NO LEAD Other Function Interface ICs 1,271

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Screening Level	No. of Bits	Interface Standard	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADN2870ACPZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		BICMOS					3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3		260	4 mm
FXL5T244BQX	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1							1.4 V		1.5/3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.1X.12,20		Other Interface ICs	1.1 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N14	1	.8 mm	2.5 mm	Not Qualified		e4	30	260	3 mm
FXLP34L6X	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1		CMOS					1.2 V		1/3.6		SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20		Other Interface ICs	1 V	.5 mm	85 Cel		-40 Cel	NICKEL GOLD	DUAL	R-PDSO-N6	1	.55 mm	1 mm	Not Qualified		e4	30	260	1.45 mm
HD3SS2522RHUR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1							3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N56	3	.8 mm	5 mm			e4	30	260	11 mm
LMH1218RTWT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	2.625 V	1							2.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.375 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	.8 mm	4 mm			e3	30	260	4 mm
LT6911UXC	Lontium Semiconductor	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	64		SQUARE	UNSPECIFIED	YES		1																	85 Cel		-40 Cel		QUAD	S-XQCC-N64
LTC4332IUFD#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS			SPI		5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16X.2,20			3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	R-PQCC-N20	1	.8 mm	4 mm		SEATED HT-CALCULATED	e3		260	5 mm
MAX3735AETG-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1		BIPOLAR					3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3735AETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1		BIPOLAR					3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX3795ETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1		BIPOLAR					3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3795ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1		BIPOLAR					3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MD1711K6-G	Microchip Technology	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1			TS 16949				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20			1.8 V	.5 mm	125 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N48		1 mm	7 mm	Not Qualified		e3			7 mm
PI3EQX7841ZDEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1							3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N20		.8 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
SN74AUP1T97DRYR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1				1		.0009 mA	2.5 V		2.5/3.3		SMALL OUTLINE, VERY THIN PROFILE			Other Interface ICs	2.3 V	.5 mm	85 Cel	PUSH-PULL	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	R-PDSO-N6	1	.6 mm	1 mm	Not Qualified		e4	30	260	1.45 mm
TCA9416DTMR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	8	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1							3.3 V	3.6 V			CHIP CARRIER		1.08 V		1.08 V		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-N8	1	.4 mm	.8 mm			e4	30	260	1.35 mm
TPS25810ATWRVCRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V	1			AEC-Q100				5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	MATTE TIN	QUAD	R-PQCC-N20	2	.8 mm	3 mm		ALSO HAVE 6.5 MAX INPUT	e3	30	260	4 mm
TPS65193RGER	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	35 V	2							30 V		-10,30	-10 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Other Interface ICs	15 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	2	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
TUSB1004IRNQR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	40	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	4						3.3 V				CHIP CARRIER, HEAT SINK/SLUG				3 V	.4 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N40	1	.8 mm	4 mm			e4		260	6 mm
UJA1169TK/FZ	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	1			AEC-Q100				13 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.8 V	.5 mm				NICKEL PALLADIUM GOLD SILVER	DUAL	R-PDSO-N20	1	1 mm	3.5 mm			e4	30	260	5.5 mm
ADN2525ACPZ-R2	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.53 V	1							3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Display Drivers	3.07 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	3	.9 mm	3 mm	Not Qualified		e3		260	3 mm
ADN2530YCPZ-500R7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.53 V	1							3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3.07 V	.5 mm	100 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	3	.9 mm	3 mm	Not Qualified		e3		260	3 mm
ADN2530YCPZ-R2	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.53 V	1							3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Display Drivers	3.07 V	.5 mm	100 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	3	.9 mm	3 mm	Not Qualified		e3		260	3 mm
ADN2531ACPZ-WP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1							3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Display Drivers	3 V	.5 mm	100 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	1	.9 mm	3 mm	Not Qualified		e3			3 mm
