Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
QUAD |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
1 |
CMOS |
SPI |
3.3 V |
SMALL OUTLINE |
SOLCC20,.32,20 |
2.97 V |
.5 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-N20 |
3 |
1.2 mm |
5 mm |
30 |
260 |
8 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
4 |
.006 mA |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14,.1X.12,20 |
1.08 V |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N14 |
1 |
.8 mm |
2.5 mm |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
Digital I/P Module |
AUTOMOTIVE |
NO LEAD |
20 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
1 |
CMOS |
SPI |
3.3 V |
SMALL OUTLINE |
SOLCC20,.32,20 |
2.97 V |
.5 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-N20 |
3 |
1.2 mm |
5 mm |
30 |
260 |
8 mm |
|||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SEGMENT |
YES |
5.5 V |
1 |
CMOS |
7-DIGIT |
3.3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
7 |
Display Drivers |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
COMMON-ANODE |
e0 |
245 |
6 mm |
|||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SEGMENT |
YES |
5.5 V |
1 |
CMOS |
7-DIGIT |
3.3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
7 |
Display Drivers |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
COMMON-ANODE |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||||||
|
Holt Integrated Circuits |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.13 V |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
e3 |
40 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
Kinetic Technologies |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
46 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1.26 V |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC46,.18X.25,16 |
1.14 V |
.4 mm |
70 Cel |
0 Cel |
QUAD |
R-XQCC-N46 |
.9 mm |
6.5 mm |
IT LASO HAS 1.65 TO 1.95V SUPPLY |
4.5 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1.2 V |
1/3.6 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,14 |
Other Interface ICs |
1 V |
.35 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM |
DUAL |
S-PDSO-N6 |
1 |
.55 mm |
1 mm |
Not Qualified |
e4 |
30 |
260 |
1 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
5.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC8,.12,20 |
0 V |
0 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N8 |
1 |
.5 mm |
2 mm |
SEATED HGT-NOM |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
2.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.1 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.5 V |
2.9 V |
.5 mm |
125 Cel |
5 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N20 |
2 |
.8 mm |
3 mm |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
4 |
.006 mA |
1.1 V |
CHIP CARRIER, VERY THIN PROFILE |
1.08 V |
.4 mm |
125 Cel |
3-State |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N12 |
1 |
.55 mm |
1.7 mm |
e4 |
260 |
2 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
IT ALSO OPERATES AT 5V, REQUIRES VDDP=5 |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
1.8 V |
5.5 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.06SQ,20 |
1.8 V |
Other Interface ICs |
1 V |
.55 mm |
85 Cel |
2.5 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N8 |
1 |
.5 mm |
1.6 mm |
Not Qualified |
e4 |
30 |
260 |
1.6 mm |
||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
SPI |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16X.2,20 |
3 V |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N20 |
1 |
.8 mm |
4 mm |
SEATED HT-CALCULATED |
e3 |
260 |
5 mm |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
4.5 V |
.5 mm |
150 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
SMALL OUTLINE |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N8 |
1 |
.4 mm |
1.4 mm |
Not Qualified |
e4 |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
6 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
1 |
1 |
.0125 mA |
LATCH |
1 V |
CHIP CARRIER |
0 V |
125 Cel |
OPEN-DRAIN |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
R-PBCC-N6 |
1 |
.4 mm |
.8 mm |
e4 |
30 |
260 |
1 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
2.25 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
1.1 mm |
3 mm |
e3 |
3 mm |
||||||||||||||||||||||||||||||||||
|
Vishay Intertechnology |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
7 |
SMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
2.4 V |
.95 mm |
85 Cel |
-30 Cel |
SINGLE |
R-XSMA-N7 |
1.8 mm |
2.8 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6.8 mm |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12X.18,25 |
4.5 V |
.65 mm |
DUAL |
R-PDSO-N14 |
1 mm |
3 mm |
4.5 mm |
|||||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
1.8 V |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N20 |
1 |
.8 mm |
2.5 mm |
Not Qualified |
e4 |
30 |
260 |
4.5 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1/3.6,1.8/5.5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC8,.04,14 |
Other Interface ICs |
.35 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-N8 |
1 |
.5 mm |
1 mm |
Not Qualified |
e3 |
30 |
260 |
1.35 mm |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.2SQ,25 |
3.6 V |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 mm |
5 mm |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
8 |
RECTANGULAR |
UNSPECIFIED |
NO |
3.6 V |
1 |
BICMOS |
3 V |
MICROELECTRONIC ASSEMBLY |
2.4 V |
70 Cel |
-20 Cel |
SINGLE |
R-XSMA-N8 |
4 |
Not Qualified |
255 |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1.8 V |
5.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
1.65 V |
1.1 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
GOLD NICKEL |
DUAL |
R-PDSO-N6 |
1 |
.8 mm |
1 mm |
e4 |
30 |
260 |
1.5 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
1.62 V |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.12X.24,16 |
3 V |
.4 mm |
70 Cel |
-40 Cel |
QUAD |
R-XQCC-N40 |
.8 mm |
3 mm |
6 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
.0009 mA |
2.5 V |
2.5/3.3 |
SMALL OUTLINE, VERY THIN PROFILE |
Other Interface ICs |
2.3 V |
.35 mm |
85 Cel |
PUSH-PULL |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-N6 |
1 |
.4 mm |
1 mm |
Not Qualified |
e4 |
30 |
260 |
1 mm |
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|
Renesas Electronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
36 V |
1 |
CMOS |
CHIP CARRIER |
LCC24,.16SQ,20 |
8 V |
.5 mm |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
S-XQCC-N24 |
1 |
.9 mm |
4 mm |
e3 |
NOT SPECIFIED |
260 |
4 mm |
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|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
1.5 V |
5.5 V |
2/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.06SQ,20 |
1.8 V |
Other Interface ICs |
1 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N8 |
1 |
.55 mm |
1.6 mm |
Not Qualified |
ALSO REQUIRED 1.8V TO 5.5V SUPPLY ON B SIDE |
e4 |
30 |
260 |
1.6 mm |
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Holt Integrated Circuits |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.13 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
e0 |
6 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
10 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
2.25 V |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
1.1 mm |
3 mm |
e3 |
3 mm |
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|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
15 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
8 |
5 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-N15 |
1 |
.8 mm |
2.5 mm |
e4 |
30 |
260 |
6.5 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
.8 mm |
5 mm |
5 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
.8 mm |
5 mm |
5 mm |
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|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2.625 V |
1 |
2 |
2.5 V |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
3 V |
2.375 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N24 |
3 |
.8 mm |
4 mm |
ALSO OPERATES WITH 3V TO 3.6V |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
2.625 V |
1 |
8 |
BICMOS |
2.5 V |
2.5,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC54,.2X.4,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-XQCC-N54 |
2 |
.8 mm |
5.5 mm |
Not Qualified |
IT ALSO OPERATES AT 3.3 V |
e3 |
30 |
260 |
10 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.