HVSON Other Function Interface ICs 147

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC4315IDE#PBF	Analog Devices	BUS BUFFERS		NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS	3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20			2.9 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N12	1	.8 mm	3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4 mm
LTC4317IDHC#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N16	1	.8 mm	3 mm			e3		260	5 mm
LTC4301LCDD#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4317CDHC#PBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.25 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-N16		.8 mm	3 mm			e3			5 mm
LTC4304CDD#TR	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4303CDD#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4304IDD	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4303CDD	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4303IDD#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4303IDD	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4303CDD#TR	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4303IDD#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4301LIDD#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4301LIDD#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4303CDD#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4301LIDD	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4301LCDD#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC6957IDD-4#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1	CMOS	3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3		260	3 mm
LTC4304CDD	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e0			3 mm
LTC4317CDHC#TRPBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.25 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-N16	1	.8 mm	3 mm			e3		260	5 mm
LTC4315IDE#TRPBF	Analog Devices	BUS BUFFERS		NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS	3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20			2.9 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N12	1	.8 mm	3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4 mm
LTC4304CDD#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3376EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX13042EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	2.2 V	Other Interface ICs	1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3390EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX3375EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX3373EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX3392EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX7304ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				1.62 V	.4 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N24	1	.85 mm	3.5 mm			e3	30	260	3.5 mm
MAX3378EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX14839GTC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.75 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
DS28E18Q+U	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	1						SMALL OUTLINE, HEAT SINK/SLUG	SOLCC8,.12,20			2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-N8	1	.8 mm	2 mm			e3	30	260	3 mm
MAX3391EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX14834ETB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.75 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm			e3	30	260	3 mm
MAX3393EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX14838GTC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				7 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
MAX3379EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX13044EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	2.2 V	Other Interface ICs	1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14		.8 mm	3 mm	Not Qualified		e3			3 mm
MAX3374EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX14839GTC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.75 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
MAX13045EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	2.2 V	Other Interface ICs	1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14		.8 mm	3 mm	Not Qualified		e3			3 mm
MAX3372EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX13042EETD+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		2.2 V		1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14	1	.8 mm	3 mm			e3	30	260	3 mm
NCP1094MNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	57 V	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				0 V	.5 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N10		1 mm	3 mm	Not Qualified					3 mm
NCP1093MNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	57 V	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				0 V	.5 mm	85 Cel		-40 Cel	TIN	DUAL	S-PDSO-N10	3	1 mm	3 mm	Not Qualified		e3	30	260	3 mm
STHS4257LDB6E	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES		1					-48 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE					.5 mm	85 Cel		-40 Cel	PURE TIN/NICKEL PALLADIUM GOLD	DUAL	S-XDSO-N8		1 mm	3 mm	Not Qualified		e3/e4	40	260	3 mm
STHS4257ADB6F	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES		1					-48 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE					.5 mm	85 Cel		-40 Cel	PURE TIN/NICKEL PALLADIUM GOLD	DUAL	S-XDSO-N8		1 mm	3 mm	Not Qualified		e3/e4	40	260	3 mm
STHS4257A1DB6E	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES		1					-48 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE					.5 mm	85 Cel		-40 Cel	PURE TIN/NICKEL PALLADIUM GOLD	DUAL	S-XDSO-N8		1 mm	3 mm	Not Qualified		e3/e4	40	260	3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.