10 Voltage Level Translators 22

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	No. of Bits	Maximum Supply Current	Output Latch/Register	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Maximum Delay	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Output Polarity	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NVT2003DP,118	NXP Semiconductors	VOLTAGE LEVEL TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		3		NONE		5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.8 V		1 V	.5 mm	85 Cel	OPEN-EMITTER	-40 Cel		DUAL	S-PDSO-G10	1	1.1 mm	3 mm		TRUE	TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE		30	260	3 mm
SY55857LKG	Microchip Technology	LVDS TO PECL TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2		1	45 mA	NONE	3.3 V			.4 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.20,20			3 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G10	2	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY		e4			3 mm
SY55855VKG	Microchip Technology	PECL TO LVDS TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.7 V	2		1	80 mA	NONE	3.3 V			.7 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20			3 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G10	2	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	CML-TO-LVDS TRANSLATION ALSO POSSIBLE	e4	40	260	3 mm
MAX9176EUB-T	Maxim Integrated	LVDS TO LVDS TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	1	40 mA	NONE	3.3 V			3.31 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.20,20			3 V	.5 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	S-PDSO-G10		1.1 mm	3 mm		COMPLEMENTARY		e0			3 mm
MAX9176EUB+T	Analog Devices	LVDS TO LVDS TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	1	40 mA	NONE	3.3 V			3.31 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.20,20			3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm		COMPLEMENTARY		e3	30	260	3 mm
MAX9176EUB	Maxim Integrated	LVDS TO LVDS TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	1	40 mA	NONE	3.3 V			3.31 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.20,20			3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm		COMPLEMENTARY		e0		245	3 mm
MAX9176EUB+	Analog Devices	LVDS TO LVDS TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	1	40 mA	NONE	3.3 V			3.31 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.20,20			3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm		COMPLEMENTARY		e3	30	260	3 mm
MAX9177EUB+	Maxim Integrated	CML/LVDS/LVPECL TO LVDS TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	1	40 mA	NONE	3.3 V			3.31 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.20,20			3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm		COMPLEMENTARY		e3	30	260	3 mm
MAX9177EUB	Maxim Integrated	CML/LVDS/LVPECL TO LVDS TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	1	40 mA	NONE	3.3 V			3.31 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.20,20			3 V	.5 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	S-PDSO-G10	1	1.1 mm	3 mm		COMPLEMENTARY		e0			3 mm
SY55855VKG-TR	Microchip Technology	PECL TO LVDS TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.7 V	2		1	80 mA	NONE	3.3 V			.7 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20			3 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G10	2	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY	CML-TO-LVDS TRANSLATION ALSO POSSIBLE	e4	40	260	3 mm
MAX9177ETB	Analog Devices	CML/LVDS/LVPECL TO LVDS TRANSLATOR	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	1	40 mA	NONE	3.3 V			3.31 ns	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20			3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-N10		.8 mm	3 mm		COMPLEMENTARY		e0			3 mm
MAX9176ETB	Analog Devices	LVDS TO LVDS TRANSLATOR	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	1	40 mA	NONE	3.3 V			3.31 ns	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20			3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-N6		.8 mm	3 mm		COMPLEMENTARY		e0			3 mm
MAX9376EUB+T	Analog Devices	LVDS TO PECL TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BIPOLAR	1		NONE	3.3 V		3.3	.6 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY		e3	30	260	3 mm
MAX9376EUB+	Analog Devices	LVDS TO PECL TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BIPOLAR	1		NONE	3.3 V		3.3	.6 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY		e3	30	260	3 mm
935292069118	NXP Semiconductors	GTL TO TTL TRANSCEIVER	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		3		NONE		5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.8 V		1 V	.5 mm	85 Cel	OPEN-EMITTER	-40 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm		TRUE	TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE				3 mm
NVT4558HKX	NXP Semiconductors	VOLTAGE LEVEL TRANSLATOR		NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V	1		1	.01 mA	LATCH	1.8 V				CHIP CARRIER, VERY THIN PROFILE	LCC10,.05X0.07,16			1.08 V	.4 mm	85 Cel	OPEN-DRAIN	-40 Cel		QUAD	R-PQCC-N10		.5 mm	1.4 mm							1.8 mm
NVT2003DP	NXP Semiconductors	VOLTAGE LEVEL TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		3		NONE		5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.8 V		1 V	.5 mm	85 Cel	OPEN-EMITTER	-40 Cel		DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	TRUE	TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE				3 mm
PI4ULS3V4103XEAEX	Diodes Incorporated	VOLTAGE LEVEL TRANSLATOR		NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	2 V	1			.01 mA	LATCH	1.2 V			15 ns	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16			1.1 V	.4 mm	85 Cel		-40 Cel		QUAD	R-XQCC-N10		.5 mm	1.4 mm							1.8 mm
MAX9376EUB-T	Maxim Integrated	LVDS TO PECL TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BIPOLAR	1		NONE	3.3 V		3.3	.6 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY		e0		245	3 mm
MAX9177EUB-T	Maxim Integrated	CML/LVDS/LVPECL TO LVDS TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	1	40 mA	NONE	3.3 V			3.31 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.20,20			3 V	.5 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	S-PDSO-G10	1	1.1 mm	3 mm		COMPLEMENTARY		e0			3 mm
MAX9177EUB+T	Maxim Integrated	CML/LVDS/LVPECL TO LVDS TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	1	40 mA	NONE	3.3 V			3.31 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.20,20			3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm		COMPLEMENTARY		e3	30	260	3 mm
MAX9376EUB	Maxim Integrated	LVDS TO PECL TRANSLATOR	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BIPOLAR	1		NONE	3.3 V		3.3	.6 ns	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	COMPLEMENTARY		e0			3 mm

Voltage Level Translators

Voltage level translators are electronic components used to convert voltage levels between different devices in electronic systems. They are used to ensure that signals are compatible and can be correctly interpreted. Voltage level translators are essential components in electronic systems that require the exchange of data and signals between different components.

Voltage level translators can be classified into several types based on their specific characteristics and applications. The most common types of voltage level translators include unidirectional and bidirectional translators.

Unidirectional voltage level translators convert signals in one direction, typically from a low voltage to a higher voltage. They are commonly used in applications where data is transmitted from a low-power device to a higher-power device. Bidirectional voltage level translators can convert signals in both directions and are commonly used in applications where data is transmitted bidirectionally between two devices.

Voltage level translators are typically characterized by their voltage range, speed, power consumption, and compatibility with different voltage levels. They are commonly used in various electronic systems, such as communications, industrial automation, and automotive electronics.