Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Maximum Supply Current | Output Latch/Register | Input Characteristics | Nominal Supply Voltage | Maximum Supply Voltage-1 | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage-1 | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Texas Instruments |
PECL TO LVPECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
||||||||||||
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
1.65 V |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
14 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,16 |
1.65 V |
1.2 V |
.4 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
DUAL |
S-PDSO-N14 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
1.65 V |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
1.65 V |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
1.65 V |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
1.65 V |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B9 |
.67 mm |
1.52 mm |
Not Qualified |
TRUE |
e0 |
1.52 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
1.65 V |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
14 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,16 |
1.65 V |
1.2 V |
.4 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
DUAL |
S-PDSO-N14 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
14 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,16 |
1.65 V |
1.2 V |
.4 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
DUAL |
S-PDSO-N14 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
1.65 V |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B9 |
.67 mm |
1.52 mm |
Not Qualified |
TRUE |
e0 |
1.52 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
1.65 V |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
BOTTOM |
S-PBGA-B9 |
1 |
.67 mm |
1.52 mm |
Not Qualified |
TRUE |
1.52 mm |
||||||||||||
Analog Devices |
CML/LVDS/LVPECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N10 |
.8 mm |
3 mm |
COMPLEMENTARY |
e0 |
3 mm |
|||||||||||||||||
|
Analog Devices |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
1 |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
||||||||||||||
|
Analog Devices |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
1 |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1.1 mm |
3 mm |
COMPLEMENTARY |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||
|
Analog Devices |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
1 |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
||||||||||||||
|
Analog Devices |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
1 |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
||||||||||||||
|
Analog Devices |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3/5 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
Analog Devices |
LVDS TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N6 |
.8 mm |
3 mm |
COMPLEMENTARY |
e0 |
3 mm |
|||||||||||||||||
|
Analog Devices |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
1 |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
||||||||||||||
|
Analog Devices |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Other Interface ICs |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
Analog Devices |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
1 |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
3 mm |
||||||||||||||||||||
|
Analog Devices |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
1 |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
||||||||||||||
|
Analog Devices |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Other Interface ICs |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
Onsemi |
TTL TO ECL TRANSLATOR |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL100K |
6 |
38 mA |
5 V |
-5 V |
2.8 ns |
CHIP CARRIER |
LDCC28,.5SQ |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.43 mm |
COMPLEMENTARY |
11.43 mm |
|||||||||||||||||||
|
Onsemi |
PECL TO LVPECL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
4 |
NONE |
2.5 V |
10 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V |
e3 |
30 |
260 |
5 mm |
||||||||||||||
|
Onsemi |
PECL TO LVPECL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
4 |
NONE |
2.5 V |
10 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V |
e3 |
30 |
260 |
5 mm |
||||||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
1 |
NONE |
2.5 V |
.225 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
3 mm |
||||||||||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
1 |
NONE |
2.5 V |
.225 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
3 mm |
||||||||||||||||||
Onsemi |
ECL TO TTL TRANSLATOR |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
6 |
65 mA |
NONE |
DIFFERENTIAL |
5 V |
-5.7 V |
-5 V |
4.6 ns |
CHIP CARRIER |
LDCC28,.5SQ |
-4.2 V |
4.5 V |
1.27 mm |
85 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
7 mm |
TRUE |
7 mm |
||||||||||||||||
|
Onsemi |
ECL TO TTL TRANSLATOR |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
6 |
65 mA |
NONE |
DIFFERENTIAL |
5 V |
-5.7 V |
-5 V |
4.6 ns |
CHIP CARRIER |
LDCC28,.5SQ |
-4.2 V |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-J28 |
2 |
