AUTOMOTIVE Bus Driver & Transceivers 2,400+

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
935274583125	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		1		3.3			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		12.3 ns			.5 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G8		5.5 V	1 mm	2 mm		TRUE	1.65 V		e4			2.3 mm	LVC/LCX/Z
935186990112	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	8	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		53 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20	1		1.1 mm	4.4 mm	Not Qualified	TRUE			e4			6.5 mm	HCT
935301504125	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	AEC-Q100	1		5			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		8.5 ns			.5 mm	125 Cel	3-STATE	-40 Cel		DUAL	2		R-PDSO-G8		5.5 V	1 mm	2 mm		TRUE	4.5 V					2.3 mm	AHCT/VHCT/VT
933670780652	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	8	CMOS		1		5			IN-LINE		33 ns			2.54 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDIP-T20			4.2 mm	7.62 mm	Not Qualified	TRUE			e4			26.73 mm	HC/UH
935174870118	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		8		3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		36 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20		3.6 V	1.1 mm	4.4 mm		TRUE	1 V		e4			6.5 mm	LV/LV-A/LVX/H
935289934115	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	20	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		4		2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9 ns			.5 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B20		3.6 V	.5 mm	2.5 mm		TRUE	1.2 V		e4			4.5 mm	LVC/LCX/Z
933967880112	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	8	CMOS		1		5			IN-LINE		48 ns			2.54 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDIP-T20			4.2 mm	7.62 mm	Not Qualified	INVERTED			e4			26.73 mm	HCT
935166910118	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	8	CMOS		1		5			SMALL OUTLINE, SHRINK PITCH		135 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20	1	6 V	2 mm	5.3 mm	Not Qualified	TRUE	2 V		e4			7.2 mm	HC/UH
935170160112	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	14	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS		1		3.3			SMALL OUTLINE, SHRINK PITCH		31 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G14		5.5 V	2 mm	5.3 mm		TRUE	1 V		e4			6.2 mm	LV/LV-A/LVX/H
935268721125	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.5 ns			.65 mm	125 Cel	3-STATE	-40 Cel	PURE TIN	DUAL	2		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm	Not Qualified	TRUE	1.65 V					2 mm	LVC/LCX/Z
935288136557	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		8		1.1			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		10.2 ns			.65 mm	125 Cel	3-STATE	-40 Cel	TIN LEAD	BOTTOM	2		R-PBGA-B56		3.6 V	1 mm	4.5 mm		TRUE	.8 V	TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B	e0			7 mm	AVC
935262538118	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		10		2.7			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		11 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G24		3.6 V	1.1 mm	4.4 mm		TRUE	1.2 V		e4			7.8 mm	LVC/LCX/Z
933713840653	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	8	CMOS		1		5			SMALL OUTLINE		220 ns			1.27 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20	1	6 V	2.65 mm	7.5 mm	Not Qualified	INVERTED	2 V		e4			12.8 mm	HC/UH
935218660112	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		8		2.7			SMALL OUTLINE		10 ns			1.27 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20		3.6 V	2.65 mm	7.5 mm		TRUE	1.2 V		e4			12.8 mm	LVC/LCX/Z
935274509125	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		1		2.3			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		11 ns			.5 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G8		5.5 V	1 mm	2 mm		TRUE	1.65 V	OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION	e4			2.3 mm	LVC/LCX/Z
NXS0102DP	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			2		1.8			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8.8 ns			.65 mm	125 Cel	OPEN-DRAIN	-40 Cel		DUAL	2		S-PDSO-G8		3.6 V	1.1 mm	3 mm	Not Qualified	TRUE	1.65 V	ALSO OPERATESD AT 2.3 TO 5.5V SUPPLY				3 mm	NXS0102
