4		260	3 mm
TPD2S703QDSKRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	7 V	1			AEC-Q100	5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	.8 mm		2.5 mm			e4	30	260	2.5 mm
MAX13047EEVB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	2		BICMOS		1.8 V	5.5 V		CHIP CARRIER, VERY THIN PROFILE		1.65 V		1.1 V	.4 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N10	1	.55 mm		1.4 mm			e4	30	260	1.8 mm
LTC4316IMS#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS		3.3 V			SMALL OUTLINE				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10		1.1 mm		3 mm			e3			3 mm
TPD2S703QDGSRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	7 V	1			AEC-Q100	5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				4.5 V	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-G10	2	1.1 mm		3 mm			e4	NOT SPECIFIED	260	3 mm
LTC4316CMS#PBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS		3.3 V			SMALL OUTLINE				2.25 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N10		1.1 mm		3 mm			e3			3 mm
DRV2604LDGSR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.2 V	1				3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2 V	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-G10	2	1.1 mm		3 mm			e4	30	260	3 mm
LTC4316IMS#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS		3.3 V			SMALL OUTLINE				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	1.1 mm		3 mm			e3		260	3 mm
FXL2T245L10X	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	10	VBCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1				1.4 V		1.5/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.08,20		Other Interface ICs	1.1 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-XBCC-B10	1	.55 mm		1.6 mm	Not Qualified		e4	30	260	2.1 mm
LTC4304CMS#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC4304CMS#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC4316IDD#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS		3.3 V			SMALL OUTLINE, VERY THIN PROFILE				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N10		.8 mm		3 mm			e3			5 mm
LTC4316IDD#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS		3.3 V			SMALL OUTLINE, VERY THIN PROFILE				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm		3 mm			e3	30	260	3 mm
ST2329IQTR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1				2 V	5.5 V	2/5	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16	1.8 V	Other Interface ICs	1.65 V	.4 mm	85 Cel	2 V	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N10	1	.55 mm		1.4 mm	Not Qualified		e4	30	260	1.8 mm
TIOL1125DRCR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	36 V	1				24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20			7 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	1 mm	.35 A	3 mm		LDO output range(V) : 5	e4		260	3 mm
BA6294	ROHM	INTERFACE CIRCUIT		THROUGH-HOLE	10		RECTANGULAR	PLASTIC/EPOXY	NO		1							FLANGE MOUNT										SINGLE	R-PSFM-T10					Not Qualified
LTC4302CMS-1#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
IC-WKNDFN10	Laser Components	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	15 V	1							SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.4 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N10		.9 mm		4 mm		SEATED HGT-NOM				4 mm
LTC4304IMS#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC4316CDD#PBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	10	VSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS		3.3 V	16.5 V		SMALL OUTLINE, VERY THIN PROFILE		12 V		2.25 V	.5 mm	70 Cel	15 V	0 Cel	MATTE TIN	DUAL	S-PDSO-N10		.8 mm		3 mm			e3			3 mm
DRV2604LDGST	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.2 V	1				3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2 V	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-G10	2	1.1 mm		3 mm			e4	30	260	3 mm
PTIOL1125DRCR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	10	SOP	SQUARE	PLASTIC/EPOXY	YES	36 V	1				24 V			SMALL OUTLINE, HEAT SINK/SLUG				7 V	.5 mm	125 Cel		-40 Cel		DUAL	S-PDSO-N10		1 mm	.35 A	3 mm		LDO output range(V) : 5				3 mm
PTIOL112DRCR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	10	SOP	SQUARE	PLASTIC/EPOXY	YES	36 V	1				24 V			SMALL OUTLINE, HEAT SINK/SLUG				7 V	.5 mm	125 Cel		-40 Cel		DUAL	S-PDSO-N10		1 mm	.35 A	3 mm						3 mm
TPD2S701QDGSRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	7 V	1			AEC-Q100	5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				4.5 V	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-G10	2	1.1 mm		3 mm			e4	NOT SPECIFIED	260	3 mm
TPD2S701QDSKRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	7 V	1			AEC-Q100	5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	.8 mm		2.5 mm			e4	30	260	2.5 mm
TCA9537DGSR	Texas Instruments	INTERFACE CIRCUIT		GULL WING	10	SOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				1.8 V			SMALL OUTLINE				1.65 V	.5 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm			e3		260	3 mm
TIOL112DRCR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	36 V	1				24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20			7 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	1 mm	.35 A	3 mm			e4		260	3 mm
MAX9921AUB/V+	Analog Devices		AUTOMOTIVE	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				BICMOS	AEC-Q100	13.6 V		13.6	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs		.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G10	1				Not Qualified		e3	30	260
MAX9921AUB/V+T	Analog Devices		AUTOMOTIVE	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				BICMOS	AEC-Q100	13.6 V		13.6	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs		.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G10	1				Not Qualified		e3	30	260
MAX9921AUB+T	Analog Devices		AUTOMOTIVE	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				BICMOS		13.6 V		13.6	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs		.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G10	1				Not Qualified		e3	30	260
LTC4304CDD#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC4304IMS	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
LTC4304CMS	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
LTC4304IDD#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm		3 mm	Not Qualified		e0			3 mm
LTC4304CMS#TR	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
LTC4304IDD#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC4302IMS-2#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
LTC4304IDD#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC4302CMS-2#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3		260	3 mm
LTC4302IMS-1#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3		260	3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.