Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
BUS EXCHANGER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
TR, 7 INCH |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
.5 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
3 |
R-PQCC-N20 |
1 |
3.6 V |
1 mm |
2.5 mm |
TRUE |
3 V |
2.5 mA |
e4 |
30 |
260 |
4.5 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
TR, 13 INCH |
5 |
15 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
.3 ns |
.65 mm |
85 Cel |
BIDIRECTIONAL |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
COMMON CONTROL |
R-PDSO-G14 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
TRUE |
4.5 V |
.1 mA |
ALSO OPERATES AT 2.3 TO 3.6 V SUPPLY |
e4 |
30 |
260 |
5 mm |
9543 |
|||||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
TUBE |
5 |
15 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
.3 ns |
.65 mm |
85 Cel |
BIDIRECTIONAL |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
COMMON CONTROL |
R-PDSO-G14 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
TRUE |
4.5 V |
.1 mA |
ALSO OPERATES AT 2.3 TO 3.6 V SUPPLY |
e4 |
30 |
260 |
5 mm |
9543 |
|||||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
AUTOMOTIVE |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
4 |
2.5 |
2.5/3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.25 ns |
Other Logic ICs |
.65 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
1 |
3.6 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
2.3 V |
.05 mA |
e4 |
30 |
2 |
260 |
5 mm |
CBTLV/3B |
|||||||||||
|
Nexperia |
BUS EXCHANGER |
AUTOMOTIVE |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
4 |
TR, 13 INCH |
2.5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.25 ns |
.65 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
1 |
3.6 V |
1.1 mm |
4.4 mm |
TRUE |
2.3 V |
.05 mA |
e4 |
30 |
2 |
260 |
5 mm |
CBTLV/3B |
||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
TR, 13 INCH |
5 |
15 pF |
SMALL OUTLINE |
SOP14,.25 |
.3 ns |
1.27 mm |
85 Cel |
BIDIRECTIONAL |
POSITIVE EDGE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
COMMON CONTROL |
R-PDSO-G14 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
TRUE |
4.5 V |
.1 mA |
ALSO OPERATES AT 2.3 TO 3.6 V SUPPLY |
e4 |
30 |
260 |
8.65 mm |
9543 |
|||||||||||||||
|
Texas Instruments |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
TR, 13 INCH |
5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.24 ns |
Other Logic ICs |
.65 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
4 V |
.003 mA |
e4 |
30 |
260 |
5 mm |
CBT/FST/QS/5C/B |
||||||||||||
|
Analog Devices |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
2 |
3.3 |
3.3/5 |
50 pF |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.1 ns |
Other Logic ICs |
.635 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
1 |
3.63 V |
1.7526 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.97 V |
ALSO OPEARATES AT 5V VCC NOMINAL |
e3 |
260 |
4.9022 mm |
3257 |
|||||||||||||||
|
Onsemi |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
2 |
TR |
4.5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.25 ns |
Other Logic ICs |
.65 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
4 V |
100 mA |
e4 |
30 |
260 |
5 mm |
CBT/FST/QS/5C/B |
||||||||||||
|
Fairchild Semiconductor |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2 |
N/A |
TR |
4.5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
.25 ns |
Other Logic ICs |
.65 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
3 |
R-PDSO-G6 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
TRUE |
4 V |
e3 |
1 |
2 mm |
CBT/FST/Q |
|||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
8 |
TR |
2.5 |
2.5/3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.2 ns |
Multiplexer/Demultiplexers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
30 |
260 |
5 mm |
CB3Q/3VH/3C/2B |
||||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
2.5 |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.2 ns |
Other Logic ICs |
.635 mm |
85 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.75 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
30 |
260 |
4.9 mm |
||||||||||||||||||
|
Onsemi |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
2 |
TR |
4.5 |
5 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
.25 ns |
Other Logic ICs |
1.27 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4 V |
100 mA |
e3 |
30 |
260 |
9.9 mm |
CBT/FST/QS/5C/B |
||||||||||||
|
Texas Instruments |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 |
CMOS |
2 |
N/A |
TUBE |
5 |
5 |
SMALL OUTLINE |
SOP24,.4 |
.24 ns |
Other Logic ICs |
1.27 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
4 |
ENABLE LOW |
R-PDSO-G24 |
1 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
4 V |
.003 mA |
e4 |
30 |
260 |
15.4 mm |
CBT/FST/QS/5C/B |
||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
2.5 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.25 ns |
Other Logic ICs |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
3 |
R-PDSO-G16 |
1 |
3.6 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
30 |
260 |
5 mm |
CBTLV/3B |
|||||||||||||||||
|
Texas Instruments |
BUS EXCHANGER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
TR, 13 INCH |
5 |
5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16/20,.14X.16,20 |
.24 ns |
Other Logic ICs |
.5 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
2 |
ENABLE LOW |
R-PQCC-N16 |
2 |
5.5 V |
1 mm |
3.5 mm |
Not Qualified |
TRUE |
4 V |
.003 mA |
e4 |
30 |
260 |
4 mm |
CBT/FST/QS/5C/B |