935188680118	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6	CMOS		1		5			SMALL OUTLINE, SHRINK PITCH		145 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G16	1	6 V	2 mm	5.3 mm	Not Qualified	TRUE	2 V		e4			6.2 mm	HC/UH
935289506118	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		14.5 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G14		5.5 V	1.1 mm	4.4 mm		TRUE	2 V		e4			5 mm	AHC/VHC/H/U/V
74AUP2G126DC	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	24 ns	1.7 Amp	Bus Driver/Transceivers	.5 mm	125 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2	ENABLE HIGH	R-PDSO-G8	1	3.6 V	1 mm	2 mm	Not Qualified	TRUE	.8 V		e4	30	260	2.3 mm	AUP/ULP/V
935210420112	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		4		2.7			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		9 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20		3.6 V	1.1 mm	4.4 mm		TRUE	1.2 V		e4			6.5 mm	LVC/LCX/Z
935165230112	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	8	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		33 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20	1		1.1 mm	4.4 mm	Not Qualified	TRUE			e4			6.5 mm	HCT
N74LV373PW-T	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		8		3.3		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		31 ns			.65 mm	125 Cel	3-STATE	-40 Cel		DUAL	2		R-PDSO-G20		5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	1 V					6.5 mm	LV/LV-A/LVX/H
935202340112	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		8		3.3			SMALL OUTLINE, SHRINK PITCH		9.5 ns			.635 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G48		5.5 V	2.8 mm	7.5 mm		TRUE	2.7 V	PORT A IS OPERATED AT VOLTAGE 1.5-3.6V	e4			15.875 mm	ALVC/VCX/A
74AUP1Z125GS	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		23.9 ns			.35 mm	125 Cel	3-STATE	-40 Cel	TIN	DUAL	2		S-PDSO-N6	1	3.6 V	.35 mm	1 mm	Not Qualified	TRUE	.8 V		e3			1 mm	AUP/ULP/V
935262006112	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	8	CMOS		1		5			SMALL OUTLINE		13.5 ns			1.27 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20	1	5.5 V	2.65 mm	7.5 mm	Not Qualified	TRUE	2 V		e4			12.8 mm	AHC
935303847125	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	AEC-Q100	1		3.3			SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		11.9 ns			.5 mm	125 Cel	3-STATE	-40 Cel		DUAL	2		R-PDSO-G8		5.5 V	1 mm	2 mm		INVERTED	1.65 V					2.3 mm	LVC/LCX/Z
935275622118	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	NO LEAD	24	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		10		2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		11 ns			.5 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2		R-PQCC-N24		3.6 V	1 mm	3.5 mm		TRUE	1.2 V		e4			5.5 mm	LVC/LCX/Z
935290549115	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		24 ns			.35 mm	125 Cel	3-STATE	-40 Cel	TIN	DUAL	2		R-PDSO-N8		3.6 V	.5 mm	1 mm		TRUE	.8 V		e3			1.35 mm	AUP/ULP/V
N74LV373D-T	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		8		3.3		50 pF	SMALL OUTLINE		31 ns			1.27 mm	125 Cel	3-STATE	-40 Cel		DUAL	2		R-PDSO-G20		5.5 V	2.65 mm	7.5 mm	Not Qualified	TRUE	1 V					12.8 mm	LV/LV-A/LVX/H
N74LV365N	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		6		3.3		50 pF	IN-LINE		26 ns			2.54 mm	125 Cel	3-STATE	-40 Cel		DUAL	2		R-PDIP-T16		5.5 V	4.2 mm	7.62 mm	Not Qualified	TRUE	1 V	WITH DUAL OUTPUT ENABLE				19.025 mm	LV/LV-A/LVX/H
935238730512	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		8		2.7			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		9.5 ns			.5 mm	125 Cel	3-STATE WITH SERIES RESISTOR	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G48		3.6 V	1.2 mm	6.1 mm		TRUE	1.2 V	WITH DIRECTION CONTROL	e4			12.5 mm	LVC/LCX/Z
935292225115	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		1		1.1			SMALL OUTLINE		24 ns			.3 mm	125 Cel	3-STATE	-40 Cel	TIN	DUAL	2		R-PDSO-N8		3.6 V	.35 mm	1 mm		TRUE	.8 V		e3			1.2 mm	AUP/ULP/V
