Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
54 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
3.3/5,9/18 |
SMALL OUTLINE, SHRINK PITCH |
SSOP54,.4 |
Peripheral Drivers |
3 V |
.65 mm |
125 Cel |
-40 Cel |
8 |
TIN |
DUAL |
R-PDSO-G54 |
3 |
2.45 mm |
7.5 mm |
Not Qualified |
ALSO REQUIRES A SUPPLY OF 5V TO 36V |
e3 |
40 |
260 |
17.9 mm |
||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G32 |
3 |
2.45 mm |
7.5 mm |
e3 |
11 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
3.3 V |
26 V |
SMALL OUTLINE, SHRINK PITCH |
8 V |
3.1 V |
.65 mm |
125 Cel |
13 V |
-40 Cel |
TIN |
DUAL |
R-PDSO-G32 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
40 |
260 |
11 mm |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
54 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
3.3/5,9/18 |
SMALL OUTLINE, SHRINK PITCH |
SSOP54,.4 |
Peripheral Drivers |
3 V |
.65 mm |
125 Cel |
-40 Cel |
8 |
TIN |
DUAL |
R-PDSO-G54 |
3 |
2.45 mm |
7.5 mm |
Not Qualified |
ALSO REQUIRES A SUPPLY OF 5V TO 36V |
e3 |
40 |
260 |
17.9 mm |
||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
48 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
1 |
MOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG |
4.75 V |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N48 |
3 |
e3 |
40 |
260 |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
3.3 V |
26 V |
SMALL OUTLINE, SHRINK PITCH |
8 V |
3.1 V |
.65 mm |
125 Cel |
13 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G32 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
30 |
220 |
11 mm |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
5 V |
FLATPACK, LOW PROFILE |
4.8 V |
.8 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G32 |
3 |
1.6 mm |
7 mm |
30 |
250 |
7 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7/18 |
FLATPACK |
QFP64,.47SQ,20 |
Other Interface ICs |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
48 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
1 |
MOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG |
4.75 V |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N48 |
3 |
e3 |
40 |
260 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
7/18 |
FLATPACK |
QFP64,.47SQ,20 |
Other Interface ICs |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
3.3 V |
26 V |
SMALL OUTLINE, SHRINK PITCH |
8 V |
3.1 V |
.65 mm |
125 Cel |
13 V |
-40 Cel |
TIN |
DUAL |
R-PDSO-G32 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
40 |
260 |
11 mm |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5,7/17 |
SMALL OUTLINE |
SOP16,.4 |
Peripheral Drivers |
1.27 mm |
125 Cel |
-40 Cel |
5 |
Matte Tin (Sn) |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5,7/17 |
SMALL OUTLINE |
SOP16,.4 |
Peripheral Drivers |
1.27 mm |
125 Cel |
-40 Cel |
5 |
Matte Tin (Sn) |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
32 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
SMALL OUTLINE |
3 V |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G32 |
3 |
2.45 mm |
7.5 mm |
Not Qualified |
e3 |
40 |
260 |
10 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
2.65 mm |
7.5 mm |
Not Qualified |
11 mm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
e3 |
40 |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.5 V |
.65 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.5 V |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
7.8 mm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.5 V |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
7.8 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.5 V |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
5 mm |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N24 |
1 mm |
3 mm |
Not Qualified |
3 mm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
2.5 V |
1.27 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G24 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
30 |
260 |
15.4 mm |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
44 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
AEC-Q100 |
4.85 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.45 V |
.65 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N44 |
1 mm |
9 mm |
ALSO REQUIRED VBAT = 4.75V TO 60V |
9 mm |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
2.5 V |
1.27 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G24 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
30 |
260 |
15.4 mm |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
44 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
AEC-Q100 |
4.85 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.45 V |
.65 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N44 |
1 mm |
9 mm |
ALSO REQUIRED VBAT = 4.75V TO 60V |
9 mm |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
2.5 V |
1.27 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G24 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
30 |
260 |
15.4 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.5 V |
.65 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
28 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
BIPOLAR |
UNCASED CHIP |
3 V |
125 Cel |
-40 Cel |
UPPER |
R-XUUC-N28 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
44 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BIPOLAR |
3.3/5 |
FLATPACK |
QFP44,.5SQ,32 |
Display Drivers |
3 V |
.8 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQFP-G44 |
2.45 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
1 |
AEC-Q100 |
13.5 V |
5.25 V |
SMALL OUTLINE, SHRINK PITCH |
4.75 V |
5.5 V |
.65 mm |
125 Cel |
5 V |
-40 Cel |
NICKEL GOLD PALLADIUM SILVER |
DUAL |
R-PDSO-G16 |
2A |
2 mm |
5.3 mm |
6.2 mm |
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|
Nexperia |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
AEC-Q100 |
GENERAL PURPOSE |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
1.2 V |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N20 |
1 |
1 mm |
2.5 mm |
e4 |
30 |
260 |
4.5 mm |
|||||||||||||||||||||||||||||
|
Nexperia |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
GENERAL PURPOSE |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
1.2 V |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N20 |
1 |
1 mm |
2.5 mm |
e4 |
30 |
260 |
4.5 mm |
||||||||||||||||||||||||||||||
|
Nexperia |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
AEC-Q100 |
GENERAL PURPOSE |
1.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
1.2 V |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G20 |
1 |
1.1 mm |
4.4 mm |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||
|
Nexperia |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
GENERAL PURPOSE |
1.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
1.2 V |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G20 |
1 |
1.1 mm |
4.4 mm |
e4 |
30 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
.85 mm |
6 mm |
Not Qualified |
e0 |
6 mm |
|||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
26 V |
1 |
BICMOS |
14 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
6 V |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N36 |
1 |
.8 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
1.62 V |
.635 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
e3 |
4.89 mm |
||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
10 |
HTSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
1.8/3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Display Drivers |
1.62 V |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
3 mm |
|||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SEGMENT |
YES |
5.5 V |
1 |
CMOS |
AEC-Q100 |
7-DIGIT |
3.3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
7 |
Display Drivers |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
COMMON-ANODE |
e3 |
30 |
260 |
6 mm |
||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N28 |
.8 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
.85 mm |
6 mm |
Not Qualified |
e3 |
6 mm |
||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
Digital I/P Module |
AUTOMOTIVE |
GULL WING |
28 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
36 V |
1 |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
7 V |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
1 |
1.1 mm |
4.4 mm |
e3 |
30 |
260 |
9.7 mm |
||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SEGMENT |
YES |
5.5 V |
1 |
CMOS |
AEC-Q100 |
7-DIGIT |
3.3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
7 |
Display Drivers |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
COMMON-ANODE |
e3 |
30 |
260 |
6 mm |
||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.62 V |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
IN-LINE |
2.5 V |
2.54 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e0 |
245 |
34.795 mm |
|||||||||||||||||||||||||||||||||
|
Maxim Integrated |
Digital I/P Module |
AUTOMOTIVE |
GULL WING |
28 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
36 V |
1 |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
7 V |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
1 |
1.1 mm |
4.4 mm |
e3 |
30 |
260 |
9.7 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.