Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
REGISTERED BUS TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
8 |
CMOS |
1 |
5 |
SMALL OUTLINE |
66 ns |
1.27 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G24 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
e4 |
15.4 mm |
HCT |
||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
1 |
TR |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,14 |
20.8 ns |
1.7 Amp |
Gates |
.35 mm |
125 Cel |
-40 Cel |
Tin (Sn) |
DUAL |
2 |
S-PDSO-N6 |
1 |
3.6 V |
.5 mm |
1 mm |
Not Qualified |
TRUE |
.8 V |
e3 |
30 |
260 |
1 mm |
AUP/ULP/V |
|||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
UNSPECIFIED |
UNSPECIFIED |
YES |
8 |
CMOS |
1 |
5 |
UNCASED CHIP |
180 ns |
125 Cel |
3-STATE |
-40 Cel |
UPPER |
2 |
X-XUUC-N |
6 V |
Not Qualified |
TRUE |
2 V |
HC/UH |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
UNSPECIFIED |
UNSPECIFIED |
YES |
8 |
CMOS |
1 |
5 |
UNCASED CHIP |
225 ns |
125 Cel |
3-STATE |
-40 Cel |
UPPER |
2 |
X-XUUC-N |
6 V |
Not Qualified |
TRUE |
2 V |
HC/UH |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
14 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
1 |
5 |
SMALL OUTLINE, SHRINK PITCH |
135 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G14 |
1 |
6 V |
2 mm |
5.3 mm |
Not Qualified |
TRUE |
2 V |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION |
e4 |
6.2 mm |
HC/UH |
|||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.5 |
SMALL OUTLINE, VERY THIN PROFILE |
23.5 ns |
.35 mm |
125 Cel |
3-STATE |
-40 Cel |
TIN |
DUAL |
2 |
S-PDSO-N6 |
5.5 V |
.35 mm |
1 mm |
TRUE |
1.2 V |
e3 |
1 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
1 |
5 |
SMALL OUTLINE |
150 ns |
1.27 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G14 |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
2 V |
e4 |
8.65 mm |
HC/UH |
||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
1 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
14.5 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
2 V |
3 mm |
AHC/VHC/H/U/V |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
8 |
CMOS |
1 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
31 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G20 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
1 V |
e4 |
6.5 mm |
LV/LV-A/LVX/H |
||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
8 |
5 |
IN-LINE |
250 ns |
2.54 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDIP-T20 |
6 V |
4.2 mm |
7.62 mm |
Not Qualified |
TRUE |
2 V |
e4 |
26.73 mm |
HC/UH |
|||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
5 |
SMALL OUTLINE |
11 ns |
1.27 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
TRUE |
4.5 V |
12.8 mm |
AHCT/VHCT/VT |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BALL |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
4 |
2.7 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
6 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBGA-B56 |
3.6 V |
1 mm |
4.5 mm |
Not Qualified |
TRUE |
1.2 V |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
LVC/LCX/Z |
||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2.7 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G5 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
TRUE |
1.65 V |
2 mm |
LVC/LCX/Z |
||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
5 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
24 ns |
.48 mm |
125 Cel |
3-STATE |
-40 Cel |
TIN |
DUAL |
2 |
S-PDSO-N5 |
1 |
3.6 V |
.35 mm |
.8 mm |
TRUE |
.8 V |
e3 |
.8 mm |
AUP/ULP/V |
|||||||||||||||||||||||
|
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
8 |
CMOS |
1 |
5 |
SMALL OUTLINE |
15 ns |
1.27 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G20 |
1 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
2 V |
e4 |
12.8 mm |
AHC |
||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
8 |
CMOS |
1 |
5 |
SMALL OUTLINE, SHRINK PITCH |
165 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G20 |
1 |
6 V |
2 mm |
5.3 mm |
Not Qualified |
TRUE |
2 V |
e4 |
7.2 mm |
HC/UH |
||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
3.3 |
SMALL OUTLINE |
43 ns |
