INDUSTRIAL Other Function Interface ICs 2,400+

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Maximum Output Current	No. of Functions	No. of Channels	Technology	Screening Level	No. of Bits	Interface Standard	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Maximum Delay	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Output Characteristics	Minimum Operating Temperature	Driver No. of Bits	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Output Polarity	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Maximum Receive Delay
ADUM2401BRWZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE	SOP16,.4			2.7 V	1.27 mm	105 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
MAX3378EEUD	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		4		BICMOS					3.3 V		1.8/5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		Other Interface ICs	1.65 V	.65 mm	85 Cel			-40 Cel		TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			5 mm
ADUM1411ARWZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE	SOP16,.4			2.7 V	1.27 mm	105 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
HMC677LP5E	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		BICMOS					5 V		+-5	-5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Other Interface ICs	4.5 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	QUAD	S-PQCC-N32	1	1 mm	5 mm	Not Qualified			e3		260	5 mm
HCPL-0931-500E	Broadcom	DIGITAL ISOLATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		2		CMOS			GENERRAL PURPOSE		3.3 V					SMALL OUTLINE	SOP8,.25			3 V	1.27 mm	100 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G8	1	1.83 mm	3.9 mm	Not Qualified		ALSO OPERATED AT 5V SUPPLY	e3		260	4.885 mm
ADUM2400CRWZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE	SOP16,.4			2.7 V	1.27 mm	105 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
ADUM5401WCRWZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V					SMALL OUTLINE	SOP16,.4			3 V	1.27 mm	105 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	3	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
PCA9507D,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1						5 mA	3.6 V		3/5			SMALL OUTLINE	SOP8,.25		Other Interface ICs	2.7 V	1.27 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified			e4	30	260	4.9 mm
SN65DSI85ZXHR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		1	2						1.8 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,9X9,20			1.65 V	.5 mm	85 Cel			-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B64	3	1 mm	5 mm					30	260	5 mm
ADUM2401ARWZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE	SOP16,.4			2.7 V	1.27 mm	105 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
MAX3656ETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		1		BIPOLAR					3.3 V		3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel			-40 Cel		TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified			e0			4 mm
MAX3656ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		1		BIPOLAR					3.3 V		3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
ADUM1311BRWZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE				2.7 V	1.27 mm	105 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
ADUM2402CRWZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE	SOP16,.4			2.7 V	1.27 mm	105 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
LTC6820IMS#3ZZTRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS	AEC-Q100				3.3 V					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm	3 mm				e3		260	4.039 mm
MAX8521ETP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		1		BICMOS					5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.65 mm	85 Cel			-40 Cel		TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified			e0			5 mm
MAX8521ETP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		1		BICMOS					5 V					CHIP CARRIER, VERY THIN PROFILE				3 V	.65 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified			e3	30	260	5 mm
GTL2002DP/DG,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1								5.5 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	0 V		0 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		Also required VDREF 0 to 5.5V	e4		260	3 mm
LTC6957IDD-3#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V		1		CMOS					3.3 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm				e3	30	260	3 mm
MAX4896ATP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	.0001 A	1		BICMOS					3.6 V		3/5			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25		Peripheral Drivers	2.7 V	.65 mm	85 Cel			-40 Cel	8	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified			e3	30	260	5 mm
ADUM6401CRIZ-RL	Analog Devices	DIGITAL ISOLATOR	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V					SMALL OUTLINE	SOP16,.25			3 V	1.27 mm	105 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	3	2.65 mm	7.5 mm				e3		260	12.8 mm
ADUM2402CRWZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE	SOP16,.4			2.7 V	1.27 mm	105 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
CY8CMBR2044-24LKXIT	Infineon Technologies	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		1		CMOS					3 V					CHIP CARRIER, VERY THIN PROFILE				1.71 V	.5 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	.6 mm	3 mm				e4	20	260	3 mm
MAX3002EUP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		BICMOS						5.5 V	1.8/5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel			-40 Cel		TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified			e0	20	240	6.5 mm
