BUS EXCHANGER Bus Driver & Transceivers 1,018

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Part RoHS Manufacturer Logic IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Schmitt Trigger Surface Mount No. of Functions Maximum Frequency At Nominal Supply Technology Screening Level No. of Inputs No. of Bits Translation Packing Method Nominal Supply Voltage / Vsup (V) Power Supplies (V) Load Capacitance (CL) Package Style (Meter) Package Equivalence Code Propagation Delay (tpd) Maximum I (ol) Sub-Category Terminal Pitch Maximum Operating Temperature Count Direction Output Characteristics Trigger Type Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports Control Type Minimum fmax JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Output Polarity Minimum Supply Voltage (Vsup) Maximum Power Supply Current (ICC) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length Family

QS3VH257S1G8

Renesas Electronics

BUS EXCHANGER

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

4

CMOS

2

TR

2.5

2.5/3.3

50 pF

SMALL OUTLINE

SOP16,.25

.2 ns

Other Logic ICs

1.27 mm

85 Cel

UNIDIRECTIONAL

3-STATE

-40 Cel

MATTE TIN

DUAL

3

ENABLE LOW

R-PDSO-G16

3

3.6 V

1.72 mm

3.9 mm

Not Qualified

TRUE

2.3 V

e3

30

260

9.9 mm

CB3Q/3VH/3C/2B

QS3VH253PAG

Renesas Electronics

BUS EXCHANGER

INDUSTRIAL

GULL WING

16

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

4

TRAY; TUBE

2.5

2.5/3.3

50 pF

.2 ns

Other Logic ICs

85 Cel

BIDIRECTIONAL

3-STATE

-40 Cel

MATTE TIN

DUAL

2

ENABLE LOW

R-PDSO-G16

1

3.6 V

Not Qualified

TRUE

2.3 V

e3

30

260

CB3Q/3VH/3C/2B

QS3VH251PAG

Renesas Electronics

BUS EXCHANGER

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

8

TUBE

2.5

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

.2 ns

.65 mm

85 Cel

BIDIRECTIONAL

3-STATE

-40 Cel

MATTE TIN

DUAL

2

ENABLE LOW

R-PDSO-G16

1

3.6 V

1.2 mm

4.4 mm

Not Qualified

TRUE

2.3 V

e3

30

260

5 mm

CB3Q/3VH/3C/2B

QS34X383Q3G

Renesas Electronics

BUS EXCHANGER

INDUSTRIAL

GULL WING

80

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

4

CMOS

4

TUBE

5

5

SMALL OUTLINE, SHRINK PITCH

SSOP80,.25,20

.25 ns

Other Logic ICs

.5 mm

85 Cel

3-STATE

-40 Cel

MATTE TIN

DUAL

4

R-PDSO-G80

1

5.25 V

1.7526 mm

3.9116 mm

Not Qualified

TRUE

4.75 V

e3

260

20.4978 mm

CBT/FST/QS/5C/B

QS3VH257QG8

Renesas Electronics

BUS EXCHANGER

INDUSTRIAL

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

4

CMOS

2

TR

2.5

2.5/3.3

50 pF

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

.2 ns

Other Logic ICs

.635 mm

85 Cel

UNIDIRECTIONAL

3-STATE

-40 Cel

MATTE TIN

DUAL

3

ENABLE LOW

R-PDSO-G16

1

3.6 V

1.73 mm

3.9 mm

Not Qualified

TRUE

2.3 V

e3

30

260

4.89 mm

CB3Q/3VH/3C/2B

QS3VH251PAG8

Renesas Electronics

BUS EXCHANGER

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

8

TR

2.5

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

.2 ns

.65 mm

85 Cel

BIDIRECTIONAL

3-STATE

-40 Cel

MATTE TIN

DUAL

2

ENABLE LOW

R-PDSO-G16

1

3.6 V

1.2 mm

4.4 mm

Not Qualified

TRUE

2.3 V

e3

30

260

5 mm

CB3Q/3VH/3C/2B

QS3VH253PAG8

Renesas Electronics

BUS EXCHANGER

INDUSTRIAL

GULL WING

16

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

4

TR

2.5

2.5/3.3

50 pF

.2 ns

Other Logic ICs

85 Cel

BIDIRECTIONAL

3-STATE

-40 Cel

MATTE TIN

DUAL

2

ENABLE LOW

R-PDSO-G16

1

3.6 V

Not Qualified

TRUE

2.3 V

e3

30

260

CB3Q/3VH/3C/2B

IDTQS3VH253PAG

Renesas Electronics

BUS EXCHANGER

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

4

2.5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.2 ns

.65 mm

85 Cel

3-STATE

-40 Cel

MATTE TIN

DUAL

2

R-PDSO-G16

3.6 V

1.2 mm

4.4 mm

Not Qualified

TRUE

2.3 V

e3

5 mm

CB3Q/3VH/3C/2B

IDTQS34X383Q3G

Renesas Electronics

BUS EXCHANGER

INDUSTRIAL

GULL WING

80

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

4

CMOS

4

5

SMALL OUTLINE, SHRINK PITCH

.25 ns

.5 mm

85 Cel

3-STATE

-40 Cel

MATTE TIN

DUAL

4

R-PDSO-G80

5.25 V

1.7526 mm

3.9116 mm

Not Qualified

TRUE

4.75 V

e3

20.4978 mm

CBT/FST/QS/5C/B

IDTQS3257QG

Renesas Electronics

BUS EXCHANGER

INDUSTRIAL

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

4

5

5

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

.25 ns

Other Logic ICs

.635 mm

85 Cel

3-STATE

-40 Cel

Matte Tin (Sn) - annealed

DUAL

3

R-PDSO-G16

1

5.25 V

1.75 mm

3.9116 mm

Not Qualified

TRUE

4.75 V

e3

30

260

4.9 mm

3257

Bus Driver & Transceivers

A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.

The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.

Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).

In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.

Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.