1.27 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
TRUE |
1 V |
BROADSIDE VERSION OF 374 |
e4 |
12.8 mm |
LV/LV-A/LVX/H |
||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
AEC-Q100 |
4 |
5 |
SMALL OUTLINE |
10.5 ns |
1.27 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
TRUE |
4.5 V |
12.8 mm |
AHCT/VHCT/VT |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
6 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
150 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G16 |
6 V |
1.1 mm |
4.4 mm |
INVERTED |
2 V |
5 mm |
HC/UH |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
10 |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
.22 ns |
.635 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G24 |
3.6 V |
1.73 mm |
3.9 mm |
TRUE |
3 V |
8.7 mm |
CBTLV/3B |
|||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
AEC-Q100 |
1 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
9.5 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
R-PQCC-N14 |
5.5 V |
1 mm |
2.5 mm |
TRUE |
4.5 V |
3 mm |
AHCT/VHCT/VT |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
8 |
3.3 |
IN-LINE |
34 ns |
2.54 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDIP-T20 |
5.5 V |
4.2 mm |
7.62 mm |
TRUE |
1 V |
WITH DIRECTION CONTROL |
e4 |
26.73 mm |
LV/LV-A/LVX/H |
||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
20 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
18.4 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B20 |
3.6 V |
.5 mm |
2.5 mm |
TRUE |
1.65 V |
4.5 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
BALL |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
8 |
3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
6 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
TIN LEAD |
BOTTOM |
2 |
R-PBGA-B56 |
3.6 V |
1 mm |
4.5 mm |
TRUE |
1.2 V |
WITH DIRECTION CONTROL |
e0 |
7 mm |
LVC/LCX/Z |
||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
TR |
1.1 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC8,.11,20 |
24 ns |
1.7 Amp |
Bus Driver/Transceivers |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
ENABLE HIGH |
R-PDSO-N8 |
1 |
3.6 V |
.5 mm |
2 mm |
Not Qualified |
TRUE |
.8 V |
e4 |
30 |
260 |
3 mm |
AUP/ULP/V |
|||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
8 |
CMOS |
1 |
5 |
SMALL OUTLINE |
265 ns |
1.27 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G20 |
1 |
6 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
2 V |
e4 |
12.8 mm |
HC/UH |
||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
9.5 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
TIN |
DUAL |
2 |
R-PDSO-G5 |
5.5 V |
1.1 mm |
1.25 mm |
TRUE |
4.5 V |
e3 |
2.05 mm |
AHCT/VHCT/VT |
||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
3.3 |
50 pF |
SMALL OUTLINE |
18 ns |
1.27 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
1 V |
WITH DIRECTION CONTROL |
12.8 mm |
LV/LV-A/LVX/H |
||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
4 |
CMOS |
1 |
5 |
IN-LINE |
38 ns |
2.54 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDIP-T14 |
4.2 mm |
7.62 mm |
Not Qualified |
TRUE |
e4 |
19.025 mm |
HC/UH |
|||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
4 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
30 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
R-PQCC-N20 |
5.5 V |
1 mm |
2.5 mm |
INVERTED |
4.5 V |
4.5 mm |
HCT |
|||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
1.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
32 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
R-PQCC-N24 |
5.5 V |
1 mm |
3.5 mm |
TRUE |
1.2 V |
5.5 mm |
LVC/LCX/Z |
||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.1 |
SMALL OUTLINE, VERY THIN PROFILE |
17.9 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-N6 |
3.6 V |
.5 mm |
1 mm |
Not Qualified |
INVERTED |
.8 V |
1.45 mm |
AUP/ULP/V |
|||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
CMOS |
1 |
5 |
IN-LINE |
48 ns |
2.54 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
Not Qualified |
TRUE |
e4 |
26.73 mm |
HCT |
|||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
135 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
R-PQCC-N20 |
6 V |
1 mm |
2.5 mm |
TRUE |
2 V |
4.5 mm |