MAX3002EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		8		BICMOS						5.5 V	1.8/5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified			e3	30	260	6.5 mm
NB4N527SMNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		1						53 mA	3.3 V		3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Line Driver or Receivers	3 V	.5 mm	85 Cel			-40 Cel		NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N16	1	1 mm	3 mm	Not Qualified				30	260	3 mm	.47 ns
TXB0304RUTR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1				4		.01 mA		3.6 V	1.2/3.3			CHIP CARRIER, VERY THIN PROFILE	LCC12,.07X.08,16	.9 V	Other Interface ICs	.9 V	.4 mm	85 Cel		3-STATE	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	R-PQCC-N12	1	.55 mm	1.7 mm	Not Qualified			e4	NOT SPECIFIED	260	2 mm
ADUM2400BRWZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE	SOP16,.4			2.7 V	1.27 mm	105 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
ADUM5201CRWZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1							3.3 V					SMALL OUTLINE				3 V	1.27 mm	105 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	3	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
ADUM7440ARQZ-RL7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3.3 V					SMALL OUTLINE				3 V	.65 mm	105 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.75 mm	3.91 mm	Not Qualified			e3		260	4.9 mm
MAX3394EETA-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES					BICMOS							1.8/5			SMALL OUTLINE	SOLCC8,.12,25		Other Interface ICs		.635 mm	85 Cel			-40 Cel		Tin/Lead (Sn/Pb)	DUAL	R-PDSO-N8				Not Qualified			e0
GTL2002DP/S440,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1								5.5 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	0 V		0 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		Also required VDREF 0 to 5.5V	e4			3 mm
HCPL-0930-000E	Broadcom	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		2		CMOS					3.3 V					SMALL OUTLINE				3 V	1.27 mm	100 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		ALSO OPERATED AT 5V SUPPLY	e3		260	4.9 mm
ADUM1301BRW-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		3		CMOS			EIA-232; EIA-422; EIA-485		3 V					SMALL OUTLINE	SOP16,.4			2.7 V	1.27 mm	105 Cel			-40 Cel		TIN LEAD	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e0		240	10.3 mm
ADUM1411BRWZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE	SOP16,.4			2.7 V	1.27 mm	105 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
ADUM3200ARZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		2		CMOS					3.3 V					SMALL OUTLINE	SOP8,.25			3 V	1.27 mm	105 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm			ALSO OPERATES AT 5V NOMINAL SUPPLY	e3	30	260	4.9 mm
LTC4331IUFD#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC	YES	5.5 V		1		CMOS			EIA-485		5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.17X.21,20			3 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	QUAD	R-PQCC-N20	1	.8 mm	4 mm				e3		260	5 mm
PCA9517ATP,147	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3.3 V		3/5			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		Line Driver or Receivers	.9 V	.5 mm	85 Cel			-40 Cel			DUAL	R-PDSO-N8	1	.8 mm	2 mm	Not Qualified		OPERATES WITH 2.7 V TO 5.5 V		30	260	3 mm
ADUM2402BRWZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE	SOP16,.4			2.7 V	1.27 mm	105 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
ADUM7642CRQZ-RL7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V	5.5 V				SMALL OUTLINE, SHRINK PITCH		3 V		3 V	.64 mm	105 Cel	3.3 V		-40 Cel		MATTE TIN	DUAL	R-PDSO-G20	1	1.75 mm	3.91 mm				e3	30	260	8.66 mm
TXB0104RGYRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1				4		.01 mA	1.4 V	5.5 V	1.2/3.6,1.8/5		13.7 ns	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14(UNSPEC)	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	1.8 V	3-STATE	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N14	2	1 mm	3.5 mm	Not Qualified	TRUE	ALSO REQUIRED 1.8V SUPPLY NOMINAL	e4	NOT SPECIFIED	260	3.5 mm
ADUM5404ARWZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V					SMALL OUTLINE				3 V	1.27 mm	105 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	3	2.65 mm	7.5 mm				e3	30	260	10.3 mm
LTC4331IUFD#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC	YES	5.5 V		1		CMOS			EIA-485		5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.17X.21,20			3 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	QUAD	R-PQCC-N20	1	.8 mm	4 mm				e3		260	5 mm
ADUM6402ARWZ	Analog Devices	DIGITAL ISOLATOR	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V					SMALL OUTLINE	SOP16,.25			3 V	1.27 mm	105 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	3	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm
HCTL-2020#PLC	Broadcom	INTERFACE CIRCUIT	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES			1		CMOS										CHIP CARRIER					1.27 mm						TIN LEAD	QUAD	S-PQCC-J20		4.57 mm	9.04 mm	Not Qualified			e0			9.04 mm
LTC6957IMS-1#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V		1		CMOS					3.3 V					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm	4.039 mm				e3			3 mm
PCA9306DC1/DG,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			1												SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20		Other Interface ICs		.5 mm	85 Cel			-40 Cel			DUAL	R-PDSO-G8	1	1 mm	2 mm	Not Qualified					260	2.3 mm
ADUM1311ARWZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3 V					SMALL OUTLINE				2.7 V	1.27 mm	105 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm	Not Qualified			e3	30	260	10.3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.