Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Maximum Supply Current | Output Latch/Register | Input Characteristics | Nominal Supply Voltage | Maximum Supply Voltage-1 | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage-1 | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
PECL-TTL/TTL-PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
2 |
ECL |
1 |
NONE |
5 V |
5 |
5.5 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.75 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
Onsemi |
ECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL |
1 |
NONE |
5 V |
+-5 |
-5 V |
4.1 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.5 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e0 |
235 |
3 mm |
||||||||||||
|
Onsemi |
TTL TO ECL TRANSLATOR |
COMMERCIAL EXTENDED |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
4 |
ECL |
1 |
NONE |
5 V |
5,-5.2 |
-5.2 V |
2.3 ns |
CHIP CARRIER |
LDCC20,.4SQ |
Level Translators |
4.75 V |
1.27 mm |
75 Cel |
OPEN-EMITTER |
0 Cel |
TIN |
QUAD |
S-PQCC-J20 |
3 |
4.57 mm |
8.965 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
260 |
8.965 mm |
||||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
ECL |
1 |
NONE |
5 V |
-4.5 |
-4.5 V |
1.25 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.75 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
||||||||||
|
Onsemi |
ECL TO TTL TRANSLATOR |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
9 |
ECL |
1 |
LATCH |
5 V |
5,-4.5 |
-4.5 V |
12 ns |
CHIP CARRIER |
LDCC28,.5SQ |
Level Translators |
4.5 V |
1.27 mm |
85 Cel |
3-STATE |
0 Cel |
TIN |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
260 |
11.505 mm |
|||||||||||
Onsemi |
ECL TO TTL TRANSLATOR |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
6 |
ECL |
1 |
REGISTER |
5 V |
-5.2 |
-5.2 V |
6.7 ns |
CHIP CARRIER |
LDCC28,.5SQ |
Level Translators |
4.5 V |
1.27 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
1 |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
e0 |
235 |
11.505 mm |
||||||||||||
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.7 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
235 |
3 mm |
||||||||||||||
|
Onsemi |
TTL TO ECL TRANSLATOR |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
6 |
ECL |
1 |
REGISTER |
5 V |
5,-5.2 |
4 ns |
CHIP CARRIER |
LDCC28,.5SQ |
Level Translators |
4.5 V |
1.27 mm |
85 Cel |
OPEN-EMITTER |
0 Cel |
TIN |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
260 |
11.505 mm |
||||||||||||
Onsemi |
TTL TO ECL TRANSLATOR |
OTHER |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
ECL10K |
1 |
NONE |
5 V |
5,-5.2 |
-5.2 V |
6 ns |
CHIP CARRIER |
LDCC20,.4SQ |
Level Translators |
1.27 mm |
85 Cel |
OPEN-EMITTER |
-30 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
1 |
4.57 mm |
8.965 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
235 |
8.965 mm |
|||||||||||||
STMicroelectronics |
TTL/CMOS TO CMOS TRANSLATOR |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
6 |
CMOS |
1 |
NONE |
3/18 |
0 ns |
CHIP CARRIER |
LDCC20,.4SQ |
Level Translators |
1.27 mm |
QUAD |
S-PQCC-J20 |
4.57 mm |
8.9662 mm |
Not Qualified |
TRUE |
8.9662 mm |
|||||||||||||||||||||||
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
S-PQCC-N24 |
1 mm |
4 mm |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
4 mm |
||||||||||||||||||
|
NXP Semiconductors |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
3 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
3 mm |
|||||||||||||||||
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3 |
NONE |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
DUAL |
S-PDSO-G10 |
1.1 mm |
3 mm |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
3 mm |
||||||||||||||||||||
NXP Semiconductors |
CMOS TO ECL TRANSLATOR |
OTHER |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.1 V |
1 |
4 |
NONE |
1.8 V |
10.1 ns |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.62 V |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B24 |
.66 mm |
2.01 mm |
Not Qualified |
TRUE |
IT ALSO NEED 2.7 TO 5 VOLT BATTERY SUPPLY |
2.01 mm |
||||||||||||||||||||
NXP Semiconductors |
CMOS TO ECL TRANSLATOR |
OTHER |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.1 V |
1 |
4 |
NONE |
1.8 V |
10.1 ns |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.62 V |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B24 |
.65 mm |
1.99 mm |
Not Qualified |
TRUE |
IT ALSO NEED 2.7 TO 5 VOLT BATTERY SUPPLY |
1.99 mm |
||||||||||||||||||||
|
NXP Semiconductors |
CMOS TO ECL TRANSLATOR |
OTHER |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.1 V |
1 |
1 |
NONE |
1.8 V |
1.8 |
10.1 ns |
GRID ARRAY |
BGA24,5X5,16 |
Other Interface ICs |
1.62 V |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B24 |
.66 mm |
2.01 mm |
Not Qualified |
TRUE |
2.01 mm |
|||||||||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
1 |
5 mA |
NONE |
3.3 V |
250 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.7 V |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
DUAL |
S-PDSO-G8 |
1.1 mm |
3 mm |
TRUE |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||
|
NXP Semiconductors |
CMOS TO ECL TRANSLATOR |
OTHER |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.1 V |
1 |
1 |
NONE |
1.8 V |
1.8 |
10.1 ns |
GRID ARRAY |
BGA24,5X5,16 |
Other Interface ICs |
1.62 V |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B24 |
.66 mm |
2.01 mm |
Not Qualified |
TRUE |
2.01 mm |
|||||||||||||||||
|
NXP Semiconductors |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
3 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
40 |
260 |
3 mm |
||||||||||||||||||
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
NONE |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 mm |
3 mm |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
3 mm |
||||||||||||||||||||
|
NXP Semiconductors |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
3 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
3 mm |
|||||||||||||||||
|
NXP Semiconductors |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
3.3 |
3 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SOP8,.25 |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
260 |
3 mm |
|||||||||||||
|
NXP Semiconductors |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
3.3 |
3 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SOP8,.25 |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