HDL6M05585	Ablic	ULTRASOUND PULSER		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V	1		SOI-CMOS					1.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20			1.7 V	.5 mm	75 Cel		0 Cel		QUAD	S-XQCC-N68		.95 mm	10.2 mm		Operating Supply in Clock mode is 2.4V to 3.6V			260	10.2 mm
HI-8425PCMF	Holt Integrated Circuits	INTERFACE CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		SOI-CMOS					3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20			3 V	.5 mm	125 Cel		-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N40	3	.82 mm	6 mm			e4	40	260	6 mm
IC-MB4QFN28-5X5	Ic-haus	INTERFACE CIRCUIT		NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1							4.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20			3 V	.5 mm	125 Cel		-40 Cel		QUAD	S-XQCC-N28		1 mm	5 mm						5 mm
IC-MB4QFN28-5X5ET-40/125	Ic-haus	INTERFACE CIRCUIT		NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1							4.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20			3 V	.5 mm	125 Cel		-40 Cel		QUAD	S-XQCC-N28		1 mm	5 mm						5 mm
ISL58303DRTZ-T13	Renesas Electronics	INTERFACE CIRCUIT		NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES		1											CHIP CARRIER									MATTE TIN	QUAD	S-XQCC-N24	1					e3	30	260
LTC4316IDD#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V				SMALL OUTLINE, VERY THIN PROFILE				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N10		.8 mm	3 mm			e3			5 mm
LTC4316IDD#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V				SMALL OUTLINE, VERY THIN PROFILE				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm			e3	30	260	3 mm
LTC4332CUFD#TRPBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS			SPI		5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16X.2,20			3 V	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD	R-PQCC-N20	1	.8 mm	4 mm		SEATED HT-CALCULATED	e3		260	5 mm
LTC4332HUFD#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS			SPI		5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16X.2,20			3 V	.5 mm	125 Cel		-40 Cel	MATTE TIN	QUAD	R-PQCC-N20	1	.8 mm	4 mm		SEATED HT-CALCULATED	e3		260	5 mm
LTC4332IUFD#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS			SPI		5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16X.2,20			3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	R-PQCC-N20	1	.8 mm	4 mm		SEATED HT-CALCULATED	e3		260	5 mm
LTC6957IDD-3#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3		260	3 mm
MAX17079GTL+TW	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		BICMOS					3.3 V				CHIP CARRIER				2.3 V		105 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1					e3	30	260
MAX7300ATL	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		CMOS									CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	125 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified		e0			6 mm
MAX7300ATL+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		CMOS									CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified		e3	30	260	6 mm
MAX7300ATL+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		CMOS									CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified		e3	30	260	6 mm
NB7VPQ702MMUTXG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	1							1.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.71 V	.5 mm	85 Cel		-40 Cel	TIN	QUAD	S-XQCC-N16	1	.55 mm	3 mm			e3		260	3 mm
PR5331C3HN/C370Y	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1							3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20			2.5 V	.5 mm	85 Cel		-30 Cel		QUAD	S-PQCC-N40	2	1 mm	6 mm					260	6 mm
PTCA9536ADTMR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1							1.95 V				CHIP CARRIER				1.65 V		125 Cel		-40 Cel		BOTTOM	R-PBCC-N8		.4 mm	.8 mm						1.35 mm
SN74GTL2003RKSR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1							3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.1X.18,20		Other Interface ICs	3 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	R-PQCC-N20	1	1 mm	2.5 mm	Not Qualified		e4	30	260	4.5 mm
TCA9536ADTMR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	8	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1							1.8 V				CHIP CARRIER				1.65 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	BOTTOM	R-PBCC-N8	1	.4 mm	.8 mm			e4		260	1.35 mm
TDP1204IRNQR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	4						3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.16X.24,16			3 V	.4 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N40	1	.8 mm	4 mm			e4		260	6 mm
TJA1145TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1			AEC-Q100				5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12X.18,25			4.5 V	.65 mm					DUAL	R-PDSO-N14		1 mm	3 mm						4.5 mm
TLE9262QXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	28 V	1			AEC-Q100				13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				5.5 V	.5 mm					QUAD	S-PQCC-N48		.9 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
TLE9262QXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	28 V	1			AEC-Q100				13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				5.5 V	.5 mm					QUAD	S-PQCC-N48		.9 mm	7 mm						7 mm
TPD8E003DQDR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		1	8										SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE					.4 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	R-PDSO-N8	1	.8 mm	1.35 mm	Not Qualified		e4	30	260	1.7 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.