935238450512	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS		4		2.7			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 ns			.5 mm	125 Cel	3-STATE	-40 Cel		DUAL	2		R-PDSO-G48		3.6 V	1.2 mm	6.1 mm	Not Qualified	TRUE	1.2 V			NOT SPECIFIED	NOT SPECIFIED	12.5 mm	LVC/LCX/Z
935174870112	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		8		3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		36 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20		3.6 V	1.1 mm	4.4 mm		TRUE	1 V		e4			6.5 mm	LV/LV-A/LVX/H
933670630652	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	8	CMOS		1		5			IN-LINE		265 ns			2.54 mm	125 Cel	3-STATE	-40 Cel		DUAL	2		R-PDIP-T20		6 V	4.2 mm	7.62 mm	Not Qualified	INVERTED	2 V					26.73 mm	HC/UH
935040550118	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		4		5			SMALL OUTLINE		150 ns			1.27 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20		6 V	2.65 mm	7.5 mm		INVERTED	2 V		e4			12.8 mm	HC/UH
933713670112	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS		1		5			SMALL OUTLINE		30 ns			1.27 mm	125 Cel	3-STATE	-40 Cel		DUAL	2		R-PDSO-G14		5.5 V	1.75 mm	3.9 mm	Not Qualified	INVERTED	4.5 V					8.65 mm	HCT
935288132112	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		2		1.2			SMALL OUTLINE		14.5 ns			1.27 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G16		3.6 V	1.75 mm	3.9 mm		TRUE	.8 V		e4			9.9 mm	AVC
935300002125	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		36 ns			.65 mm	125 Cel	3-STATE	-40 Cel		DUAL	2		R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		TRUE	4.5 V					2.05 mm	HCT
935290148118	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	NO LEAD	24	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1.5			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		32 ns			.5 mm	125 Cel	3-STATE	-40 Cel		QUAD	2		R-PQCC-N24		5.5 V	1 mm	3.5 mm		TRUE	1.2 V					5.5 mm	LVC/LCX/Z
935300723125	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		14.5 ns			.65 mm	125 Cel	3-STATE	-40 Cel	TIN	DUAL	2		R-PDSO-G5		5.5 V	1.1 mm	1.25 mm		TRUE	2 V		e3			2.05 mm	AHC/VHC/H/U/V
935219010112	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		8		2.7			SMALL OUTLINE, SHRINK PITCH		9.5 ns			.65 mm	125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2		R-PDSO-G20		3.6 V	2 mm	5.3 mm		TRUE	1.2 V	BROADSIDE VERSION OF 373	e4			7.2 mm	LVC/LCX/Z
74AUP2G241GM	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	2	CMOS		1	TR	1.1	1.2/3.3	30 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	24 ns	1.7 Amp	Bus Driver/Transceivers	.55 mm	125 Cel	3-STATE	-40 Cel		QUAD	2	ENABLE LOW/HIGH	S-PQCC-N8	1	3.6 V	.5 mm	1.6 mm	Not Qualified	TRUE	.8 V			30	260	1.6 mm	AUP/ULP/V
935279057132	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1.1			SMALL OUTLINE, VERY THIN PROFILE		24 ns			.5 mm	125 Cel	3-STATE	-40 Cel	TIN	DUAL	2		R-PDSO-N6		3.6 V	.5 mm	1 mm		TRUE	.8 V		e3			1.45 mm	AUP/ULP/V
935280514115	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1.4			SMALL OUTLINE, VERY THIN PROFILE		40.5 ns			.5 mm	125 Cel	3-STATE	-40 Cel	TIN	DUAL	2		R-PDSO-N6		3.6 V	.5 mm	1 mm		TRUE	1.1 V	WITH DIRECTION CONTROL	e3			1.45 mm	AUP/ULP/V
935285527115	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		5			SMALL OUTLINE, VERY THIN PROFILE		14.5 ns			.5 mm	125 Cel	3-STATE	-40 Cel	TIN	DUAL	2		R-PDSO-N6		5.5 V	.5 mm	1 mm		TRUE	2 V		e3			1.45 mm	AHC/VHC/H/U/V
74AUP1Z04GM,132	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1.2			SMALL OUTLINE, VERY THIN PROFILE		20.1 ns			.5 mm	125 Cel		-40 Cel	TIN	DUAL	2		R-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	TRUE	.8 V		e3	30	260	1.45 mm	AUP/ULP/V
935271661125	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		14.5 ns			.95 mm	125 Cel	3-STATE	-40 Cel	TIN	DUAL	2		R-PDSO-G5		5.5 V	1.1 mm	1.5 mm		TRUE	2 V		e3			2.9 mm	AHC/VHC/H/U/V

Bus Driver & Transceivers

A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.

The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.

Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).

In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.

Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.