Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
13.5 V |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6.2 mm |
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|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.5 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-XQCC-N28 |
.6 mm |
5 mm |
e0 |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.63 V |
1 |
CMOS |
2.5 V |
GRID ARRAY, LOW PROFILE |
2.37 V |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
1.47 mm |
15 mm |
IT ALSO REQUIRES 3.3V |
15 mm |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
114 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.65 V |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B114 |
2 |
1.4 mm |
5.5 mm |
Not Qualified |
e0 |
20 |
235 |
16 mm |
||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 V |
1 |
1.8 V |
CHIP CARRIER |
1.6 V |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
.4 mm |
6 mm |
Not Qualified |
6 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Display Drivers |
2.9 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||
Texas Instruments |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BIPOLAR |
20 V |
20 |
SMALL OUTLINE |
SOP16,.4 |
Other Interface ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Display Drivers |
2.9 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N20 |
1 mm |
4 mm |
Not Qualified |
4 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.2 V |
1 |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2 V |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
S-PDSO-G10 |
2 |
1.1 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
46 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Display Drivers |
2.9 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
55 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.5 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-XBGA-B9 |
1 |
.625 mm |
1.44 mm |
e1 |
30 |
260 |
1.44 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
101 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B101 |
3 |
1.03 mm |
6 mm |
e1 |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
1 |
1.85 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
1.75 V |
.5 mm |
110 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G80 |
3 |
1.2 mm |
12 mm |
e4 |
30 |
260 |
12 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
5.2 V |
1 |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-XBGA-B9 |
1 |
.625 mm |
1.44 mm |
e1 |
30 |
260 |
1.44 mm |
||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
49 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
90 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA49,7X7,32 |
Line Driver or Receivers |
3 V |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B49 |
3 |
1.5 mm |
7 mm |
Not Qualified |
e0 |
20 |
235 |
7 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.62 V |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B25 |
1 |
.675 mm |
2.015 mm |
Not Qualified |
e1 |
30 |
260 |
2.015 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
46 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Display Drivers |
2.9 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.3 V |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N56 |
2 |
.8 mm |
5 mm |
e3 |
30 |
260 |
11 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N56 |
2 |
.8 mm |
5 mm |
HOST SIDE I/O SUPPLY VOLTAGE= 1.8V TO 3.3V |
e3 |
30 |
260 |
11 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.55 V |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.6 V |
1 |
1.5 V |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
1.4 V |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
14 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Display Drivers |
2.9 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
9.9 V |
1 |
9 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
3.5 V |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.625 mm |
1.29 mm |
e1 |
30 |
260 |
1.99 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
55 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.5 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-XQCC-N28 |
.6 mm |
5 mm |
e0 |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
45 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
13.5 V |
1 |
12 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
3.5 V |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.625 mm |
1.29 mm |
e1 |
30 |
260 |
1.99 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N48 |
3 |
.8 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N48 |
3 |
.8 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N56 |
2 |
.8 mm |
5 mm |
HOST SIDE I/O SUPPLY VOLTAGE= 1.8V TO 3.3V |
e3 |
30 |
260 |
11 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N48 |
3 |
.8 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
0 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e4 |
30 |
260 |
6.2 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
49 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
130 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA49,7X7,32 |
Line Driver or Receivers |
3 V |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B49 |
4 |
1.5 mm |
7 mm |
Not Qualified |
e1 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2 mm |
5.3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.2 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.6 V |
1 |
1.5 V |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
1.4 V |
.5 mm |
110 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
e4 |
30 |
260 |
14 mm |
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Texas Instruments |
BUS BUFFERS |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
SMALL OUTLINE |
2.7 V |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
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|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
101 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B101 |
3 |
1.03 mm |
6 mm |
e1 |
30 |
260 |
6 mm |
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|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
1 |
1.85 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
QFP80,.55SQ,20 |
1.75 V |
.5 mm |
110 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G80 |
3 |
1.2 mm |
12 mm |
e4 |
30 |
260 |
12 mm |
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|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.3 V |
1 |
3 |
.005 mA |
1.8 V |
1.6/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
R-PQCC-N12 |
1 |
.55 mm |
1.7 mm |
Not Qualified |
e4 |
30 |
260 |
2 mm |
|||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.62 V |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B25 |
1 |
.675 mm |
2.015 mm |
Not Qualified |
e1 |
30 |
260 |
2.015 mm |
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|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
13.5 V |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6.2 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
2.7 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
Line Driver or Receivers |
.9 V |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
IT ALSO REQUIRES 2.7 TO 5.5 V |
e4 |
30 |
260 |
4.9 mm |
||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 V |
1 |
3 |
.005 mA |
1.8 V |
1.6/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
3 mm |
|||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
2.5 V |
1.2/3.3 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP6,.11,37 |
Other Interface ICs |
2.3 V |
.95 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G6 |
1 |
1.45 mm |
1.6 mm |
Not Qualified |
e4 |
30 |
260 |
2.9 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.