260 |
3 mm |
||||||||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3 |
NONE |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
3 mm |
|||||||||||||||||
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
4 mm |
||||||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
NONE |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 |
1 mm |
3 mm |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
3 mm |
||||||||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
NONE |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
3 mm |
|||||||||||||||||
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
e4 |
4 mm |
|||||||||||||
Infineon Technologies |
ECL TO TTL TRANSLATOR |
MILITARY |
J BEND |
84 |
QCCJ |
SQUARE |
CERAMIC |
YES |
BICMOS |
38535Q/M;38534H;883B |
5,-5.2 |
CHIP CARRIER |
LDCC84,1.2SQ |
Level Translators |
1.27 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-XQCC-J84 |
Not Qualified |
e0 |
|||||||||||||||||||||||||
|
Nexperia |
VOLTAGE LEVEL TRANSLATOR |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 V |
1 |
AEC-Q100 |
2 |
STANDARD |
1 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.16 |
0 V |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
TRUE |
e4 |
30 |
260 |
3 mm |
|||||||||||||||
|
Maxim Integrated |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
1.65 V |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B9 |
1 |
.67 mm |
1.52 mm |
Not Qualified |
TRUE |
e1 |
30 |
260 |
1.52 mm |
||||||||
|
Maxim Integrated |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
14 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,16 |
1.65 V |
1.2 V |
.4 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
||||||||
|
Maxim Integrated |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
1.65 V |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B9 |
1 |
.67 mm |
1.52 mm |
Not Qualified |
TRUE |
e1 |
30 |
260 |
1.52 mm |
||||||||
|
Maxim Integrated |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
14 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,16 |
1.65 V |
1.2 V |
.4 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
Matte Tin (Sn) |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
||||||||
|
Maxim Integrated |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
14 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,16 |
1.65 V |
1.2 V |
.4 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
||||||||
Maxim Integrated |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
245 |
3 mm |
|||||||||||||
|
Maxim Integrated |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BIPOLAR |
1 |
NONE |
3.3 V |
-3.3 V |
.57 ns |
FLATPACK, THIN PROFILE, FINE PITCH |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
5 mm |
|||||||||||||
Maxim Integrated |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
4 |
BIPOLAR |
1 |
NONE |
3.3 V |
-3.3 V |
.45 ns |
CHIP CARRIER, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
5 mm |
||||||||||||||||
Maxim Integrated |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Other Interface ICs |
3 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
245 |
3 mm |
|||||||||||||
Maxim Integrated |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
4 |
BIPOLAR |
1 |
NONE |
3.3 V |
-3.3 V |
.45 ns |
CHIP CARRIER, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
5 mm |
|||||||||||||||
Maxim Integrated |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3/5 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
245 |
3 mm |
|||||||||||||
Maxim Integrated |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
1 |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
245 |
3 mm |
||||||||||||||||
|
Maxim Integrated |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BIPOLAR |
1 |
NONE |
3.3 V |
-3.3 V |
.45 ns |
FLATPACK, THIN PROFILE, FINE PITCH |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
5 mm |
|||||||||||||
Maxim Integrated |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BIPOLAR |
1 |
NONE |
3.3 V |
-2.5/-3.3/2.5/3.3 |
-3.3 V |
.45 ns |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Level Translators |
2.375 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
5 mm |
||||||||||||
Maxim Integrated |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BIPOLAR |
1 |
NONE |
3.3 V |
+-2.5/+-5 |
-3.3 V |
.57 ns |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Level Translators |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
5 mm |
|||||||||||||
Maxim Integrated |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BIPOLAR |
1 |
NONE |
3.3 V |
-3.3 V |
.45 ns |
FLATPACK, THIN PROFILE, FINE PITCH |
2.375 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
5 mm |
|||||||||||||||
Maxim Integrated |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
4 |
BIPOLAR |
1 |
NONE |
3.3 V |
-3.3 V |
.45 ns |
CHIP CARRIER, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
5 mm |
|||||||||||||||
Maxim Integrated |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
4 |
BIPOLAR |
1 |
NONE |
3.3 V |
-3.3 V |
.57 ns |
CHIP CARRIER, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
5 mm |
Voltage level translators are electronic components used to convert voltage levels between different devices in electronic systems. They are used to ensure that signals are compatible and can be correctly interpreted. Voltage level translators are essential components in electronic systems that require the exchange of data and signals between different components.
Voltage level translators can be classified into several types based on their specific characteristics and applications. The most common types of voltage level translators include unidirectional and bidirectional translators.
Unidirectional voltage level translators convert signals in one direction, typically from a low voltage to a higher voltage. They are commonly used in applications where data is transmitted from a low-power device to a higher-power device. Bidirectional voltage level translators can convert signals in both directions and are commonly used in applications where data is transmitted bidirectionally between two devices.
Voltage level translators are typically characterized by their voltage range, speed, power consumption, and compatibility with different voltage levels. They are commonly used in various electronic systems, such as communications, industrial automation, and automotive electronics.