4.57 mm |
7 mm |
TRUE |
e3 |
7 mm |
||||||||||||
|
Onsemi |
ECL TO TTL TRANSLATOR |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
6 |
65 mA |
NONE |
DIFFERENTIAL |
5 V |
-5.7 V |
-5 V |
4.6 ns |
CHIP CARRIER |
LDCC28,.5SQ |
-4.2 V |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
7 mm |
TRUE |
7 mm |
|||||||||||||||
Onsemi |
TTL TO ECL TRANSLATOR |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL100K |
6 |
38 mA |
5 V |
-5 V |
2.8 ns |
CHIP CARRIER |
LDCC28,.5SQ |
4.5 V |
1.27 mm |
85 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.43 mm |
COMPLEMENTARY |
11.43 mm |
|||||||||||||||||||
Onsemi |
ECL TO TTL TRANSLATOR |
MILITARY |
NO LEAD |
16 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
4 |
MIL-STD-883 |
4 |
NONE |
5 V |
-5.2 V |
CHIP CARRIER |
125 Cel |
TOTEM-POLE |
-55 Cel |
QUAD |
S-XQCC-N16 |
Not Qualified |
TRUE |
|||||||||||||||||||||||||
Onsemi |
TTL TO ECL TRANSLATOR |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL100K |
6 |
38 mA |
5 V |
-5 V |
2.8 ns |
CHIP CARRIER |
LDCC28,.5SQ |
4.5 V |
1.27 mm |
85 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.43 mm |
COMPLEMENTARY |
11.43 mm |
|||||||||||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
1 |
NONE |
2.5 V |
.225 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
30 |
260 |
3 mm |
||||||||||||||||
Onsemi |
ECL TO TTL TRANSLATOR |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
6 |
65 mA |
NONE |
DIFFERENTIAL |
5 V |
-5.7 V |
-5 V |
4.6 ns |
CHIP CARRIER |
LDCC28,.5SQ |
-4.2 V |
4.5 V |
1.27 mm |
85 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
7 mm |
TRUE |
7 mm |
||||||||||||||||
Onsemi |
TTL/CMOS TO CMOS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
6 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2/3.3 |
0 ns |
SMALL OUTLINE |
SOLCC6,.04,14 |
Other Interface ICs |
.35 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N6 |
Not Qualified |
||||||||||||||||||||||||||||
Onsemi |
TTL TO ECL TRANSLATOR |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL100K |
6 |
38 mA |
5 V |
-5 V |
2.8 ns |
CHIP CARRIER |
LDCC28,.5SQ |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.43 mm |
COMPLEMENTARY |
11.43 mm |
|||||||||||||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.6 ns |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Level Translators |
3 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
260 |
2 mm |
|||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
2.2 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
TOTEM-POLE |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
||||||||||
Onsemi |
PECL TO TTL TRANSLATOR |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
6 |
ECL |
1 |
REGISTER |
5 V |
5 |
8.3 ns |
CHIP CARRIER |
LDCC28,.5SQ |
Level Translators |
4.75 V |
1.27 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
e0 |
11.505 mm |
|||||||||||||||
|
Onsemi |
TTL/NMOS TO ECL TRANSLATOR |
COMMERCIAL EXTENDED |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
4 |
ECL |
1 |
NONE |
5 V |
5.25 V |
2.2 ns |
CHIP CARRIER |
LDCC(UNSPEC) |
4.75 V |
Level Translators |
4.75 V |
1.27 mm |
75 Cel |
5 V |
OPEN-EMITTER |
0 Cel |
TIN |
QUAD |
S-PQCC-J20 |
3 |
4.57 mm |
8.965 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
8.965 mm |
||||||||
|
Onsemi |
ECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL |
1 |
NONE |
5 V |
+-5 |
-5 V |
4.1 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.5 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
||||||||||
Onsemi |
TTL TO ECL TRANSLATOR |
COMMERCIAL EXTENDED |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
4 |
ECL |
2 |
NONE |
5 V |
5,-5.2 |
-5.2 V |
3.1 ns |
CHIP CARRIER |
LDCC20,.4SQ |
Level Translators |
4.75 V |
1.27 mm |
75 Cel |
OPEN-EMITTER |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
1 |
4.57 mm |
8.965 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
235 |
8.965 mm |
Voltage level translators are electronic components used to convert voltage levels between different devices in electronic systems. They are used to ensure that signals are compatible and can be correctly interpreted. Voltage level translators are essential components in electronic systems that require the exchange of data and signals between different components.
Voltage level translators can be classified into several types based on their specific characteristics and applications. The most common types of voltage level translators include unidirectional and bidirectional translators.
Unidirectional voltage level translators convert signals in one direction, typically from a low voltage to a higher voltage. They are commonly used in applications where data is transmitted from a low-power device to a higher-power device. Bidirectional voltage level translators can convert signals in both directions and are commonly used in applications where data is transmitted bidirectionally between two devices.
Voltage level translators are typically characterized by their voltage range, speed, power consumption, and compatibility with different voltage levels. They are commonly used in various electronic systems, such as communications, industrial automation, and automotive electronics.