||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
TR, 7 INCH |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.1X.18,20 |
.5 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
3 |
R-PQCC-N20 |
1 |
3.6 V |
1 mm |
2.5 mm |
Not Qualified |
TRUE |
3 V |
2.5 mA |
e4 |
30 |
260 |
4.5 mm |
CBT/FST/QS/5C/B |
||||||||||||||||
|
Texas Instruments |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
2 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.24 ns |
Other Logic ICs |
.65 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
4 V |
.003 mA |
e4 |
30 |
260 |
5 mm |
CBT/FST/QS/5C/B |
||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
8 |
2.5 |
2.5/3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.2 ns |
Multiplexer/Demultiplexers |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
30 |
260 |
5 mm |
CB3Q/3VH/3C/2B |
|||||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
2.5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.2 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
30 |
260 |
5 mm |
CB3Q/3VH/3C/2B |
|||||||||||||||||||||
|
Texas Instruments |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
1 |
N/A |
2.5 |
50 pF |
SMALL OUTLINE |
SOP16,.4 |
1 ns |
1.27 mm |
85 Cel |
BIDIRECTIONAL |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
4 |
COMMON CONTROL |
R-PDSO-G16 |
1 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
2.3 V |
.012 mA |
e4 |
30 |
1 |
260 |
10.3 mm |
9546 |
|||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
2.5 |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.2 ns |
Other Logic ICs |
.635 mm |
85 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.75 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
30 |
260 |
4.9 mm |
CB3Q/3VH/3C/2B |
|||||||||||||||||
Integrated Device Technology |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
2.5 |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.2 ns |
Other Logic ICs |
.635 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.75 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.3 V |
e0 |
20 |
240 |
4.9 mm |
CB3Q/3VH/3C/2B |
||||||||||||||||||
Integrated Device Technology |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
2.5 |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.2 ns |
Other Logic ICs |
.635 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.75 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.3 V |
e0 |
20 |
240 |
4.9 mm |
CB3Q/3VH/3C/2B |
||||||||||||||||||
|
Diodes Incorporated |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
3 V |
e3 |
4.9 mm |
3L |
|||||||||||||||||||||||
|
Texas Instruments |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
TR, 13 INCH |
5 |
5 |
50 pF |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.3 |
.24 ns |
Other Logic ICs |
.65 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
2 mm |
5.3 mm |
Not Qualified |
TRUE |
4 V |
.003 mA |
e4 |
30 |
260 |
6.2 mm |
CBT/FST/QS/5C/B |
||||||||||||
|
Texas Instruments |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
TR, 13 INCH |
5 |
5 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
.24 ns |
Other Logic ICs |
1.27 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4 V |
.003 mA |
e4 |
30 |
260 |
9.9 mm |
CBT/FST/QS/5C/B |
||||||||||||
|
Analog Devices |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
2 |
TR, 7 INCH |
3.3 |
3.3/5 |
50 pF |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.1 ns |
Other Logic ICs |
.635 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
1 |
3.63 V |
1.7526 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.97 V |
ALSO OPEARATES AT 5V VCC NOMINAL |
e3 |
260 |
4.9022 mm |
3257 |
||||||||||||||
|
Texas Instruments |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
TR, 13 INCH |
5 |
5 |
50 pF |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.24 ns |
Other Logic ICs |
.635 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
ENABLE LOW |
R-PDSO-G16 |
2 |
5.5 V |
1.75 mm |
3.895 mm |
Not Qualified |
TRUE |
4 V |
.003 mA |
e4 |
30 |
260 |
4.905 mm |
CBT/FST/QS/5C/B |
||||||||||||
|
Texas Instruments |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
8 |
N/A |
TR |
3.3 |
10 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
11.5 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
3 |
R-PDSO-G48 |
1 |
3.6 V |
1.2 mm |
6.1 mm |
Not Qualified |
TRUE |
3 V |
.6 mA |
e4 |
30 |
260 |
12.5 mm |
3DV |
|||||||||||||||||
|
Nexperia |
BUS EXCHANGER |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
4 |
TR, 7 INCH |
2.5 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.09X.14,20 |
.25 ns |
.5 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
3 |
ENABLE LOW |
R-PQCC-N16 |
1 |
3.6 V |
1 mm |
2.5 mm |
TRUE |
2.3 V |
.05 mA |
e4 |
30 |
2 |
260 |
3.5 mm |
CBTLV/3B |
||||||||||||
|
Analog Devices |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
2 |
TR |
3.3 |
3.3/5 |
50 pF |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.1 ns |
Other Logic ICs |
.635 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
1 |
3.63 V |
1.7526 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.97 V |
ALSO OPEARATES AT 5V VCC NOMINAL |
e3 |
260 |
4.9022 mm |
3257 |
||||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
56 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
8 |
N/A |
TR |
2.5 |
2.5/3.3 |
50 pF |
.2 ns |
Other Logic ICs |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
3 |
R-PDSO-G56 |
1 |
3.6 V |
Not Qualified |
TRUE |
2.3 V |
e3 |
30 |
2 |
260 |
CB3Q/3VH/3C/2B |
||||||||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
