LFBGA Other Function Interface ICs 15

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CF4320HZKFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	114	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1			.01 mA	3.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH				1.65 V	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B114	3	1.4 mm	5.5 mm	Not Qualified		e1	30	260	16 mm
SCAN921023SLC/NOPB	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		CMOS	90 mA	3.3 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32		Line Driver or Receivers	3 V	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B49	4	1.5 mm	7 mm	Not Qualified		e1	30	260	7 mm
SCAN921224SLC	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		CMOS	130 mA	3.3 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32		Line Driver or Receivers	3 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B49	3	1.5 mm	7 mm	Not Qualified		e0	20	235	7 mm
CF4320HGKFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	114	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH				1.65 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B114	2	1.4 mm	5.5 mm	Not Qualified		e0	20	235	16 mm
SCAN921023SLC	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		CMOS	90 mA	3.3 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32		Line Driver or Receivers	3 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B49	3	1.5 mm	7 mm	Not Qualified		e0	20	235	7 mm
SCAN921224SLC/NOPB	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		CMOS	130 mA	3.3 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32		Line Driver or Receivers	3 V	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B49	4	1.5 mm	7 mm	Not Qualified		e1	30	260	7 mm
DS560DF810ALUR	Texas Instruments	INTERFACE CIRCUIT		BALL	135	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES		1	8			1.2 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA135,9X15,32				.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B135	3	1.55 mm	8 mm		ALSO REQUIRED 1.8V SUPPLY NOMINAL	e1		260	13 mm
DS560DF810ALUT	Texas Instruments	INTERFACE CIRCUIT		BALL	135	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES		1	8			1.2 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA135,9X15,32				.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B135	3	1.55 mm	8 mm		ALSO REQUIRED 1.8V SUPPLY NOMINAL	e1		260	13 mm
SN74LV4320AGKFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	114	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS	.01 mA			1.8/5,3.3/5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA114,6X19,32		Other Interface ICs	1.65 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B114	2	1.4 mm	5.5 mm	Not Qualified		e0	20	235	16 mm
SN74LV4320AZKFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	114	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS	.01 mA			1.8/5,3.3/5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA114,6X19,32		Other Interface ICs	1.65 V	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B114	3	1.4 mm	5.5 mm	Not Qualified		e1	30	260	16 mm
PI2EQX3202BNBE	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	84	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1				1.5 V		1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA84,10X10,32		Other Interface ICs	1.4 V	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B84	3	1.46 mm	9 mm	Not Qualified		e1			9 mm
PI2EQX3202BNBEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	84	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1				1.5 V		1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA84,10X10,32		Other Interface ICs	1.4 V	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B84	3	1.46 mm	9 mm	Not Qualified		e1			9 mm
DS1862B	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	LFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V	3.6 V	1.5/3.3,3/5.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA25,5X5,30	1.6 V	Display Drivers	2.9 V	.8 mm	100 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B25	3	1.5 mm	5 mm	Not Qualified		e0			5 mm
DS1862B+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	LFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V	3.6 V	1.5/3.3,3/5.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA25,5X5,30	1.6 V	Display Drivers	2.9 V	.8 mm	100 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B25	3	1.5 mm	5 mm	Not Qualified		e1	30	260	5 mm
DS1862B+T&R	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	LFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V	3.6 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.6 V		2.9 V	.8 mm	100 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B25	3	1.5 mm	5 mm	Not Qualified		e1	30	260	5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.