Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
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STMicroelectronics |
INTERFACE CIRCUIT |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
20 V |
1 |
CMOS |
5 V |
3/15 |
IN-LINE |
DIP16,.3 |
Other Interface ICs |
3 V |
2.54 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
5.1 mm |
7.62 mm |
Not Qualified |
e4 |
245 |
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STMicroelectronics |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC |
SEGMENT |
YES |
CMOS |
3 mA |
5/15 |
FLATPACK |
FL16,.3 |
7 |
0-BP |
Other Interface ICs |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
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STMicroelectronics |
INTERFACE CIRCUIT |
GULL WING |
10 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
24 V |
1 |
AEC-Q100 |
14 V |
SMALL OUTLINE |
5.2 V |
1.27 mm |
DUAL |
R-PDSO-G10 |
3.65 mm |
7.5 mm |
9.4 mm |
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STMicroelectronics |
INTERFACE CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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STMicroelectronics |
INTERFACE CIRCUIT |
GULL WING |
16 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.3 V |
1 |
AEC-Q100 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SSOP16,.25,20 |
3 V |
.5 mm |
150 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
3 |
1.72 mm |
3.9 mm |
4.9 mm |
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STMicroelectronics |
INTERFACE CIRCUIT |
THROUGH-HOLE |
5 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
16 V |
+-16 |
-16 V |
IN-LINE |
ZIP5H,.15,.7,67TB |
Other Interface ICs |
1.7 mm |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T5 |
Not Qualified |
e0 |
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STMicroelectronics |
Digital I/P Module |
3 |
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STMicroelectronics |
INTERFACE CIRCUIT |
3 |
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STMicroelectronics |
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STMicroelectronics |
INTERFACE CIRCUIT |
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STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
3 V |
1.5/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA5,3X3,17/10 |
Other Interface ICs |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B5 |
.714 mm |
1.02 mm |
Not Qualified |
1.36 mm |
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STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
2 |
1.8 V |
5.5 V |
1.8/3.3,1.8/5 |
CHIP CARRIER |
LCC10,.06X.07,16 |
1.65 V |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
1.8 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-XQCC-N10 |
1 |
.55 mm |
1.4 mm |
Not Qualified |
e4 |
30 |
260 |
1.8 mm |
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STMicroelectronics |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
11 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1.5/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA11,3X7,17/10 |
Other Interface ICs |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B11 |
.715 mm |
1.41 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
2.04 mm |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
28 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
5 V |
4.5 V |
.5 mm |
13.5 V |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
10 mm |
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STMicroelectronics |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2.25 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
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STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
35 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Peripheral Drivers |
.5 mm |
105 Cel |
-40 Cel |
12 |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
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STMicroelectronics |
INDUSTRIAL |
SEGMENT |
CMOS |
.35 mA |
2/5 |
DIE OR CHIP |
128 |
65-BP |
Other Interface ICs |
85 Cel |
-40 Cel |
Not Qualified |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
11 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1.65 V |
1.5/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA11,3X7,17/10 |
Other Interface ICs |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B11 |
.715 mm |
1.41 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
2.04 mm |
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STMicroelectronics |
INTERFACE CIRCUIT |
GULL WING |
16 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.3 V |
1 |
AEC-Q100 |
3.3 V |
16 V |
3.3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SSOP16,.25,20 |
6 V |
Peripheral Drivers |
3 V |
.5 mm |
150 Cel |
13 V |
-40 Cel |
6 |
DUAL |
R-PDSO-G16 |
1.72 mm |
3.9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
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STMicroelectronics |
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STMicroelectronics |
INTERFACE CIRCUIT |
3 |
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STMicroelectronics |
INTERFACE CIRCUIT |
3 |
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STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
5.5 V |
CHIP CARRIER, VERY THIN PROFILE |
1.8 V |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N16 |
1 |
.6 mm |
1.8 mm |
Not Qualified |
e4 |
30 |
260 |
2.6 mm |
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STMicroelectronics |
INTERFACE CIRCUIT |
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STMicroelectronics |
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STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
15 V |
4 |
CMOS |
3/15 |
CHIP CARRIER |
LDCC20,.4SQ |
Other Interface ICs |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
4.57 mm |
8.9662 mm |
Not Qualified |
e3 |
8.9662 mm |
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STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
3.3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
1.27 mm |
85 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
e4 |
40 |
260 |
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STMicroelectronics |
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STMicroelectronics |
INTERFACE CIRCUIT |
3 |
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STMicroelectronics |
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STMicroelectronics |
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STMicroelectronics |
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STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
.6 mA |
5/15 |
IN-LINE |
DIP16,.3 |
7 |
0-BP |
Other Interface ICs |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
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STMicroelectronics |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC |
SEGMENT |
YES |
CMOS |
3 mA |
5/15 |
FLATPACK |
FL16,.3 |
7 |
0-BP |
Other Interface ICs |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
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STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
15 V |
4 |
CMOS |
5 V |
IN-LINE |
3 V |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
LG-MAX |
e0 |
20 mm |
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STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
-48 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
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STMicroelectronics |
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STMicroelectronics |
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STMicroelectronics |
INTERFACE CIRCUIT |
GULL WING |
10 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
24 V |
1 |
AEC-Q100 |
14 V |
SMALL OUTLINE |
5.2 V |
1.27 mm |
DUAL |
R-PDSO-G10 |
3.65 mm |
7.5 mm |
9.4 mm |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 V |
1 |
CMOS |
5 V |
5/15 |
SMALL OUTLINE |
SOP16,.25 |
Other Interface ICs |
3 V |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
9.9 mm |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
-48 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
PURE TIN/NICKEL PALLADIUM GOLD |
DUAL |
S-XDSO-N8 |
1 mm |
3 mm |
Not Qualified |
e3/e4 |
40 |
260 |
3 mm |
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STMicroelectronics |
INTERFACE CIRCUIT |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
18 V |
4 |
CMOS |
3/18 |
IN-LINE |
DIP16,.3 |
Other Interface ICs |
3 V |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
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STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
CMOS |
2.7 V |
SMALL OUTLINE, VERY THIN PROFILE |
1.2 V |
.4 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDSO-N6 |
.55 mm |
1 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
1.2 mm |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1.8 V |
1.5/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA5,3X3,20/10 |
Other Interface ICs |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B5 |
.715 mm |
1.02 mm |
Not Qualified |
e1 |
1.36 mm |
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STMicroelectronics |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.