Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
45 V |
1 |
24 V |
24 |
SMALL OUTLINE |
SOP14,.25 |
Peripheral Drivers |
8 V |
1.27 mm |
85 Cel |
-25 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
8.65 mm |
||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
16 V |
1 |
12 V |
SMALL OUTLINE |
6 V |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
12.8 mm |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
SEGMENT |
CMOS |
.35 mA |
2/5 |
DIE OR CHIP |
128 |
65-BP |
Other Interface ICs |
85 Cel |
-40 Cel |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
MILITARY |
FLAT |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
18 V |
4 |
CMOS |
5 V |
FLATPACK |
3 V |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
6.9 mm |
9.95 mm |
||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
3 mA |
5/15 |
IN-LINE |
DIP16,.3 |
7 |
0-BP |
Other Interface ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.1 V |
1 |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
4.9 V |
.5 mm |
95 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
3.3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Interface ICs |
1.27 mm |
85 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
e4 |
40 |
260 |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
1.8/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.05X.06,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N8 |
.6 mm |
1.2 mm |
Not Qualified |
ALSO REQUIRED VCC = 1.8 TO 5.5V SUPPLY RANGE |
1.4 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
-48 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
PURE TIN/NICKEL PALLADIUM GOLD |
DUAL |
S-XDSO-N8 |
1 mm |
3 mm |
Not Qualified |
e3/e4 |
40 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G80 |
1.6 mm |
12 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BUTT |
20 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
1.8 V |
2/5 |
CHIP CARRIER, VERY THIN PROFILE |
BGA20,4X5,20 |
Other Interface ICs |
1.71 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBCC-B20 |
1 mm |
2 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
2.46 mm |
|||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
12 V |
1 |
12 V |
IN-LINE |
10 V |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T20 |
5.1 mm |
7.62 mm |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2/5 |
SMALL OUTLINE, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Other Interface ICs |
1.65 V |
.4 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-N10 |
1 |
.55 mm |
1.4 mm |
Not Qualified |
e4 |
30 |
260 |
1.8 mm |
|||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
.6 mA |
5/15 |
IN-LINE |
DIP16,.3 |
7 |
0-BP |
Other Interface ICs |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
46 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE, SHRINK PITCH |
6 V |
.5 mm |
125 Cel |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-G46 |
3 |
3.6 mm |
11 mm |
e3 |
30 |
245 |
15.9 mm |
|||||||||||||||||||||||||||||||
STMicroelectronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
SEGMENT |
NO |
CMOS |
3 mA |
5/15 |
IN-LINE |
DIP16,.3 |
4 |
0-BP |
Other Interface ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1.8 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
1.16 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1.65 V |
GRID ARRAY |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B25 |
3 |
1.16 mm |
3 mm |
Not Qualified |
e1 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
CMOS |
3.3 V |
FLATPACK |
3.15 V |
.5 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
Not Qualified |
e4 |
40 |
260 |
7 mm |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
-48 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
PURE TIN/NICKEL PALLADIUM GOLD |
DUAL |
S-XDSO-N8 |
1 mm |
3 mm |
Not Qualified |
e3/e4 |
40 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP28,.4 |
2.7 V |
1.27 mm |
85 Cel |
-25 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
e4 |
30 |
250 |
17.9 mm |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
-48 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
PURE TIN/NICKEL PALLADIUM GOLD |
DUAL |
S-XDSO-N8 |
1 mm |
3 mm |
Not Qualified |
e3/e4 |
40 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6.5 V |
1 |
3.3 V |
6.5 V |
SMALL OUTLINE |
4 V |
2.7 V |
1.27 mm |
85 Cel |
5 V |
-25 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
ALSO REQUIRES A SUPPLY OF 3V TO 6.5V |
e3 |
30 |
260 |
17.9 mm |
|||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-XQCC-N24 |
1 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.4 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G24 |
3 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
7.8 mm |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6.5 V |
1 |
3.3 V |
6.5 V |
SMALL OUTLINE |
4.5 V |
2.7 V |
1.27 mm |
85 Cel |
5 V |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
30 |
250 |
17.9 mm |
||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP16,.25 |
2.7 V |
1.27 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
CMOS |
3.3 V |
FLATPACK |
3.15 V |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP16,.25 |
2.7 V |
1.27 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
2.7 V |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-XQCC-N16 |
.8 mm |
2.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2.9 mm |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
-48 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
PURE TIN/NICKEL PALLADIUM GOLD |
DUAL |
S-XDSO-N8 |
1 mm |
3 mm |
Not Qualified |
e3/e4 |
40 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-XQCC-N24 |
1 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
1.16 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1.8 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B36 |
1.16 mm |
3.6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3.6 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1.8 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.4 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.5 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
2.7 V |
.65 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
1.2 mm |
4.4 mm |
ALSO OPERATES AT 5V SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
9.7 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
2.7 V |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-XQCC-N16 |
.8 mm |
2.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2.9 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.