HVSON Other Function Interface ICs 147

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Screening Level	Interface Standard	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Nominal Output Peak Current Limit	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NCP1094MNRG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	57 V	1								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				0 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	3	1 mm		3 mm	Not Qualified		e3	30	260	3 mm
SN6507DGQRQ1	Texas Instruments	INTERFACE CIRCUIT		GULL WING	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	36 V	1			AEC-Q100		24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	TSSOP10,.20,20			3 V	.5 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G10	2	1.1 mm		3 mm			e4		260	3 mm
LTC6957IDD-2#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS		EIA-644-A; TIA-644-A	3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3	30	260	3 mm
DS2484Q+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1					5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20			1.71 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-N8	1	.8 mm		2 mm			e3	30	260	3 mm
NCP1093MNRG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	57 V	1								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				0 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	3	1 mm		3 mm	Not Qualified		e3	30	260	3 mm
PCA9617ATPZ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS			.95 V	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		2.2 V		.8 V	.5 mm	85 Cel	2.5 V	-40 Cel		DUAL	R-PDSO-N8	1	.8 mm		2 mm		ALSO OPERATES WITH 2.2 V TO 5.5 V			260	3 mm
LTC6957IDD-2#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3		260	3 mm
LTC6957IDD-3#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3	30	260	3 mm
PCA9517ATP,147	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS			3.3 V		3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		Line Driver or Receivers	.9 V	.5 mm	85 Cel		-40 Cel		DUAL	R-PDSO-N8	1	.8 mm		2 mm	Not Qualified	OPERATES WITH 2.7 V TO 5.5 V		30	260	3 mm
DS2484Q+U	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1					5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				1.71 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-N8	1	.8 mm		2 mm			e3	30	260	3 mm
HV892K7-G	Microchip Technology	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.8 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,25			2.65 V	.65 mm	85 Cel		-25 Cel	MATTE TIN	DUAL	S-PDSO-N10		.8 mm		4 mm	Not Qualified		e3			4 mm
TIOL1123DRCR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	36 V	1					24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20			7 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	1 mm	.35 A	3 mm		LDO output range(V) : 3.3	e4		260	3 mm
TPD2S703QDSKRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	7 V	1			AEC-Q100		5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	.8 mm		2.5 mm			e4	30	260	2.5 mm
LTC4301LIDD#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm
MAX258ATA+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		BICMOS			5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N8	1	.8 mm		2 mm			e3	30	260	3 mm
LTC6957IDD-4#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3			3 mm
LTC6957IDD-1#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS		EIA-644-A; TIA-644-A	3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3	30	260	3 mm
TPS25821DSSR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1					5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N12	1	.8 mm		2 mm			e4	30	260	3 mm
TPS25820DSSR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1					5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N12	1	.8 mm		2 mm			e4	30	260	3 mm
TPS25821DSST	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1					5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N12	1	.8 mm		2 mm			e4	30	260	3 mm
TPS25820DSST	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1					5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N12	1	.8 mm		2 mm			e4	30	260	3 mm
UJA1169TK/FZ	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	1			AEC-Q100		13 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.8 V	.5 mm				NICKEL PALLADIUM GOLD SILVER	DUAL	R-PDSO-N20	1	1 mm		3.5 mm			e4	30	260	5.5 mm
LTC6957IDD-3#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3		260	3 mm
TPD8E003DQDR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		1	8							SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE					.4 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	R-PDSO-N8	1	.8 mm		1.35 mm	Not Qualified		e4	30	260	1.7 mm
DS28E18Q+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	1								SMALL OUTLINE, HEAT SINK/SLUG	SOLCC8,.12,20			2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-N8	1	.8 mm		2 mm			e3	30	260	3 mm
TIOL1125DRCR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	36 V	1					24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20			7 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	1 mm	.35 A	3 mm		LDO output range(V) : 5	e4		260	3 mm
BTS56033LBAAUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	24	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1			AEC-Q100		4.3 V	28 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		5.5 V		3.8 V	.65 mm		13.5 V			DUAL	R-PDSO-N24	3	1 mm		6 mm		SEATED HGT-NOM				9.5 mm
MAX14838GTC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1		BICMOS			24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				7 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3	30	260	3 mm
BTS54220LBEAUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	24	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1			AEC-Q100		4.3 V	28 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		5.5 V		3.8 V	.65 mm		13.5 V		MATTE TIN	DUAL	R-PDSO-N24	3	1 mm		6 mm		SEATED HGT-NOM	e3			9.5 mm
IC-WKNDFN10	Laser Components	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	15 V	1								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.4 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N10		.9 mm		4 mm		SEATED HGT-NOM				4 mm
LTC4317IDHC#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N16	1	.8 mm		3 mm			e3		260	5 mm
LTC6957IDD-1#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3		260	3 mm
MAX3377EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4		BICMOS			3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm		3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
PI6ULS5V9511AZWEX	Diodes Incorporated	BUS BUFFERS		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20			2.7 V	.5 mm	85 Cel		-40 Cel		DUAL	R-PDSO-N8		.65 mm		2 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
TPD2S701QDSKRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	7 V	1			AEC-Q100		5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	.8 mm		2.5 mm			e4	30	260	2.5 mm
TIOL112DRCR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	36 V	1					24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20			7 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	1 mm	.35 A	3 mm			e4		260	3 mm
DS2485Q+T	Analog Devices	INTERFACE CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V	1		BICMOS			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38			2.97 V	.95 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N6	1	.8 mm		3 mm			e3	30	260	3 mm
DS2485Q+U	Analog Devices	INTERFACE CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V	1		BICMOS			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38			2.97 V	.95 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N6	1	.8 mm		3 mm			e3	30	260	3 mm
DS2483Q+U	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1					5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N8	1	.8 mm		2 mm			e3	30	260	3 mm
DS2483Q+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1					1.8 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				1.71 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N8	1	.8 mm		2 mm			e3	30	260	3 mm
LTC4315CDE#PBF	Analog Devices	BUS BUFFERS		NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20			2.9 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-N12	1	.8 mm		3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4 mm
LTC4315CDE#TRPBF	Analog Devices	BUS BUFFERS		NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS			3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20			2.9 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-N12	1	.8 mm		3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4 mm
LTC4304CDD#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC4301LCDD	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	S-PDSO-N8	1	.8 mm		3 mm	Not Qualified		e0			3 mm
LTC4303IDD#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-N8	1	.8 mm		3 mm	Not Qualified		e0			3 mm
LTC4304IDD#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm		3 mm	Not Qualified		e0			3 mm
LTC4304IDD#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC4304IDD#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.