INDUSTRIAL Other Function Interface ICs 2,400+

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3735E/D	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	RECTANGULAR	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V			UNCASED CHIP				2.97 V		85 Cel		-40 Cel	TIN LEAD	UPPER	R-XUUC-N29				Not Qualified		e0
MAX3340EEBE	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V	3.6 V	5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	1.8 V	Other Interface ICs	4 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0		245	2.02 mm
MAX13004EEUE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G16	1	1.1 mm	5 mm	Not Qualified		e0			5 mm
MAX13003EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	6	BICMOS	1.65 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0			2.02 mm
MAX3006EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX14595EWA+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.2 V	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V		.9 V	.4 mm	85 Cel	3 V	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B8	1	.69 mm	.837 mm			e2	30	260	1.627 mm
MAX1740EUB	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3 V	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH		1.425 V		2.25 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0		245	3 mm
MAX3261ECJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1	BIPOLAR	5 V		5	FLATPACK, THIN PROFILE, FINE PITCH	QFP32,.35SQ,32		Display Drivers	4.75 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3376EEBL	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	FBGA	SQUARE	PLASTIC/EPOXY	YES			BICMOS			1.8/5	GRID ARRAY, FINE PITCH	BGA8,3X3,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B8	1			Not Qualified		e0
MAX3667ECJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32		Display Drivers	3.135 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	CAN ALSO OPERATE WITH A 5V SUPPLY	e0			7 mm
MAX3008EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3869EGJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		3.3 V		3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3343EEUD	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		5 V	3.6 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.8 V	Other Interface ICs	4 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX24002TL+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.4 mm	95 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1	.8 mm	5 mm			e3	30	260	5 mm
MAX3392EEBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			2.02 mm
MAX3667ECJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32		Display Drivers	3.135 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	CAN ALSO OPERATE WITH A 5V SUPPLY	e0			7 mm
MAX3646ETG-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3005EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX13032EEBE+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2 mm	Not Qualified		e1	30	260	2 mm
MAX3668EHJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3261ECJ+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1		5 V			FLATPACK, THIN PROFILE, FINE PITCH				4.75 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e3			5 mm
MAX3343EEUD-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		5 V	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.8 V		4 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3736ETE	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e0			3 mm
MAX3023EUD-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3371EXK-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	3.3 V	5.5 V	1.8/5,3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	1.6 V	Other Interface ICs	2.5 V	.65 mm	85 Cel	1.8 V	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	BIDIRECTIONAL LEVEL SHIFTER				2 mm
MAX3130EAI-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V			SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified		e0			10.2 mm
MAX3341EEUD	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	5 V		2/3.3,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	4 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3007EUP+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS		5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.65 V		1.2 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX3012EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V	8	BICMOS			1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B20	1	.67 mm		Not Qualified		e0
MAX3663ETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		3.3 V		3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3738ETG-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0		245	4 mm
MAX3379EEBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			2.02 mm
MAX3667ECJ+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32		Display Drivers	3.135 V	.8 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	CAN ALSO OPERATE WITH A 5V SUPPLY	e3	30	260	7 mm
MAX3376EEKA-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			2.9 mm
MAX3375EEKA	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.1		Other Interface ICs		.635 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1			Not Qualified		e0
MAX17108ETI+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	20 V	1	BICMOS	16 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				6 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.8 mm	5 mm			e3	30	260	5 mm
MAX3741ETE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e0			3 mm
MAX7370ATG+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.62 V		1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.85 mm	3.5 mm			e3	30	260	3.5 mm
MAX3735AEGG-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.97 V	.5 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N24		1 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
MAX3011EBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX13013EXT-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4		245	2 mm
MAX3634ETM-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified		e0			7 mm
MAX3004EUP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3373EEKA	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.1		Other Interface ICs		.635 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1			Not Qualified		e0
MAX3668E/D	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	DIE	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1		3.3 V			UNCASED CHIP				3.14 V		85 Cel		-40 Cel	TIN LEAD	UPPER	R-XUUC-N48	1			Not Qualified		e0
MAX3013EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	8	BICMOS	3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	1.65 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX13000EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	6	BICMOS	1.65 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16		.67 mm	2.02 mm	Not Qualified		e0			2.02 mm
MAX3737EGJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	1 mm	5 mm	Not Qualified		e0		245	5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.