24 Other Function Interface ICs 305

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CCE4502CC3.3B-CSP	Renesas Electronics	DIGITAL I/O MODULE		BALL	24	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	36 V	1	HV-CMOS	24 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA24,4X6,16	9 V	.4 mm	105 Cel	-40 Cel		BOTTOM	R-PBGA-B24		.5834 mm	1.98 mm						2.572 mm
CCE4502CC5L-CSP	Renesas Electronics	DIGITAL I/O MODULE		BALL	24	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	36 V	1	HV-CMOS	24 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA24,4X6,16	9 V	.4 mm	105 Cel	-40 Cel		BOTTOM	R-PBGA-B24		.5834 mm	1.98 mm						2.572 mm
CCE4502CC5B-CSP	Renesas Electronics	DIGITAL I/O MODULE		BALL	24	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	36 V	1	HV-CMOS	24 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA24,4X6,16	9 V	.4 mm	105 Cel	-40 Cel		BOTTOM	R-PBGA-B24		.5834 mm	1.98 mm						2.572 mm
CCE4502CC3.3B-QFN	Renesas Electronics	DIGITAL I/O MODULE		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	36 V	1	HV-CMOS	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	9 V	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N24		.8 mm	4 mm						4 mm
CCE4502CC5B-QFN	Renesas Electronics	DIGITAL I/O MODULE		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	36 V	1	HV-CMOS	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	9 V	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N24		.8 mm	4 mm						4 mm
CCE4502CC3.3L-QFN	Renesas Electronics	DIGITAL I/O MODULE		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	36 V	1	HV-CMOS	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	9 V	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N24		.8 mm	4 mm						4 mm
ISL58303DRTZ-T7A	Renesas Electronics	INTERFACE CIRCUIT		NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES		1				CHIP CARRIER						MATTE TIN	QUAD	S-XQCC-N24	1					e3	30	260
UPD168830MA-6A5-E1-A	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1	MOS	5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		4.5 V	.5 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G24		1.2 mm	4.4 mm			e6			6.65 mm
ZIOL2201BI1R	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES	36 V	1	CMOS			CHIP CARRIER	LCC24,.16SQ,20	8 V	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N24	1	.9 mm	4 mm			e3		260	4 mm
ZIOL2411BI1R	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES	36 V	1	CMOS			CHIP CARRIER	LCC24,.16SQ,20	8 V	.5 mm	85 Cel	-40 Cel	Tin (Sn)	QUAD	S-XQCC-N24	1	.9 mm	4 mm			e3	NOT SPECIFIED	260	4 mm
ZIOL2401	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES	36 V	1	CMOS			CHIP CARRIER	LCC24,.16SQ,20	8 V	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N24		.9 mm	4 mm						4 mm
ZIOL2411BI1W	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES	36 V	1	CMOS			CHIP CARRIER	LCC24,.16SQ,20	8 V	.5 mm	85 Cel	-40 Cel	Tin (Sn)	QUAD	S-XQCC-N24	1	.9 mm	4 mm			e3	NOT SPECIFIED	260	4 mm
ZIOL2201BI1W	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES	36 V	1	CMOS			CHIP CARRIER	LCC24,.16SQ,20	8 V	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N24	1	.9 mm	4 mm			e3		260	4 mm
B7AH-R6D53	Omron	Digital O/P Module	COMMERCIAL	THROUGH-HOLE	24	SIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	1	HYBRID	5 V		IN-LINE	SIP24/26,.18,70	4.5 V	1.8 mm	55 Cel	-10 Cel		SINGLE	R-PSIP-T24		20 mm	9 mm		LG-MAX; WD-MAX				51 mm
B7AH-R6D58	Omron	Digital O/P Module	COMMERCIAL	THROUGH-HOLE	24	SIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	1	HYBRID	5 V		IN-LINE	SIP24/26,.18,70	4.5 V	1.8 mm	55 Cel	-10 Cel		SINGLE	R-PSIP-T24		20 mm	9 mm		LG-MAX; WD-MAX				51 mm
LG1625AXF	Broadcom	INTERFACE CIRCUIT		GULL WING	24	QFP	SQUARE	PLASTIC/EPOXY	YES		1	BIPOLAR		-5.2 V	FLATPACK			1.27 mm			TIN LEAD	QUAD	S-PQFP-G24		2.3876 mm	9.2456 mm	Not Qualified		e0	30	240	9.2456 mm
LG1627BXC	Broadcom	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	24	QFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES		1			-5.2 V	FLATPACK			.762 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-CQFP-G24			7.112 mm	Not Qualified		e0	30	240	7.112 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.