Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Maximum Supply Current | Output Latch/Register | Input Characteristics | Nominal Supply Voltage | Maximum Supply Voltage-1 | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage-1 | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
AEC-Q100 |
4 |
.04 mA |
1.5 V |
1.2/3.6,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC14/18,.14SQ,20 |
Other Interface ICs |
1.2 V |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N14 |
2 |
1 mm |
3.5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
3.5 mm |
|||||||||||||
|
Onsemi |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
2 |
100 mA |
1.8 V |
1.8/5 |
115 ns |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,.06SQ,20 |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N8 |
1 |
.55 mm |
1.6 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
1.6 mm |
|||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3 |
NONE |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
3 mm |
||||||||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
1.8 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
1 |
5 mA |
NONE |
3.3 V |
3/3.3 |
250 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Line Driver or Receivers |
2.7 V |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
3 mm |
|||||||||
|
Microchip Technology |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
2 |
1 |
25 mA |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
3.135 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
CAN ALSO OPERATE WITH 5V SUPPLY |
e4 |
40 |
260 |
3 mm |
||||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
14 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,16 |
1.65 V |
1.2 V |
.4 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
||||||||
|
Microchip Technology |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
20 mA |
NONE |
3.3 V |
2.5 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e4 |
40 |
260 |
3 mm |
||||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
2.5 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Microchip Technology |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
20 mA |
NONE |
3.3 V |
2.5 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.9754 mm |
2 mm |
Not Qualified |
TRUE |
e4 |
40 |
260 |
2 mm |
|||||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
40 mA |
NONE |
DIFFERENTIAL |
3.3 V |
3.3 |
2.2 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Microchip Technology |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
1 |
30 mA |
NONE |
3.3 V |
2.5 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.9754 mm |
2 mm |
TRUE |
e4 |
40 |
260 |
2 mm |
||||||||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
2 |
ECL |
1 |
NONE |
3.3 V |
-4.5 |
-4.5 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Microchip Technology |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
1 |
45 mA |
NONE |
3.3 V |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
2 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
3 mm |
|||||||||||||||
Renesas Electronics |
CMOS TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
3.3 V |
2.5/3.3 |
0 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Level Translators |
2.2 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Microchip Technology |
PECL-TTL/TTL-PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
40 mA |
NONE |
3.3 V |
2.5 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.9754 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
40 |
260 |
2 mm |
|||||||||||||
|
Onsemi |
TTL TO ECL TRANSLATOR |
COMMERCIAL EXTENDED |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
4 |
ECL |
2 |
NONE |
5 V |
5,-5.2 |
-5.2 V |
3.1 ns |
CHIP CARRIER |
LDCC20,.4SQ |
Level Translators |
4.75 V |
1.27 mm |
75 Cel |
OPEN-EMITTER |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
3 |
4.57 mm |
8.965 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
8.965 mm |
|||||||||
Onsemi |
TTL TO ECL TRANSCEIVER |
COMMERCIAL EXTENDED |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
ECL |
1 |
NONE |
5 V |
4.8 ns |
CHIP CARRIER |
4.5 V |
1.27 mm |
75 Cel |
3-STATE |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
1 |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
235 |
11.505 mm |
|||||||||||||||
Renesas Electronics |
CMOS TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
3.3 V |
2.5/3.3 |
0 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Level Translators |
2.2 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
PECL TO CML TRANSLATOR |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
1.1 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
70 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
5 mm |
|||||||||||||||
|
Onsemi |
TTL TO ECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL |
1 |
NONE |
5 V |
5,-4.5/-5.2 |
-5 V |
2 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.5 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
||||||||||
Maxim Integrated |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
245 |
3 mm |
|||||||||||||
|
Analog Devices |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
Maxim Integrated |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
3 mm |
||||||||||||||
|
Analog Devices |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Microchip Technology |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.7 V |
2 |
1 |
80 mA |
NONE |
3.3 V |
.7 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
2 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
CML-TO-LVDS TRANSLATION ALSO POSSIBLE |
e4 |
40 |
260 |
3 mm |
||||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
1.65 V |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B9 |
1 |
.67 mm |
1.52 mm |
Not Qualified |
TRUE |
e1 |
30 |
260 |
1.52 mm |
||||||||
Maxim Integrated |
LVDS TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
S-PDSO-G10 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e0 |
3 mm |
|||||||||||||||||
|
Analog Devices |
LVDS TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||||
Maxim Integrated |
LVDS TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e0 |
245 |
3 mm |
|||||||||||||||
|
Analog Devices |
LVDS TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
3.25 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
Micrel |
PECL-TTL/TTL-PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
3.3 |
2.5 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Level Translators |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-XQCC-N8 |
2 |
.9754 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
30 |
240 |
2 mm |
|||||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
2.25 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
LVTTL/LVCMOS TO LVECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
10 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.875 ns |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Level Translators |
3 V |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQFP-G32 |
2 |
1.6 mm |
7 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
7 mm |
|||||||||||
|
Maxim Integrated |
CML/LVDS/LVPECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||||
Maxim Integrated |
CML/LVDS/LVPECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e0 |
3 mm |
||||||||||||||||
Maxim Integrated |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3/5 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
245 |
3 mm |
|||||||||||||
|
Analog Devices |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3/5 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
TTL/CMOS TO CMOS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
12 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
4 |
.01 mA |
1.2/3.3 |
8.5 ns |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07SQ,16 |
Other Interface ICs |
1.1 V |
.4 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N12 |
1 |
.55 mm |
1.8 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
1.8 mm |
||||||||||||
|
M/a-com Technology Solutions |
TTL TO GAAS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
CMOS |
1 |
.02 mA |
5 V |
+-5 |
-5 V |
25 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Other Interface ICs |
4.5 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N20 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
4 mm |
|||||||||||
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
ECL |
1 |
NONE |
5 V |
-4.5 |
-4.5 V |
1.25 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.75 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
235 |
3 mm |
||||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
ECL |
1 |
NONE |
5 V |
5 |
5.5 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.75 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
ECL |
1 |
NONE |
5 V |
5 |
5.5 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.75 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.45 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.45 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SOP8,.25 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
Onsemi |
ECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL |
1 |
NONE |
5 V |
+-5 |
-5 V |
4.1 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.5 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e0 |
235 |
3 mm |
|||||||||||||
|
Onsemi |
ECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL |
1 |
NONE |
5 V |
+-5 |
-5 V |
4.1 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.5 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
Voltage level translators are electronic components used to convert voltage levels between different devices in electronic systems. They are used to ensure that signals are compatible and can be correctly interpreted. Voltage level translators are essential components in electronic systems that require the exchange of data and signals between different components.
Voltage level translators can be classified into several types based on their specific characteristics and applications. The most common types of voltage level translators include unidirectional and bidirectional translators.
Unidirectional voltage level translators convert signals in one direction, typically from a low voltage to a higher voltage. They are commonly used in applications where data is transmitted from a low-power device to a higher-power device. Bidirectional voltage level translators can convert signals in both directions and are commonly used in applications where data is transmitted bidirectionally between two devices.
Voltage level translators are typically characterized by their voltage range, speed, power consumption, and compatibility with different voltage levels. They are commonly used in various electronic systems, such as communications, industrial automation, and automotive electronics.