2.5 |
SMALL OUTLINE |
.2 ns |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
2 |
R-PDSO-G16 |
3 |
3.6 V |
1.7272 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
9.9 mm |
CB3Q/3VH/3C/2B |
|||||||||||||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
N/A |
TR, 13 INCH |
3.3 |
2.5/3.3 |
SMALL OUTLINE |
SOP16,.25 |
.25 ns |
Other Logic ICs |
1.27 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
DUAL |
2 |
ENABLE LOW |
R-PDSO-G16 |
1 |
3.6 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
2.3 V |
.05 mA |
30 |
260 |
9.9 mm |
CBTLV/3B |
||||||||||||||
|
NXP Semiconductors |
BUS EXCHANGER |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
4 |
2.5 |
2.5/3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.1X.14,20 |
.25 ns |
Other Logic ICs |
.5 mm |
125 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
QUAD |
3 |
ENABLE LOW |
R-PQCC-N16 |
1 |
3.6 V |
1 mm |
2.5 mm |
Not Qualified |
TRUE |
2.3 V |
.05 mA |
30 |
2 |
260 |
3.5 mm |
CBTLV/3B |
|||||||||||||
Analog Devices |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
2 |
3.3 |
3.3/5 |
50 pF |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.1 ns |
Other Logic ICs |
.635 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
TIN LEAD |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
1 |
3.63 V |
1.7526 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.97 V |
ALSO OPEARATES AT 5V VCC NOMINAL |
e0 |
240 |
4.9022 mm |
3257 |
||||||||||||||||
Analog Devices |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
2 |
TR, 7 INCH |
3.3 |
3.3/5 |
50 pF |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.1 ns |
Other Logic ICs |
.635 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
TIN LEAD |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
1 |
3.63 V |
1.7526 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.97 V |
ALSO OPEARATES AT 5V VCC NOMINAL |
e0 |
240 |
4.9022 mm |
3257 |
|||||||||||||||
|
Onsemi |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
TR |
4.5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.25 ns |
Other Logic ICs |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 |
ENABLE LOW |
R-PDSO-G16 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
4 V |
e4 |
30 |
260 |
5 mm |
CBT/FST/QS/5C/B |
||||||||||||||
Integrated Device Technology |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
2.5 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.2 ns |
Other Logic ICs |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
2.3 V |
e0 |
20 |
240 |
5 mm |
CB3Q/3VH/3C/2B |
||||||||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
2.5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.2 ns |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
40 |
260 |
5 mm |
CB3Q/3VH/3C/2B |
|||||||||||||||||||||
Integrated Device Technology |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
2.5 |
2.5/3.3 |
SMALL OUTLINE |
SOP16,.25 |
.2 ns |
Other Logic ICs |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
2 |
R-PDSO-G16 |
1 |
3.6 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
2.3 V |
e0 |
30 |
240 |
9.9 mm |
CB3Q/3VH/3C/2B |
||||||||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
2.5 |
SMALL OUTLINE |
.2 ns |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
2 |
R-PDSO-G16 |
3.6 V |
1.7272 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
9.9 mm |
CB3Q/3VH/3C/2B |
||||||||||||||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
12 |
TR |
2.5 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.3,20 |
.25 ns |
Other Logic ICs |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
4 |
R-PDSO-G56 |
1 |
3.6 V |
1.2 mm |
6.1 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
30 |
260 |
14 mm |
CBTLV/3B |
||||||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
12 |
TR |
2.5 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.3,20 |
.25 ns |
Bus Driver/Transceivers |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
3 |
R-PDSO-G56 |
1 |
3.6 V |
1.2 mm |
6.1 mm |
Not Qualified |
TRUE |
2.3 V |
e3 |
30 |
260 |
14 mm |
CBTLV/3B |
||||||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
N/A |
TUBE |
2.5 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.25 ns |
Other Logic ICs |
.65 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
2 |
ENABLE LOW |
R-PDSO-G16 |
1 |
3.6 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
2.3 V |
.01 mA |
e3 |
30 |
260 |
5 mm |
CBTLV/3B |
||||||||||||
|
Renesas Electronics |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
N/A |
TR |
2.5 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.25 ns |
Other Logic ICs |
.65 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
MATTE TIN |
DUAL |
2 |
ENABLE LOW |
R-PDSO-G16 |
1 |
3.6 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
2.3 V |
.01 mA |
e3 |
30 |
260 |
5 mm |
CBTLV/3B |
||||||||||||
Analog Devices |
BUS EXCHANGER |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
2 |
TR |
3.3 |
3.3/5 |
50 pF |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.1 ns |
Multiplexer/Demultiplexer |
.635 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
TIN LEAD |
DUAL |
3 |
ENABLE LOW |
R-PDSO-G16 |
3.63 V |
1.7526 mm |
3.9116 mm |
Not Qualified |
TRUE |
2.97 V |
ALSO OPEARATES AT 5V VCC NOMINAL |
e0 |
4.9022 mm |
3257 |
A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.
The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.
Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).
In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.
Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.