HC/UH |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
1.5 |
SMALL OUTLINE, VERY THIN PROFILE |
17.2 ns |
.35 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-N8 |
3.6 V |
.5 mm |
1 mm |
Not Qualified |
TRUE |
1.2 V |
ALSO OPERATESD AT 1.65 TO 5.5V SUPPLY |
1.35 mm |
NXB0102 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
4 |
2.7 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
6.5 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G48 |
3.6 V |
1.2 mm |
6.1 mm |
Not Qualified |
INVERTED |
1.2 V |
NOT SPECIFIED |
NOT SPECIFIED |
12.5 mm |
LVC/LCX/Z |
|||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
8 |
1.2 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
14.4 ns |
.4 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G48 |
3.6 V |
1.1 mm |
4.4 mm |
TRUE |
.8 V |
TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B |
e4 |
9.7 mm |
AVC |
||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
AEC-Q100 |
1 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
11.4 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
S-PDSO-G8 |
5.5 V |
1.1 mm |
3 mm |
TRUE |
1.65 V |
3 mm |
LVC/LCX/Z |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
2.7 |
SMALL OUTLINE, SHRINK PITCH |
9.5 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G20 |
3.6 V |
2 mm |
5.3 mm |
TRUE |
1.2 V |
BROADSIDE VERSION OF 373 |
e4 |
7.2 mm |
LVC/LCX/Z |
||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
4 |
2.7 |
SMALL OUTLINE, SHRINK PITCH |
6 ns |
.635 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G48 |
1 |
3.6 V |
2.8 mm |
7.5 mm |
Not Qualified |
TRUE |
1.2 V |
e4 |
15.875 mm |
LVC/LCX/Z |
||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
1.1 |
SMALL OUTLINE, VERY THIN PROFILE |
24 ns |
.35 mm |
125 Cel |
3-STATE |
-40 Cel |
TIN |
DUAL |
2 |
R-PDSO-N8 |
3.6 V |
.35 mm |
1 mm |
TRUE |
.8 V |
e3 |
1.35 mm |
AUP/ULP/V |
|||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR |
1.8 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
24 ns |
1.7 Amp |
Bus Driver/Transceivers |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
Tin (Sn) |
DUAL |
2 |
ENABLE HIGH |
R-PDSO-N6 |
1 |
3.6 V |
.5 mm |
1 mm |
Not Qualified |
TRUE |
.8 V |
e3 |
30 |
260 |
1.45 mm |
AUP/ULP/V |
|||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
SMALL OUTLINE |
50 ns |
1.27 mm |
125 Cel |
3-STATE |
-40 Cel |
DUAL |
2 |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
TRUE |
4.5 V |
12.8 mm |
HCT |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
8 |
1.2 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
14.4 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G48 |
3.6 V |
1.2 mm |
6.1 mm |
TRUE |
.8 V |
TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B |
e4 |
12.5 mm |
AVC |
||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
UNSPECIFIED |
UNSPECIFIED |
YES |
8 |
CMOS |
1 |
5 |
UNCASED CHIP |
150 ns |
125 Cel |
3-STATE |
-40 Cel |
UPPER |
2 |
X-XUUC-N |
6 V |
Not Qualified |
TRUE |
2 V |
HC/UH |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
8 |
CMOS |
1 |
5 |
SMALL OUTLINE, SHRINK PITCH |
150 ns |
.65 mm |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 |
R-PDSO-G20 |
1 |
6 V |
2 mm |
5.3 mm |
Not Qualified |
TRUE |
2 V |
e4 |
7.2 mm |
HC/UH |
||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
8 |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
265 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
QUAD |
2 |
R-PQCC-N20 |
6 V |
1 mm |
2.5 mm |
TRUE |
2 V |
4.5 mm |
HC/UH |
||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
NO LEAD |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
TR |
1.1 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC8,.04,14 |
24 ns |
1.7 Amp |
Bus Driver/Transceivers |
.35 mm |
125 Cel |
3-STATE |
-40 Cel |
TIN |
DUAL |
2 |
ENABLE LOW |
R-PDSO-N8 |
1 |
3.6 V |
.5 mm |
1 mm |
Not Qualified |
TRUE |
.8 V |
e3 |
30 |
260 |
1.35 mm |
AUP/ULP/V |
A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.
The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.
Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).
In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.
Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.