INDUSTRIAL Other Function Interface ICs 2,400+

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3002EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V		1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm			e0			2.54 mm
MAX3663ETG-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3931E/D-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	37	DIE	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR	5 V			UNCASED CHIP				4.75 V		85 Cel		-40 Cel	TIN LEAD	UPPER	R-XUUC-N37				Not Qualified		e0
MAX17121ETG+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.2 V	.5 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N24	1	.8 mm	4 mm						4 mm
MAX3023EBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e0			2.02 mm
MAX13034EEBE+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B16		.67 mm	2.02 mm	Not Qualified		e3			2.02 mm
MAX3395EEBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS			1.8/5	GRID ARRAY, FINE PITCH	BGA12,3X4,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	R-PBGA-B12				Not Qualified		e0
MAX253EUA-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS	5 V		5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	4.5 V	.65 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0	20	240	3 mm
MAX3131EAI+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V			SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified		e3			10.2 mm
MAX3023EUD	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX1841EUB	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		1.8 V	5.5 V	1.8,1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	1.4 V	Other Interface ICs	1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0		245	3 mm
MAX3343EEUD+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		5 V	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.8 V		4 V	.65 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
MAX3273ETG+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX3391EEUD-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V		1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		Other Interface ICs	1.65 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			5 mm
MAX13005EEUE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G16	1	1.1 mm	5 mm	Not Qualified		e0			5 mm
MAX3371ELT-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	3.3 V	5.5 V	1.8/5,3/5	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.06,20	1.6 V	Other Interface ICs	2.5 V	.5 mm	85 Cel	1.8 V	-40 Cel	GOLD	DUAL	R-PDSO-N6	1	.8 mm	1 mm	Not Qualified	BIDIRECTIONAL LEVEL SHIFTER	e4			1.5 mm
MAX3669EHJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V		3.3/5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3867ECM-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH				3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e0			7 mm
MAX3863EGJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3.15 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.9 mm	5 mm	Not Qualified		e0		245	5 mm
MAX3010EBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3372EEBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX3967ETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BIPOLAR	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3737EGJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3008EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V	8	BICMOS			1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B20	1	.67 mm		Not Qualified		e0
MAX3850EGJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	3.6 V	1	BIPOLAR	3.3 V			CHIP CARRIER, VERY THIN PROFILE				3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-CQCC-N32	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX13043EETD+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	2.2 V	Other Interface ICs	1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	DUAL	S-PDSO-N14	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3377EEUD-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V		1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		Other Interface ICs	1.65 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			5 mm
MAX3737ETJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e0			5 mm
MAX3373EEBL	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	FBGA	SQUARE	PLASTIC/EPOXY	YES			BICMOS			1.8/5	GRID ARRAY, FINE PITCH	BGA8,3X3,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B8				Not Qualified
MAX3967AETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24		.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3372EEKA-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			2.9 mm
MAX3001EEBP	Maxim Integrated		INDUSTRIAL	BALL	20	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS			1.8/5	GRID ARRAY, FINE PITCH	BGA20,4X5,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1			Not Qualified		e0
MAX13033EEBE+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B16		.67 mm	2.02 mm	Not Qualified		e3			2.02 mm
MAX13055EEWG+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	24	BGA	UNSPECIFIED	UNSPECIFIED	YES	3.6 V	1					GRID ARRAY				2.2 V		85 Cel		-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	X-XBGA-B24	1			Not Qualified		e2	30	260
MAX3013EGP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	8	BICMOS	3.3 V		1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25		Other Interface ICs	1.65 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3009EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX13014EKA	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		e0		245	2.9 mm
MAX3340EEUD-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		5 V	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.8 V		4 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3392EEBC	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS			1.8/5	GRID ARRAY, FINE PITCH	BGA12,3X4,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1			Not Qualified		e0
MAX3967ETG-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BIPOLAR	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3023EBC+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e1	30	260	2.02 mm
MAX3736ETE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e0			3 mm
MAX3669ETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		3.3 V		3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX13013EBT-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B6	1	.67 mm	1.75 mm	Not Qualified		e0		245	1.98 mm
MAX3003EBP	Maxim Integrated		INDUSTRIAL	BALL	20	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS			1.8/5	GRID ARRAY, FINE PITCH	BGA20,4X5,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1			Not Qualified		e0
MAX3393EEUD-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V		1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		Other Interface ICs	1.65 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			5 mm
MAX3634ETM+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified		e3	30	260	7 mm
MAX13000EEUE+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified					5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.