Microchip Technology Other Function Interface ICs 29

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MCP2122T-E/SN

Microchip Technology

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

TS 16949

5 V

SMALL OUTLINE

SOP8,.25

1.8 V

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

e3

30

260

4.9 mm

PM8561B-F3EI

Microchip Technology

INTERFACE CIRCUIT

SQUARE

UNSPECIFIED

1

PM8564B-FEI

Microchip Technology

INTERFACE CIRCUIT

SQUARE

UNSPECIFIED

1

PM8565B-FEI

Microchip Technology

INTERFACE CIRCUIT

SQUARE

UNSPECIFIED

1

PM8563B-F3EI

Microchip Technology

INTERFACE CIRCUIT

SQUARE

UNSPECIFIED

1

PM8562B-F3EI

Microchip Technology

INTERFACE CIRCUIT

SQUARE

UNSPECIFIED

1

TIN SILVER COPPER

e1

HV892K7-G

Microchip Technology

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

10

HVSON

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC10,.16,25

2.65 V

.65 mm

85 Cel

-25 Cel

MATTE TIN

DUAL

S-PDSO-N10

.8 mm

4 mm

Not Qualified

e3

4 mm

PM8566B-FEI

Microchip Technology

INTERFACE CIRCUIT

SQUARE

UNSPECIFIED

1

MCP2122-E/SN

Microchip Technology

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

TS 16949

5 V

SMALL OUTLINE

SOP8,.25

1.8 V

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

30

260

4.9 mm

MCP2122-E/SNG

Microchip Technology

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

TS 16949

5 V

SMALL OUTLINE

SOP8,.25

1.8 V

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

4.9 mm

SEC1210-CN-02NC-TR

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.2SQ,25

3.6 V

.65 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N24

1 mm

5 mm

5 mm

PM8055B-FEI

Microchip Technology

INTERFACE CIRCUIT

BALL

1408

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1408

KXUSB-150

Microchip Technology

INTERFACE CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

5.25 V

1

5 V

MICROELECTRONIC ASSEMBLY

4.75 V

UNSPECIFIED

R-XXMA-X

MCP2122-E/SNVAO

Microchip Technology

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

TS 16949; AEC-Q100

5 V

SMALL OUTLINE

SOP8,.25

1.8 V

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

SEC1210-CN-02NC

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.2SQ,25

3.6 V

.65 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N24

1 mm

5 mm

5 mm

SEC1210-CN-02

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.2SQ,25

3.6 V

.65 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N24

1 mm

5 mm

5 mm

SEC1210-CN-02-TR

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.2SQ,25

3.6 V

.65 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N24

1 mm

5 mm

5 mm

MD1711K6-G

Microchip Technology

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

1.8 V

.5 mm

125 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N48

1 mm

7 mm

Not Qualified

e3

7 mm

MCP2122T-E/SNG

Microchip Technology

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

TS 16949

5 V

SMALL OUTLINE

SOP8,.25

1.8 V

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

e3

4.9 mm

HSA2-040SIA/A2S23

Microchip Technology

TOUCHSCREEN CONTROLLER

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

5 V

SMALL OUTLINE

SOP28,.41,50

4.75 V

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G28

1

2.64 mm

7.49 mm

e3

40

260

17.87 mm

MD2134K7-G

Microchip Technology

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

5 V

5.25 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.20SQ,16

4.75 V

4.75 V

.4 mm

70 Cel

5 V

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N40

.8 mm

5 mm

Not Qualified

e4

5 mm

SEC1110-A5-02NC

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.2SQ,32

3.6 V

.8 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N16

1 mm

5 mm

5 mm

HSA2-040SIA/A2S23TR

Microchip Technology

TOUCHSCREEN CONTROLLER

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

5 V

SMALL OUTLINE

SOP28,.41,50

4.75 V

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G28

1

2.64 mm

7.49 mm

e3

40

260

17.87 mm

MD1712FG-G

Microchip Technology

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5 V

1

3.3 V

12.6 V

-10 V

FLATPACK, LOW PROFILE, FINE PITCH

SPQFP48,.28SQ,20

8 V

1.8 V

.5 mm

70 Cel

10 V

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

MD2131K7-G

Microchip Technology

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

2.7 V

1

2.5 V

5.25 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

4.75 V

2.3 V

.4 mm

70 Cel

5 V

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N40

.8 mm

5 mm

e4

5 mm

SEC1110-A5-02-TR

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.2SQ,32

3.6 V

.8 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N16

1 mm

5 mm

5 mm

SEC1210I-CN-02-TR

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.2SQ,25

3.6 V

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1 mm

5 mm

5 mm

SY88022ALMG

Microchip Technology

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

3 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

2

.9 mm

3 mm

e4

40

260

3 mm

SY88022ALMG-TR

Microchip Technology

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

3 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

.9 mm

3 mm

e4

3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.