Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
36 V |
1 |
CMOS |
CHIP CARRIER |
LCC24,.16SQ,20 |
8 V |
.5 mm |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
S-XQCC-N24 |
1 |
.9 mm |
4 mm |
e3 |
NOT SPECIFIED |
260 |
4 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2.625 V |
1 |
2 |
2.5 V |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
3 V |
2.375 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N24 |
3 |
.8 mm |
4 mm |
ALSO OPERATES WITH 3V TO 3.6V |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
10 |
.005 mA |
3.3 V |
2.64 V |
2.5,3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
2.36 V |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
2.5 V |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
7.8 mm |
|||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
3.3 V |
2.64 V |
2.5,3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
2.36 V |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
2.5 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
7.8 mm |
||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
4.5 V |
.65 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
2 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
8.65 mm |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.2SQ,25 |
3.6 V |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 mm |
5 mm |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
DIGITAL I/O MODULE |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
36 V |
1 |
HV-CMOS |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
9 V |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
.8 mm |
4 mm |
4 mm |
||||||||||||||||||||||||||||||||||||
|
Dialog Semiconductor |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
32 V |
1 |
HVCMOS |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
8 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
.8 mm |
4 mm |
4 mm |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.2SQ,25 |
3.6 V |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 mm |
5 mm |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
DIGITAL I/O MODULE |
BALL |
24 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
36 V |
1 |
HV-CMOS |
24 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,4X6,16 |
9 V |
.4 mm |
105 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
.5834 mm |
1.98 mm |
2.572 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
COMMERCIAL |
BALL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
6 |
SPI |
5 V |
GRID ARRAY |
BGA24,6X9,40 |
3 V |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
R-PBGA-B24 |
3.11 mm |
6.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
1 |
.8 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.2SQ,25 |
3.6 V |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 mm |
5 mm |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
1 mm |
4 mm |
Not Qualified |
e3 |
260 |
4 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.9 V |
1 |
1.8 V |
SMALL OUTLINE, SHRINK PITCH |
1.7 V |
.65 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G24 |
3 |
2 mm |
5.3 mm |
ALSO OPERATE WITH 2.5V, 3.3V AND 5V SUPPLY VOLTAGE |
e3 |
30 |
260 |
8.2 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.9 V |
1 |
1.8 V |
SMALL OUTLINE, SHRINK PITCH |
1.7 V |
.65 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G24 |
3 |
2 mm |
5.3 mm |
ALSO OPERATE WITH 2.5V, 3.3V AND 5V SUPPLY VOLTAGE |
e3 |
30 |
260 |
8.2 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
35 V |
2 |
30 V |
-10,30 |
-10 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Interface ICs |
15 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
6 |
SPI |
5 V |
GRID ARRAY |
BGA24,6X9,40 |
3 V |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3.11 mm |
6.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
2 |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
ALSO OPERATES WITH 3V TO 3.6V |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2.64 V |
10 |
2.5 V |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
2.36 V |
.65 mm |
85 Cel |
3.3 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
7.8 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
6 |
SPI |
5 V |
GRID ARRAY |
BGA24,6X9,40 |
3 V |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3.11 mm |
6.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
3.3 V |
3.3 |
CHIP CARRIER |
LCC24,.13SQ,20 |
Other Interface ICs |
.5 mm |
80 Cel |
-20 Cel |
QUAD |
S-PQCC-N24 |
1 |
Not Qualified |
30 |
260 |
||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
e0 |
4 mm |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
4.3 V |
28 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
3.8 V |
.65 mm |
13.5 V |
DUAL |
R-PDSO-N24 |
3 |
1 mm |
6 mm |
SEATED HGT-NOM |
9.5 mm |
||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
1 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
1 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
4.3 V |
28 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
3.8 V |
.65 mm |
13.5 V |
MATTE TIN |
DUAL |
R-PDSO-N24 |
3 |
1 mm |
6 mm |
SEATED HGT-NOM |
e3 |
9.5 mm |
||||||||||||||||||||||||||||||||
|
Device Engineering |
INTERFACE CIRCUIT |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
1 |
BICMOS |
3.3 V |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
4.5 V |
2.97 V |
.65 mm |
5 V |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.1938 mm |
4.3942 mm |
e4 |
30 |
260 |
7.7978 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
3.3 V |
3.3 |
CHIP CARRIER |
LCC24,.13SQ,20 |
Other Interface ICs |
.5 mm |
80 Cel |
-20 Cel |
QUAD |
S-PQCC-N24 |
1 |
Not Qualified |
30 |
260 |
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|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
1.8/3.3 |
SMALL OUTLINE, VERY THIN PROFILE |
LCC24,.13SQ,16 |
Display Drivers |
1.62 V |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N24 |
1 |
.85 mm |
3.5 mm |
Not Qualified |
e3 |
30 |
260 |
3.5 mm |
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|
Microchip Technology |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.2SQ,25 |
3.6 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 mm |
5 mm |
5 mm |
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|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
45 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
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Texas Instruments |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
4.5 V |
4.5 V |
.65 mm |
70 Cel |
5 V |
0 Cel |
DUAL |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
7.8 mm |
||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
4.5 V |
4.5 V |
.65 mm |
85 Cel |
5 V |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
7.8 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
55 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
4.5 V |
4.5 V |
.65 mm |
85 Cel |
5 V |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
7.8 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
4.5 V |
4.5 V |
.65 mm |
70 Cel |
5 V |
0 Cel |
DUAL |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
7.8 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.