10 Other Function Interface ICs 136

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC4316CDD#TRPBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	10	VSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS		3.3 V			SMALL OUTLINE, VERY THIN PROFILE				2.25 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm			e3		260	3 mm
LTC4302IMS-2#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4302IMS-1#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4302CMS-1#TR	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302CMS-2#TR	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4304IMS#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302IMS-2	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302IMS-2#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4304IMS#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4304CDD#TR	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4302CMS-2	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4304IDD	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4302CMS-1#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3		260	3 mm
LTC4302CMS-1	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302IMS-1#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302IMS-1	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4304CDD	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4302CMS-2#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4316CMS#TRPBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS		3.3 V			SMALL OUTLINE				2.25 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	1.1 mm	3 mm			e3		260	3 mm
LTC4304CDD#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX6618AUB+T	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX6618AUB+	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX7306AUB+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS		3.3 V		1.8/3.3	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Display Drivers	1.62 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX1841EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			1.8 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.4 V		1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX6621AUB+	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX1740EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.25 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX1841EUB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			1.8 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.4 V		1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
MAX7306ALB+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	VSON	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS		3.3 V		1.8/3.3	SMALL OUTLINE, VERY THIN PROFILE	SOLCC10,.08,16		Display Drivers	1.62 V	.4 mm	125 Cel		-40 Cel	GOLD NICKEL	DUAL	S-XDSO-N10	1	.8 mm	2 mm	Not Qualified		e4	30	260	2 mm
MAX1741EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX13047EEVB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	2	BICMOS		1.8 V	5.5 V	1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16	1.65 V	Other Interface ICs	1.1 V	.4 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N10	1	.55 mm	1.4 mm	Not Qualified		e4	30	260	1.8 mm
MAX14834ETB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1	BICMOS		24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.75 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm			e3	30	260	3 mm
MAX7306ALB+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	VSON	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS		3.3 V		1.8/3.3	SMALL OUTLINE, VERY THIN PROFILE	SOLCC10,.08,16		Display Drivers	1.62 V	.4 mm	125 Cel		-40 Cel	GOLD NICKEL	DUAL	S-XDSO-N10	1	.8 mm	2 mm	Not Qualified		e4	30	260	2 mm
MAX1840EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			1.8 V	5.5 V	1.8,1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	1.4 V	Other Interface ICs	1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX6621AUB+T	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX6618AUB+TG126	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm			e3	30	260	3 mm
MAX7306AUB+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS		3.3 V		1.8/3.3	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Display Drivers	1.62 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX1840EUB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			1.8 V	5.5 V	1.8,1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	1.4 V	Other Interface ICs	1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
NB4N855SMR4G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1			3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
NB4N855SMR4	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1			3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	85 Cel		-40 Cel	Tin/Lead (Sn80Pb20)	DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified		e0	30	235	3 mm
FXL2TD245L10X	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1				3.6 V	1.5/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.08,20	1.1 V	Other Interface ICs	1.1 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N10	1	.55 mm	1.6 mm	Not Qualified		e4	30	260	2.1 mm
NCP1094MNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	57 V	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				0 V	.5 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N10		1 mm	3 mm	Not Qualified					3 mm
NCP1093MNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	57 V	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				0 V	.5 mm	85 Cel		-40 Cel	TIN	DUAL	S-PDSO-N10	3	1 mm	3 mm	Not Qualified		e3	30	260	3 mm
VBG15NB22T5SP-E	STMicroelectronics	INTERFACE CIRCUIT		GULL WING	10	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	24 V	1		AEC-Q100	14 V			SMALL OUTLINE				5.2 V	1.27 mm					DUAL	R-PDSO-G10		3.65 mm	7.5 mm						9.4 mm
ST2129QTR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	2			1.8 V	5.5 V	1.8/3.3,1.8/5	CHIP CARRIER	LCC10,.06X.07,16	1.65 V	Other Interface ICs	1.65 V	.4 mm	85 Cel	1.8 V	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	R-XQCC-N10	1	.55 mm	1.4 mm	Not Qualified		e4	30	260	1.8 mm
VBG15NB22T5TR-E	STMicroelectronics	INTERFACE CIRCUIT		GULL WING	10	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	24 V	1		AEC-Q100	14 V			SMALL OUTLINE				5.2 V	1.27 mm					DUAL	R-PDSO-G10		3.65 mm	7.5 mm						9.4 mm
ST2329AQTR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1					2/5	SMALL OUTLINE, VERY THIN PROFILE	LCC10,.06X.07,16		Other Interface ICs	1.65 V	.4 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-N10	1	.55 mm	1.4 mm	Not Qualified		e4	30	260	1.8 mm
NTS0103GU10,115	NXP Semiconductors		AUTOMOTIVE	NO LEAD	10	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES							1.8/3.3,2.5/5	CHIP CARRIER	LCC10,.06X.07,16		Other Interface ICs		.4 mm	125 Cel		-40 Cel		QUAD	R-PQCC-N10	1			Not Qualified			30	260
NTS0103GU10	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1			1.8 V		1.8/3.3,2.5/5	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16		Other Interface ICs	1.65 V	.4 mm	125 Cel		-40 Cel		QUAD	R-PQCC-N10	1	.5 mm	1.4 mm	Not Qualified	IT ALSO REQUIRES 2.3 TO 5.5 V		30	260	1.8 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.